JP4882732B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP4882732B2
JP4882732B2 JP2006346565A JP2006346565A JP4882732B2 JP 4882732 B2 JP4882732 B2 JP 4882732B2 JP 2006346565 A JP2006346565 A JP 2006346565A JP 2006346565 A JP2006346565 A JP 2006346565A JP 4882732 B2 JP4882732 B2 JP 4882732B2
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JP
Japan
Prior art keywords
detection unit
humidity
flow rate
semiconductor substrate
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006346565A
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English (en)
Japanese (ja)
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JP2008157742A5 (https=
JP2008157742A (ja
Inventor
輝夫 小田
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Denso Corp
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Denso Corp
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Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP2006346565A priority Critical patent/JP4882732B2/ja
Priority to DE102007055779A priority patent/DE102007055779B4/de
Priority to US12/000,462 priority patent/US7640798B2/en
Publication of JP2008157742A publication Critical patent/JP2008157742A/ja
Publication of JP2008157742A5 publication Critical patent/JP2008157742A5/ja
Application granted granted Critical
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Expired - Fee Related legal-status Critical Current
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/56—Investigating or analyzing materials by the use of thermal means by investigating moisture content
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/6845—Micromachined devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/688—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element
    • G01F1/69—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element of resistive type
    • G01F1/692—Thin-film arrangements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F25/00—Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume
    • G01F25/10—Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume of flowmeters
    • G01F25/15—Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume of flowmeters specially adapted for gas meters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • General Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Measuring Volume Flow (AREA)
JP2006346565A 2006-12-22 2006-12-22 半導体装置 Expired - Fee Related JP4882732B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2006346565A JP4882732B2 (ja) 2006-12-22 2006-12-22 半導体装置
DE102007055779A DE102007055779B4 (de) 2006-12-22 2007-12-12 Halbleitervorrichtung zum Erfassen einer Flussrate von Fluid
US12/000,462 US7640798B2 (en) 2006-12-22 2007-12-13 Semiconductor device for detecting flow rate of fluid

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006346565A JP4882732B2 (ja) 2006-12-22 2006-12-22 半導体装置

Publications (3)

Publication Number Publication Date
JP2008157742A JP2008157742A (ja) 2008-07-10
JP2008157742A5 JP2008157742A5 (https=) 2009-03-19
JP4882732B2 true JP4882732B2 (ja) 2012-02-22

Family

ID=39431985

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006346565A Expired - Fee Related JP4882732B2 (ja) 2006-12-22 2006-12-22 半導体装置

Country Status (3)

Country Link
US (1) US7640798B2 (https=)
JP (1) JP4882732B2 (https=)
DE (1) DE102007055779B4 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011099757A (ja) * 2009-11-06 2011-05-19 Hitachi Automotive Systems Ltd 熱式流体流量センサおよびその製造方法
JP2014185865A (ja) * 2013-03-21 2014-10-02 Hitachi Automotive Systems Ltd 熱式流量計
JP2015225029A (ja) * 2014-05-29 2015-12-14 株式会社デンソー 物理量センサ
DE112017001418T5 (de) 2016-06-15 2018-11-29 Hitachi Automotive Systems, Ltd. Halbleitervorrichtung, Verfahren zur Herstellung der Halbleitervorrichtung und Strömungssensor

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JP4674529B2 (ja) * 2005-11-07 2011-04-20 株式会社デンソー 湿度センサ装置及びその製造方法
JP5178388B2 (ja) * 2008-08-11 2013-04-10 日立オートモティブシステムズ株式会社 空気流量測定装置
DE102008056198B4 (de) * 2008-11-06 2015-02-19 Continental Automotive Gmbh Massenstromsensor und Kraftfahrzeug mit dem Massenstromsensor
JP5279667B2 (ja) * 2008-11-28 2013-09-04 日立オートモティブシステムズ株式会社 熱式空気流量センサ
JP5175974B2 (ja) * 2009-03-31 2013-04-03 アルプス電気株式会社 容量型湿度センサ及びその製造方法
DE102009028848A1 (de) * 2009-08-24 2011-03-03 Endress + Hauser Flowtec Ag Aufbau und Herstellungsverfahrens eines Sensors eines thermischen Durchflussmessgeräts
JP4929333B2 (ja) * 2009-09-30 2012-05-09 日立オートモティブシステムズ株式会社 センサの構造
JP5318737B2 (ja) * 2009-12-04 2013-10-16 株式会社デンソー センサ装置およびその製造方法
JP5208099B2 (ja) * 2009-12-11 2013-06-12 日立オートモティブシステムズ株式会社 流量センサとその製造方法、及び流量センサモジュール
WO2012049742A1 (ja) 2010-10-13 2012-04-19 日立オートモティブシステムズ株式会社 流量センサおよびその製造方法並びに流量センサモジュールおよびその製造方法
DE102010043062A1 (de) * 2010-10-28 2012-05-03 Robert Bosch Gmbh Sensorvorrichtung zur Erfassung einer Strömungseigenschaft eines fluiden Mediums
DE102010043083A1 (de) * 2010-10-28 2012-05-03 Robert Bosch Gmbh Sensorvorrichtung zur Erfassung einer Strömungseigenschaft eines fluiden Mediums
JP5857032B2 (ja) * 2011-03-02 2016-02-10 日立オートモティブシステムズ株式会社 熱式流量計
JP5526065B2 (ja) 2011-03-25 2014-06-18 日立オートモティブシステムズ株式会社 熱式センサおよびその製造方法
JP5333529B2 (ja) * 2011-07-05 2013-11-06 株式会社デンソー モールドパッケージの製造方法
WO2013008273A1 (ja) * 2011-07-13 2013-01-17 日立オートモティブシステムズ株式会社 流量計
US9103705B2 (en) * 2012-02-27 2015-08-11 Freescale Semiconductor, Inc. Combined environmental parameter sensor
DE102012009421A1 (de) 2012-05-11 2013-11-14 E + E Elektronik Ges.M.B.H. Strömungssensor
JP5675716B2 (ja) 2012-06-29 2015-02-25 日立オートモティブシステムズ株式会社 熱式空気流量センサ
JP5916637B2 (ja) * 2013-01-11 2016-05-11 日立オートモティブシステムズ株式会社 流量センサおよびその製造方法
US9360357B2 (en) * 2013-03-19 2016-06-07 Wisenstech Ltd. Micromachined mass flow sensor with condensation prevention and method of making the same
JP6021761B2 (ja) * 2013-08-27 2016-11-09 日立オートモティブシステムズ株式会社 ガスセンサ装置
JP6035582B2 (ja) * 2013-10-30 2016-11-30 株式会社デンソー 空気流量測定装置及びその製造方法
WO2015064213A1 (ja) 2013-10-31 2015-05-07 日立オートモティブシステムズ株式会社 空気流量測定装置
JP6274021B2 (ja) 2014-06-10 2018-02-07 株式会社デンソー 湿度測定装置
JP6212000B2 (ja) * 2014-07-02 2017-10-11 株式会社東芝 圧力センサ、並びに圧力センサを用いたマイクロフォン、血圧センサ、及びタッチパネル
EP3176543B1 (en) * 2014-07-30 2020-11-18 Hitachi Automotive Systems, Ltd. Circuit board mounting structure and sensor using same
US10900921B2 (en) * 2015-01-20 2021-01-26 Masco Corporation Multi-functional water quality sensor
JP6641820B2 (ja) * 2015-09-16 2020-02-05 株式会社デンソー 流量測定装置
JP6932640B2 (ja) 2015-09-30 2021-09-08 日立Astemo株式会社 物理量検出装置
JP6747124B2 (ja) * 2016-07-14 2020-08-26 株式会社デンソー 流量センサ
JP6812688B2 (ja) * 2016-07-20 2021-01-13 株式会社デンソー 吸気流量測定装置
DE102017116408A1 (de) * 2017-07-20 2019-01-24 Endress + Hauser Wetzer Gmbh + Co. Kg Thermisches Durchflussmessgerät
US12163944B2 (en) * 2017-07-20 2024-12-10 The Regents Of The University Of Michigan Multi-functional water quality sensor
JP6416357B1 (ja) * 2017-10-05 2018-10-31 三菱電機株式会社 流量測定装置
EP3614109A1 (de) * 2018-08-22 2020-02-26 Technische Universität Graz Messvorrichtung und messsonde für ein strömendes fluid
CN112912699B (zh) * 2018-11-05 2024-03-19 日立安斯泰莫株式会社 芯片封装件的定位固定结构
EP3882615A4 (en) * 2018-11-12 2022-07-27 National Institute for Materials Science CONDENSATION SENSING ELEMENT
US11397047B2 (en) * 2019-04-10 2022-07-26 Minebea Mitsumi Inc. Moisture detector, moisture detection method, electronic device, and log output system

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JP2957769B2 (ja) * 1991-08-26 1999-10-06 株式会社日立製作所 熱式空気流量計及びエンジン制御装置
JP2784286B2 (ja) * 1991-12-09 1998-08-06 三菱電機株式会社 半導体センサー装置の製造方法
JP3329073B2 (ja) * 1993-06-04 2002-09-30 セイコーエプソン株式会社 半導体装置およびその製造方法
JPH102772A (ja) * 1996-06-14 1998-01-06 Hitachi Ltd 空気流量測定装置
JP3335860B2 (ja) * 1997-01-16 2002-10-21 株式会社日立製作所 熱式空気流量計用測定素子及び熱式空気流量計
JP3364115B2 (ja) * 1997-07-03 2003-01-08 三菱電機株式会社 感熱式流量検出素子
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011099757A (ja) * 2009-11-06 2011-05-19 Hitachi Automotive Systems Ltd 熱式流体流量センサおよびその製造方法
JP2014185865A (ja) * 2013-03-21 2014-10-02 Hitachi Automotive Systems Ltd 熱式流量計
JP2015225029A (ja) * 2014-05-29 2015-12-14 株式会社デンソー 物理量センサ
DE112017001418T5 (de) 2016-06-15 2018-11-29 Hitachi Automotive Systems, Ltd. Halbleitervorrichtung, Verfahren zur Herstellung der Halbleitervorrichtung und Strömungssensor

Also Published As

Publication number Publication date
DE102007055779A1 (de) 2008-06-26
US7640798B2 (en) 2010-01-05
US20080148842A1 (en) 2008-06-26
JP2008157742A (ja) 2008-07-10
DE102007055779B4 (de) 2013-08-14

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