JP4882548B2 - 半導体装置及びその製造方法 - Google Patents
半導体装置及びその製造方法 Download PDFInfo
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- JP4882548B2 JP4882548B2 JP2006182300A JP2006182300A JP4882548B2 JP 4882548 B2 JP4882548 B2 JP 4882548B2 JP 2006182300 A JP2006182300 A JP 2006182300A JP 2006182300 A JP2006182300 A JP 2006182300A JP 4882548 B2 JP4882548 B2 JP 4882548B2
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- metal oxide
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- oxide film
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- H01L21/76841—Barrier, adhesion or liner layers
Description
前記第2導電性酸化金属膜の上に、金属元素よりなる導電性向上膜を形成する工程と、前記導電性向上膜の上に、イリジウム以外の白金族元素であって、前記導電性向上膜を構成する前記金属元素とは異なる金属元素よりなる導電性カバー膜を形成する工程と、前記導電性カバー膜の上にハードマスクを形成する工程と、前記ハードマスクをエッチングマスクとして用いながら、該ハードマスクから露出する領域の前記導電性カバー膜、導電性向上膜、前記第1導電性酸化金属膜、前記第2導電性酸化金属膜、前記強誘電体膜、及び前記第1導電膜をエッチングして、前記第1導電性酸化金属膜と前記第2導電性酸化金属膜よりなる上部電極、前記強誘電体膜よりなるキャパシタ誘電体膜、及び前記第1導電膜よりなる下部電極を備えたキャパシタを形成する工程と、前記ハードマスクがエッチングされるエッチング条件を用い、該ハードマスクと、前記下部電極から露出する領域の前記結晶性導電膜とをエッチングする工程と、前記ハードマスクと前記結晶性導電膜とをエッチングする工程の後に、前記キャパシタの側面を、前記導電性カバー膜の材料を溶解するエッチング液に曝す工程と、前記側面を前記エッチング液に曝した後、前記キャパシタを覆う第2層間絶縁膜を形成する工程と、前記上部電極の上の前記導電性カバー膜と前記第2層間絶縁膜に、前記導電性向上膜に至る深さの第1ホールを形成する工程と、前記第1ホール内に、グルー膜とプラグ用導電膜とを順に形成してなる第1導電性プラグを形成する工程とを有し、前記第1導電性酸化金属膜を構成する第1の金属酸化物と前記第2導電性酸化金属膜を構成する第2の金属酸化物のそれぞれの化学量論的な組成をAO x1 、BO y1 (AとBは金属元素)、前記第1の金属酸化物と前記第2の金属酸化物の実際の組成をAO x2 、BO y2 とすると、関係y2/y1>x2/x1が成り立つ半導体装置の製造方法が提供される。
本発明の実施の形態に先立ち、本願発明者が行った調査について説明する。
図3〜図12は、本実施形態に係る半導体装置の製造途中の断面図である。
図14〜図19は、本発明の第2実施形態に係る半導体装置の製造途中の断面図である。なお、これらの図において第1実施形態で説明した要素には第1実施形態と同じ符号を付し、以下ではその説明を省略する。
図20は、本実施形態に係る半導体装置の断面図である。
図21〜図27は、本実施形態に係る半導体装置の製造途中の断面図である。なお、これらの図において、第1実施形態で説明した要素には第1実施形態と同じ符号を付し、以下ではその説明を省略する。
前記第1層間絶縁膜の上に形成された下部電極と、
前記下部電極の上に形成された強誘電体材料よりなるキャパシタ誘電体膜と、
前記キャパシタ誘電体膜の上に順に形成された第1導電性酸化金属膜及び第2導電性酸化金属膜を備え、前記キャパシタ誘電体膜及び前記下部電極と共にキャパシタを構成する上部電極と、
前記上部電極の上に形成され、イリジウム以外の白金族元素よりなる導電性カバー膜とを有し、
前記第1導電性酸化金属膜を構成する第1の金属酸化物と前記第2導電性酸化金属膜を構成する第2の金属酸化物のそれぞれの化学量論的な組成をAOx1、BOy1(AとBは金属元素)、前記第1の金属酸化物と前記第2の金属酸化物の実際の組成をAOx2、BOy2とすると、関係y2/y1>x2/x1が成り立つことを特徴とする半導体装置。
前記上部電極の上の前記導電性カバー膜と前記第2層間絶縁膜に、前記導電性向上膜に至る深さの第1ホールが形成され、
前記第1ホール内に、グルー膜とプラグ用導電膜とを順に形成してなる第1導電性プラグが形成されたことを特徴とする付記2に記載の半導体装置。
前記結晶性導電膜の上に前記下部電極が形成されたことを特徴とする付記1に記載の半導体装置。
前記不純物拡散領域の上の前記第1層間絶縁膜に第2ホールが形成され、
前記第2ホール内に前記不純物拡散領域と電気的に接続された第2導電性プラグが形成されて、
前記第2導電性プラグの上方に、該第2導電性プラグと電気的に接続されるように前記下部電極が形成されたことを特徴とする付記1に記載の半導体装置。
前記第1層間絶縁膜の上に結晶性導電膜を形成する工程と、
前記結晶性導電膜の上に第1導電膜を形成する工程と、
前記第1導電膜の上に強誘電体膜を形成する工程と、
前記強誘電体膜の上に第2導電膜を形成する工程と、
前記第2導電膜の上に、イリジウム以外の白金族元素よりなる導電性カバー膜を形成する工程と、
前記導電性カバー膜の上にハードマスクを形成する工程と、
前記ハードマスクをエッチングマスクとして用いながら、該ハードマスクから露出する領域の前記導電性カバー膜、前記第2導電膜、前記強誘電体膜、及び前記第1導電膜をエッチングして、前記第2導電膜よりなる上部電極、前記強誘電体膜よりなるキャパシタ誘電体膜、及び前記第1導電膜よりなる下部電極を備えたキャパシタを形成する工程と、
前記ハードマスクがエッチングされるエッチング条件を用い、該ハードマスクと、前記下部電極から露出する領域の前記結晶性導電膜とをエッチングする工程と、
を有することを特徴とする半導体装置の製造方法。
前記第1導電性酸化金属膜を構成する第1の金属酸化物と前記第2導電性酸化金属膜を構成する第2の金属酸化物のそれぞれの化学量論的な組成をAOx1、BOy1(AとBは金属元素)、前記第1の金属酸化物と前記第2の金属酸化物の実際の組成をAOx2、BOy2とすると、関係y2/y1>x2/x1が成り立つことを特徴とする付記11に記載の半導体装置の製造方法。
前記第2導電性酸化金属膜を形成する工程は、酸素と不活性ガスとをスパッタガスとし、且つ前記スパッタガスに占める酸素の流量比が、前記第1導電性酸化金属膜を形成する工程におけるよりも多い反応性スパッタ法により行われることを特徴とする付記14に記載の半導体装置の製造方法。
前記導電性向上膜の上に前記導電性カバー膜を形成することを特徴とする付記14に記載の半導体装置の製造方法。
前記上部電極の上の前記導電性カバー膜と前記第2層間絶縁膜に、前記導電性向上膜に至る深さのホールを形成する工程と、
前記ホール内に、グルー膜とプラグ用導電膜とを順に形成してなる導電性プラグを形成する工程とを更に有することを特徴とする付記17に記載の半導体装置の製造方法。
Claims (6)
- 半導体基板の上方に形成された第1層間絶縁膜と、
前記第1層間絶縁膜の上に形成された結晶性導電膜と、
前記結晶性導電膜の上に形成された下部電極と、
前記下部電極の上に形成された強誘電体材料よりなるキャパシタ誘電体膜と、
前記キャパシタ誘電体膜の上に順に形成された第1導電性酸化金属膜及び第2導電性酸化金属膜を備え、前記キャパシタ誘電体膜及び前記下部電極と共にキャパシタを構成する上部電極と、
前記第2導電性酸化金属膜の上に形成され、金属元素よりなる導電性向上膜と、
前記導電性向上膜の上に形成され、イリジウム以外の白金族元素であって前記導電性向上膜を構成する前記金属元素とは異なる金属元素よりなる導電性カバー膜と、
前記キャパシタを覆う第2層間絶縁膜とを有し、
前記第1導電性酸化金属膜を構成する第1の金属酸化物と前記第2導電性酸化金属膜を構成する第2の金属酸化物のそれぞれの化学量論的な組成をAOx1、BOy1(AとBは金属元素)、前記第1の金属酸化物と前記第2の金属酸化物の実際の組成をAOx2、BOy2とすると、関係y2/y1>x2/x1が成り立ち、
前記上部電極の上の前記導電性カバー膜と前記第2層間絶縁膜に、前記導電性向上膜に至る深さの第1ホールが形成され、
前記第1ホール内に、グルー膜とプラグ用導電膜とを順に形成してなる第1導電性プラグが形成されたことを特徴とする半導体装置。 - 半導体基板の上方に第1層間絶縁膜を形成する工程と、
前記第1層間絶縁膜の上に結晶性導電膜を形成する工程と、
前記結晶性導電膜の上に第1導電膜を形成する工程と、
前記第1導電膜の上に強誘電体膜を形成する工程と、
前記強誘電体膜の上に第1導電性酸化金属膜を形成する工程と、
前記第1導電性酸化金属膜の上に第2導電性酸化金属膜を形成する工程と、
前記第2導電性酸化金属膜の上に、金属元素よりなる導電性向上膜を形成する工程と、
前記導電性向上膜の上に、イリジウム以外の白金族元素であって、前記導電性向上膜を構成する前記金属元素とは異なる金属元素よりなる導電性カバー膜を形成する工程と、
前記導電性カバー膜の上にハードマスクを形成する工程と、
前記ハードマスクをエッチングマスクとして用いながら、該ハードマスクから露出する領域の前記導電性カバー膜、導電性向上膜、前記第1導電性酸化金属膜、前記第2導電性酸化金属膜、前記強誘電体膜、及び前記第1導電膜をエッチングして、前記第1導電性酸化金属膜と前記第2導電性酸化金属膜よりなる上部電極、前記強誘電体膜よりなるキャパシタ誘電体膜、及び前記第1導電膜よりなる下部電極を備えたキャパシタを形成する工程と、
前記ハードマスクがエッチングされるエッチング条件を用い、該ハードマスクと、前記下部電極から露出する領域の前記結晶性導電膜とをエッチングする工程と、
前記ハードマスクと前記結晶性導電膜とをエッチングする工程の後に、前記キャパシタの側面を、前記導電性カバー膜の材料を溶解するエッチング液に曝す工程と、
前記側面を前記エッチング液に曝した後、前記キャパシタを覆う第2層間絶縁膜を形成する工程と、
前記上部電極の上の前記導電性カバー膜と前記第2層間絶縁膜に、前記導電性向上膜に至る深さの第1ホールを形成する工程と、
前記第1ホール内に、グルー膜とプラグ用導電膜とを順に形成してなる第1導電性プラグを形成する工程とを有し、
前記第1導電性酸化金属膜を構成する第1の金属酸化物と前記第2導電性酸化金属膜を構成する第2の金属酸化物のそれぞれの化学量論的な組成をAO x1 、BO y1 (AとBは金属元素)、前記第1の金属酸化物と前記第2の金属酸化物の実際の組成をAO x2 、BO y2 とすると、関係y2/y1>x2/x1が成り立つことを特徴とする半導体装置の製造方法。 - 前記第1導電性酸化金属膜を形成する工程は、酸素と不活性ガスとをスパッタガスとする反応性スパッタ法により行われ、
前記第2導電性酸化金属膜を形成する工程は、酸素と不活性ガスとをスパッタガスとし、且つ前記スパッタガスに占める酸素の流量比が、前記第1導電性酸化金属膜を形成する工程におけるよりも多い反応性スパッタ法により行われることを特徴とする請求項2に記載の半導体装置の製造方法。 - 前記第2導電性酸化金属膜を形成する工程の前に、酸化性ガス含有雰囲気中において前記第1導電性酸化金属膜をアニールする工程を更に有することを特徴とする請求項2に記載の半導体装置の製造方法。
- 前記第2導電性酸化金属膜の上面が露出している状態で、該第2導電性酸化金属膜をアニールする工程を更に有することを特徴とする請求項2に記載の半導体装置の製造方法。
- 前記第2導電性酸化金属膜を形成する工程において、前記第1導電性酸化金属膜よりも厚く前記第2導電性酸化金属膜を形成することを特徴とする請求項2に記載の半導体装置の製造方法。
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US9876018B2 (en) * | 2015-12-03 | 2018-01-23 | Micron Technology, Inc. | Ferroelectric capacitor, ferroelectric field effect transistor, and method used in forming an electronic component comprising conductive material and ferroelectric material |
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US20090298204A1 (en) | 2009-12-03 |
US7592657B2 (en) | 2009-09-22 |
US20120077288A1 (en) | 2012-03-29 |
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