JP4878801B2 - 基板処理装置、半導体装置の製造方法 - Google Patents

基板処理装置、半導体装置の製造方法 Download PDF

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JP4878801B2
JP4878801B2 JP2005278771A JP2005278771A JP4878801B2 JP 4878801 B2 JP4878801 B2 JP 4878801B2 JP 2005278771 A JP2005278771 A JP 2005278771A JP 2005278771 A JP2005278771 A JP 2005278771A JP 4878801 B2 JP4878801 B2 JP 4878801B2
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temperature
measured
zones
temperature sensor
thermocouple
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JP2007088394A5 (enExample
JP2007088394A (ja
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和夫 田中
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Kokusai Denki Electric Inc
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Hitachi Kokusai Electric Inc
Kokusai Denki Electric Inc
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JP2005278771A 2005-09-26 2005-09-26 基板処理装置、半導体装置の製造方法 Expired - Lifetime JP4878801B2 (ja)

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JP2005278771A JP4878801B2 (ja) 2005-09-26 2005-09-26 基板処理装置、半導体装置の製造方法

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JP2005278771A JP4878801B2 (ja) 2005-09-26 2005-09-26 基板処理装置、半導体装置の製造方法

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JP2007088394A JP2007088394A (ja) 2007-04-05
JP2007088394A5 JP2007088394A5 (enExample) 2008-10-30
JP4878801B2 true JP4878801B2 (ja) 2012-02-15

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Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5510991B2 (ja) * 2007-09-06 2014-06-04 株式会社日立国際電気 半導体製造装置及び基板処理方法
US8916793B2 (en) 2010-06-08 2014-12-23 Applied Materials, Inc. Temperature control in plasma processing apparatus using pulsed heat transfer fluid flow
US9338871B2 (en) 2010-01-29 2016-05-10 Applied Materials, Inc. Feedforward temperature control for plasma processing apparatus
US8880227B2 (en) 2010-05-27 2014-11-04 Applied Materials, Inc. Component temperature control by coolant flow control and heater duty cycle control
US10274270B2 (en) 2011-10-27 2019-04-30 Applied Materials, Inc. Dual zone common catch heat exchanger/chiller
JP5539449B2 (ja) * 2012-06-29 2014-07-02 東京エレクトロン株式会社 プログラム、熱処理装置及び熱処理装置の動作検出方法
JP7154116B2 (ja) * 2018-11-28 2022-10-17 東京エレクトロン株式会社 原料タンクの監視装置及び原料タンクの監視方法
JP6917495B1 (ja) 2020-03-04 2021-08-11 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、半導体装置の製造方法及びプログラム
KR102520584B1 (ko) * 2020-10-14 2023-04-10 세메스 주식회사 공정 계측 장치 및 방법

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09134886A (ja) * 1995-11-08 1997-05-20 Kokusai Electric Co Ltd 半導体製造装置のランピング温度制御方法
JPH1025577A (ja) * 1996-07-12 1998-01-27 Tokyo Electron Ltd 成膜処理装置
JP4358915B2 (ja) * 1997-03-21 2009-11-04 株式会社日立国際電気 半導体製造システム
KR20010071235A (ko) * 1998-05-11 2001-07-28 세미툴 인코포레이티드 열반응기용 온도 제어 시스템
JP4286514B2 (ja) * 2002-09-27 2009-07-01 株式会社日立国際電気 半導体製造装置及び温度制御方法、半導体製造方法
US7006900B2 (en) * 2002-11-14 2006-02-28 Asm International N.V. Hybrid cascade model-based predictive control system
JP2005123308A (ja) * 2003-10-15 2005-05-12 Hitachi Kokusai Electric Inc 基板処理装置

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