JP4876851B2 - 耐熱樹脂前駆体組成物およびそれを用いた半導体装置 - Google Patents
耐熱樹脂前駆体組成物およびそれを用いた半導体装置 Download PDFInfo
- Publication number
- JP4876851B2 JP4876851B2 JP2006287214A JP2006287214A JP4876851B2 JP 4876851 B2 JP4876851 B2 JP 4876851B2 JP 2006287214 A JP2006287214 A JP 2006287214A JP 2006287214 A JP2006287214 A JP 2006287214A JP 4876851 B2 JP4876851 B2 JP 4876851B2
- Authority
- JP
- Japan
- Prior art keywords
- group
- carbon atoms
- organic group
- heat
- resistant resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 0 *c(cc1)c(*)cc1C(Nc(cc(*c(cc1)cc(NC(c2cc(N)c(*)cc2)=O)c1O)cc1)c1O)=O Chemical compound *c(cc1)c(*)cc1C(Nc(cc(*c(cc1)cc(NC(c2cc(N)c(*)cc2)=O)c1O)cc1)c1O)=O 0.000 description 1
- BGTZYQSCNQIZER-UHFFFAOYSA-N CC(C)(c1ccc(C)c(C)c1)c1cc(C)c(C)cc1 Chemical compound CC(C)(c1ccc(C)c(C)c1)c1cc(C)c(C)cc1 BGTZYQSCNQIZER-UHFFFAOYSA-N 0.000 description 1
- MBZVPENZVICHRL-UHFFFAOYSA-N Cc(c(C)c1)cc2c1Oc1cc(C)c(C)cc1C2(C(F)(F)F)C(F)(F)F Chemical compound Cc(c(C)c1)cc2c1Oc1cc(C)c(C)cc1C2(C(F)(F)F)C(F)(F)F MBZVPENZVICHRL-UHFFFAOYSA-N 0.000 description 1
- ZSIACQWHDVUCHB-UHFFFAOYSA-N Cc(c(C)c1)ccc1S(c1cc(C)c(C)cc1)(=O)=O Chemical compound Cc(c(C)c1)ccc1S(c1cc(C)c(C)cc1)(=O)=O ZSIACQWHDVUCHB-UHFFFAOYSA-N 0.000 description 1
- WAXXKUASACLBQD-UHFFFAOYSA-N Cc(c(C)c1)ccc1[Si](C)(C)c1cc(C)c(C)cc1 Chemical compound Cc(c(C)c1)ccc1[Si](C)(C)c1cc(C)c(C)cc1 WAXXKUASACLBQD-UHFFFAOYSA-N 0.000 description 1
- GLFKFHJEFMLTOB-UHFFFAOYSA-N Cc1ccc(C(C(F)(F)F)(C(F)(F)F)c2cc(C)c(C)cc2)cc1C Chemical compound Cc1ccc(C(C(F)(F)F)(C(F)(F)F)c2cc(C)c(C)cc2)cc1C GLFKFHJEFMLTOB-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Formation Of Insulating Films (AREA)
- Materials For Photolithography (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006287214A JP4876851B2 (ja) | 2006-10-23 | 2006-10-23 | 耐熱樹脂前駆体組成物およびそれを用いた半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006287214A JP4876851B2 (ja) | 2006-10-23 | 2006-10-23 | 耐熱樹脂前駆体組成物およびそれを用いた半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008106083A JP2008106083A (ja) | 2008-05-08 |
| JP2008106083A5 JP2008106083A5 (https=) | 2009-10-08 |
| JP4876851B2 true JP4876851B2 (ja) | 2012-02-15 |
Family
ID=39439722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006287214A Expired - Fee Related JP4876851B2 (ja) | 2006-10-23 | 2006-10-23 | 耐熱樹脂前駆体組成物およびそれを用いた半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4876851B2 (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5562585B2 (ja) * | 2009-07-06 | 2014-07-30 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物 |
| EP3461856B1 (en) | 2015-10-13 | 2025-07-09 | Samsung Electronics Co., Ltd. | Composition for preparing poly(imide-amide)copolymer |
| WO2018087990A1 (ja) * | 2016-11-10 | 2018-05-17 | 東レ株式会社 | ジアミン化合物、それを用いた耐熱性樹脂および樹脂組成物 |
| GB201810710D0 (en) * | 2018-06-29 | 2018-08-15 | Smartkem Ltd | Sputter Protective Layer For Organic Electronic Devices |
| KR102637283B1 (ko) * | 2018-10-19 | 2024-02-16 | 후지필름 가부시키가이샤 | 경화막의 제조 방법, 수지 조성물, 경화막, 적층체의 제조 방법 및 반도체 디바이스의 제조 방법 |
| CN111116401B (zh) * | 2019-12-23 | 2024-07-09 | 盐城通海生物科技有限公司 | 一种c7侧链取代的含氟二胺单体的制备方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3478104B2 (ja) * | 1997-11-26 | 2003-12-15 | 東レ株式会社 | 感光性耐熱性樹脂前駆体組成物の製造方法 |
| JP2001133975A (ja) * | 1999-08-23 | 2001-05-18 | Toray Ind Inc | ポジ型感光性樹脂前駆体組成物 |
| JP3636059B2 (ja) * | 2000-10-19 | 2005-04-06 | 東レ株式会社 | ポジ型感光性樹脂前駆体組成物 |
| JP4337389B2 (ja) * | 2002-04-26 | 2009-09-30 | 東レ株式会社 | 耐熱性樹脂前駆体組成物の製造方法 |
-
2006
- 2006-10-23 JP JP2006287214A patent/JP4876851B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2008106083A (ja) | 2008-05-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6048257B2 (ja) | 耐熱性樹脂及びその前駆体組成物 | |
| US20090202794A1 (en) | Positive photosensitive resin composition | |
| JP5636456B2 (ja) | 感光性樹脂組成物 | |
| KR101900636B1 (ko) | 감광성 수지 조성물 | |
| WO2011080992A1 (ja) | ポジ型感光性樹脂組成物 | |
| JP2009230098A (ja) | 感光性樹脂組成物、パターン形成方法、並びに半導体装置及びその製造方法 | |
| JP2008216569A (ja) | 感光性樹脂組成物 | |
| KR101249605B1 (ko) | 감광성 수지 조성물, 경화 릴리프 패턴의 제조 방법 및 반도체 장치 | |
| JP2014071374A (ja) | 感光性樹脂組成物 | |
| JP5061435B2 (ja) | 耐熱樹脂前駆体組成物およびそれを用いた半導体装置 | |
| JP2018104599A (ja) | ポリイミド樹脂およびポジ型感光性樹脂組成物 | |
| JP5562585B2 (ja) | 感光性樹脂組成物 | |
| JP4337389B2 (ja) | 耐熱性樹脂前駆体組成物の製造方法 | |
| JP4935272B2 (ja) | ポジ型感光性樹脂組成物 | |
| JP4876851B2 (ja) | 耐熱樹脂前駆体組成物およびそれを用いた半導体装置 | |
| JP5115045B2 (ja) | ポリイミドワニス | |
| JP2001329061A (ja) | ヒドロキシポリアミド | |
| JP4798851B2 (ja) | アルコキシシラン化合物及びその組成物 | |
| JPH08272098A (ja) | 感光性樹脂組成物及びそれを用いるパターン化されたポリイミド皮膜の形成方法 | |
| JP4396143B2 (ja) | 耐熱性樹脂前駆体組成物 | |
| JPH07196917A (ja) | 感光性樹脂組成物及びそれを用いるパターン化されたポリイミド皮膜の形成方法 | |
| JP2000063519A (ja) | ポリイミド前駆体組成物およびその製造方法 | |
| JP2007328363A (ja) | 感光性耐熱性重合体組成物 | |
| JP2008081534A (ja) | 耐熱性樹脂前駆体組成物 | |
| JPH11160870A (ja) | 感光性ポリイミド前駆体樹脂組成物及びこれを用いた半導体装置の製造法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090825 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20090825 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20110927 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20111101 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20111114 |
|
| R151 | Written notification of patent or utility model registration |
Ref document number: 4876851 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20141209 Year of fee payment: 3 |
|
| LAPS | Cancellation because of no payment of annual fees |