JP4876851B2 - 耐熱樹脂前駆体組成物およびそれを用いた半導体装置 - Google Patents

耐熱樹脂前駆体組成物およびそれを用いた半導体装置 Download PDF

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Publication number
JP4876851B2
JP4876851B2 JP2006287214A JP2006287214A JP4876851B2 JP 4876851 B2 JP4876851 B2 JP 4876851B2 JP 2006287214 A JP2006287214 A JP 2006287214A JP 2006287214 A JP2006287214 A JP 2006287214A JP 4876851 B2 JP4876851 B2 JP 4876851B2
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group
carbon atoms
organic group
heat
resistant resin
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Japanese (ja)
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JP2008106083A (ja
JP2008106083A5 (enExample
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智之 弓場
真佐夫 富川
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Toray Industries Inc
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Toray Industries Inc
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  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Formation Of Insulating Films (AREA)
  • Materials For Photolithography (AREA)
JP2006287214A 2006-10-23 2006-10-23 耐熱樹脂前駆体組成物およびそれを用いた半導体装置 Expired - Fee Related JP4876851B2 (ja)

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JP2006287214A JP4876851B2 (ja) 2006-10-23 2006-10-23 耐熱樹脂前駆体組成物およびそれを用いた半導体装置

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JP2006287214A JP4876851B2 (ja) 2006-10-23 2006-10-23 耐熱樹脂前駆体組成物およびそれを用いた半導体装置

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JP2008106083A JP2008106083A (ja) 2008-05-08
JP2008106083A5 JP2008106083A5 (enExample) 2009-10-08
JP4876851B2 true JP4876851B2 (ja) 2012-02-15

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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5562585B2 (ja) * 2009-07-06 2014-07-30 旭化成イーマテリアルズ株式会社 感光性樹脂組成物
EP3156436B1 (en) 2015-10-13 2018-12-12 Samsung Electronics Co., Ltd. Poly(imide-amide)copolymer, method for preparing poly(imide-amide)copolymer, article containing poly(imide-amide)copolymer, and electronic device including same
SG11201903455QA (en) * 2016-11-10 2019-05-30 Toray Industries Di-Amine Compound, And Heat Resistant Resin And Resin Composition Using The Same
GB201810710D0 (en) * 2018-06-29 2018-08-15 Smartkem Ltd Sputter Protective Layer For Organic Electronic Devices
JP7137631B2 (ja) * 2018-10-19 2022-09-14 富士フイルム株式会社 硬化膜の製造方法、樹脂組成物、硬化膜、積層体の製造方法および半導体デバイスの製造方法
CN111116401B (zh) * 2019-12-23 2024-07-09 盐城通海生物科技有限公司 一种c7侧链取代的含氟二胺单体的制备方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3478104B2 (ja) * 1997-11-26 2003-12-15 東レ株式会社 感光性耐熱性樹脂前駆体組成物の製造方法
JP2001133975A (ja) * 1999-08-23 2001-05-18 Toray Ind Inc ポジ型感光性樹脂前駆体組成物
JP3636059B2 (ja) * 2000-10-19 2005-04-06 東レ株式会社 ポジ型感光性樹脂前駆体組成物
JP4337389B2 (ja) * 2002-04-26 2009-09-30 東レ株式会社 耐熱性樹脂前駆体組成物の製造方法

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