JP2008106083A5 - - Google Patents
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- Publication number
- JP2008106083A5 JP2008106083A5 JP2006287214A JP2006287214A JP2008106083A5 JP 2008106083 A5 JP2008106083 A5 JP 2008106083A5 JP 2006287214 A JP2006287214 A JP 2006287214A JP 2006287214 A JP2006287214 A JP 2006287214A JP 2008106083 A5 JP2008106083 A5 JP 2008106083A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- carbon atoms
- organic group
- aromatic
- ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 125000004432 carbon atom Chemical group C* 0.000 claims 11
- 125000003118 aryl group Chemical group 0.000 claims 8
- 125000000962 organic group Chemical group 0.000 claims 8
- -1 diamine compound Chemical class 0.000 claims 3
- 239000002243 precursor Substances 0.000 claims 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 2
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims 2
- 125000000217 alkyl group Chemical group 0.000 claims 2
- 125000003709 fluoroalkyl group Chemical group 0.000 claims 2
- 229910052739 hydrogen Inorganic materials 0.000 claims 2
- 239000001257 hydrogen Substances 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 125000006158 tetracarboxylic acid group Chemical group 0.000 claims 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 150000005690 diesters Chemical class 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006287214A JP4876851B2 (ja) | 2006-10-23 | 2006-10-23 | 耐熱樹脂前駆体組成物およびそれを用いた半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006287214A JP4876851B2 (ja) | 2006-10-23 | 2006-10-23 | 耐熱樹脂前駆体組成物およびそれを用いた半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008106083A JP2008106083A (ja) | 2008-05-08 |
| JP2008106083A5 true JP2008106083A5 (enExample) | 2009-10-08 |
| JP4876851B2 JP4876851B2 (ja) | 2012-02-15 |
Family
ID=39439722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006287214A Expired - Fee Related JP4876851B2 (ja) | 2006-10-23 | 2006-10-23 | 耐熱樹脂前駆体組成物およびそれを用いた半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4876851B2 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5562585B2 (ja) * | 2009-07-06 | 2014-07-30 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物 |
| JP6881837B2 (ja) | 2015-10-13 | 2021-06-02 | 三星電子株式会社Samsung Electronics Co., Ltd. | ポリ（イミド−アミド）コポリマー、ポリ（イミド−アミド）コポリマーの製造方法、ポリ（イミド−アミド）コポリマーを含む成形品、前記成形品を含む電子素子 |
| WO2018087990A1 (ja) * | 2016-11-10 | 2018-05-17 | 東レ株式会社 | ジアミン化合物、それを用いた耐熱性樹脂および樹脂組成物 |
| GB201810710D0 (en) * | 2018-06-29 | 2018-08-15 | Smartkem Ltd | Sputter Protective Layer For Organic Electronic Devices |
| WO2020080216A1 (ja) * | 2018-10-19 | 2020-04-23 | 富士フイルム株式会社 | 硬化膜の製造方法、樹脂組成物、硬化膜、積層体の製造方法および半導体デバイスの製造方法 |
| CN111116401B (zh) * | 2019-12-23 | 2024-07-09 | 盐城通海生物科技有限公司 | 一种c7侧链取代的含氟二胺单体的制备方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3478104B2 (ja) * | 1997-11-26 | 2003-12-15 | 東レ株式会社 | 感光性耐熱性樹脂前駆体組成物の製造方法 |
| JP2001133975A (ja) * | 1999-08-23 | 2001-05-18 | Toray Ind Inc | ポジ型感光性樹脂前駆体組成物 |
| JP3636059B2 (ja) * | 2000-10-19 | 2005-04-06 | 東レ株式会社 | ポジ型感光性樹脂前駆体組成物 |
| JP4337389B2 (ja) * | 2002-04-26 | 2009-09-30 | 東レ株式会社 | 耐熱性樹脂前駆体組成物の製造方法 |
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2006
- 2006-10-23 JP JP2006287214A patent/JP4876851B2/ja not_active Expired - Fee Related