JP4854725B2 - 基板処理用クラスタ装置及びクラスタ装置の基板処理方法 - Google Patents
基板処理用クラスタ装置及びクラスタ装置の基板処理方法 Download PDFInfo
- Publication number
- JP4854725B2 JP4854725B2 JP2008305814A JP2008305814A JP4854725B2 JP 4854725 B2 JP4854725 B2 JP 4854725B2 JP 2008305814 A JP2008305814 A JP 2008305814A JP 2008305814 A JP2008305814 A JP 2008305814A JP 4854725 B2 JP4854725 B2 JP 4854725B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- load lock
- chamber
- lock chamber
- transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
従来技術によるクラスタ装置は、ロードロックチャンバ(60)と、搬送チャンバ(70)と、工程チャンバ(80)とを含んでなる。
60、100 ロードロックチャンバ
70、200 搬送チャンバ
80、300 工程チャンバ
90、400 搬送ロボット
91、410 アーム
l 長辺
s 短辺
500 回転ステージ
510 支持ピン
520 回転ブロック
Claims (7)
- 外部から基板を供給されて一時収容するロードロックチャンバと、
上記ロードロックチャンバと接する搬送チャンバと、
各々の一面が上記搬送チャンバと接する複数の工程チャンバと、
上記搬送チャンバ内に設けられ、上記基板を上記複数の工程チャンバ及びロードロックチャンバから取り出したり収容させる搬送ロボットと、
上記ロードロックチャンバ内に設けられ、上記基板を回転可能に支持する回転ステージと、を含み、
上記複数の工程チャンバは、各々長方形の平断面を有し、平断面で長辺に該当する一面が上記搬送チャンバと接することを特徴とする基板処理用クラスタ装置。 - 請求項1において、
上記搬送ロボットは、上記基板を支持する一対以上のアームを含むことを特徴とする基板処理用クラスタ装置。 - 請求項1において、
上記回転ステージは、
上記基板を支持して昇降駆動される複数の支持ピンと、
上記複数の支持ピンを支持して回転駆動される回転ブロックと、を含むことを特徴とする基板処理用クラスタ装置。 - 請求項1において、
上記基板は、長方形板材であって、
上記基板が外部から上記ロードロックチャンバに収容される時には短辺側から投入され、
上記回転ステージは上記基板を同一平面上で回転させて長辺側が上記搬送チャンバに向かうようにし、
上記基板が上記搬送チャンバから上記ロードロックチャンバに収容される時には長辺側から投入され、
上記回転ステージは上記基板を同一平面上で回転させて短辺側が外部に向かうようにすることを特徴とする基板処理用クラスタ装置。 - 基板を外部からロードロックチャンバに供給する基板供給段階と、
上記ロードロックチャンバ内で上記基板を回転させる第1の基板回転段階と、
上記回転された基板を上記ロードロックチャンバと接する搬送チャンバに取り出す第1の基板搬送段階と、
上記取り出された基板を上記搬送チャンバに接する複数の工程チャンバに選択的に供給する工程投入段階と、を含み、
上記基板は、長方形板材であって、
上記基板供給段階は、上記基板の短辺側から上記ロードロックチャンバに供給し、
上記第1の基板回転段階は、上記基板を同一平面上で回転させて上記基板の長辺側が上記搬送チャンバに向かうようにしたクラスタ装置の基板処理方法。 - 請求項5において、
上記工程チャンバから工程が完了した基板を上記搬送チャンバに取り出す工程完了段階と、
上記取り出された基板を上記ロードロックチャンバに供給する第2の基板搬送段階と、
上記ロードロックチャンバ内で上記基板を回転させる第2の基板回転段階と、
上記基板を上記ロードロックチャンバから外部に引き出す基板引出段階と、をさらに含むことを特徴とするクラスタ装置の基板処理方法。 - 請求項6において、
上記第2の基板搬送段階は、上記基板の長辺側から上記ロードロックチャンバに供給し、
上記第2の基板回転段階は、上記基板を同一平面上で回転させて上記基板の短辺側が外部に向かうようにし、
上記基板引出段階は、上記基板の短辺側から上記ロードロックチャンバで引き出すことを特徴とするクラスタ装置の基板処理方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2008-0035932 | 2008-04-18 | ||
KR1020080035932A KR100965413B1 (ko) | 2008-04-18 | 2008-04-18 | 기판 처리용 클러스터 장치 및 클러스터 장치의 기판 처리방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009260241A JP2009260241A (ja) | 2009-11-05 |
JP4854725B2 true JP4854725B2 (ja) | 2012-01-18 |
Family
ID=41201243
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008305814A Expired - Fee Related JP4854725B2 (ja) | 2008-04-18 | 2008-12-01 | 基板処理用クラスタ装置及びクラスタ装置の基板処理方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20090263230A1 (ja) |
JP (1) | JP4854725B2 (ja) |
KR (1) | KR100965413B1 (ja) |
CN (1) | CN101562124B (ja) |
TW (1) | TWI388026B (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100111650A1 (en) * | 2008-01-31 | 2010-05-06 | Applied Materials, Inc. | Automatic substrate loading station |
JP4766156B2 (ja) * | 2009-06-11 | 2011-09-07 | 日新イオン機器株式会社 | イオン注入装置 |
WO2012176060A1 (en) * | 2011-06-23 | 2012-12-27 | Dynamic Micro Systems | Semiconductor cleaner systems and methods |
CN105580124B (zh) | 2013-09-26 | 2018-05-18 | 应用材料公司 | 用于基板处理的混合平台式设备、系统以及方法 |
CN104630718A (zh) * | 2013-11-13 | 2015-05-20 | 中国科学院沈阳科学仪器股份有限公司 | 一种五腔体全自动电子束沉积系统 |
TWI677046B (zh) * | 2015-04-23 | 2019-11-11 | 美商應用材料股份有限公司 | 半導體處理系統中的外部基板材旋轉 |
JP6598242B2 (ja) * | 2015-08-19 | 2019-10-30 | 芝浦メカトロニクス株式会社 | 基板処理装置、および基板処理方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3030160B2 (ja) * | 1992-04-28 | 2000-04-10 | 東京エレクトロン株式会社 | 真空処理装置 |
US5518542A (en) * | 1993-11-05 | 1996-05-21 | Tokyo Electron Limited | Double-sided substrate cleaning apparatus |
JPH098094A (ja) * | 1995-06-21 | 1997-01-10 | Shibaura Eng Works Co Ltd | 真空処理装置 |
US6309163B1 (en) * | 1997-10-30 | 2001-10-30 | Applied Materials, Inc. | Wafer positioning device with storage capability |
JP2002164407A (ja) * | 2000-11-27 | 2002-06-07 | Japan Steel Works Ltd:The | レーザアニール処理装置及び方法 |
JP2004079614A (ja) * | 2002-08-12 | 2004-03-11 | Dainippon Printing Co Ltd | ワークの処理方法及びその処理装置 |
JP2004128022A (ja) * | 2002-09-30 | 2004-04-22 | Hitachi Kokusai Electric Inc | 基板処理装置 |
JP4619854B2 (ja) * | 2005-04-18 | 2011-01-26 | 東京エレクトロン株式会社 | ロードロック装置及び処理方法 |
US8057153B2 (en) * | 2006-09-05 | 2011-11-15 | Tokyo Electron Limited | Substrate transfer device, substrate processing apparatus and substrate transfer method |
-
2008
- 2008-04-18 KR KR1020080035932A patent/KR100965413B1/ko active IP Right Grant
- 2008-10-24 US US12/257,628 patent/US20090263230A1/en not_active Abandoned
- 2008-11-13 CN CN2008101718057A patent/CN101562124B/zh not_active Expired - Fee Related
- 2008-11-18 TW TW097144438A patent/TWI388026B/zh not_active IP Right Cessation
- 2008-12-01 JP JP2008305814A patent/JP4854725B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR100965413B1 (ko) | 2010-06-25 |
CN101562124A (zh) | 2009-10-21 |
TWI388026B (zh) | 2013-03-01 |
CN101562124B (zh) | 2011-01-26 |
US20090263230A1 (en) | 2009-10-22 |
JP2009260241A (ja) | 2009-11-05 |
KR20090110433A (ko) | 2009-10-22 |
TW200945470A (en) | 2009-11-01 |
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