JP4847440B2 - ウエハレベルでの光−電子テスト装置および方法 - Google Patents
ウエハレベルでの光−電子テスト装置および方法 Download PDFInfo
- Publication number
- JP4847440B2 JP4847440B2 JP2007502910A JP2007502910A JP4847440B2 JP 4847440 B2 JP4847440 B2 JP 4847440B2 JP 2007502910 A JP2007502910 A JP 2007502910A JP 2007502910 A JP2007502910 A JP 2007502910A JP 4847440 B2 JP4847440 B2 JP 4847440B2
- Authority
- JP
- Japan
- Prior art keywords
- optical
- wafer
- electronic
- opto
- level test
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/30—Optical coupling means for use between fibre and thin-film device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/34—Optical coupling means utilising prism or grating
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12083—Constructional arrangements
- G02B2006/12107—Grating
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Optical Integrated Circuits (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US55131604P | 2004-03-08 | 2004-03-08 | |
| US60/551,316 | 2004-03-08 | ||
| US11/075,430 US7109739B2 (en) | 2004-03-08 | 2005-03-08 | Wafer-level opto-electronic testing apparatus and method |
| PCT/US2005/007473 WO2005086786A2 (en) | 2004-03-08 | 2005-03-08 | Wafer-level opto-electronic testing apparatus and method |
| US11/075,430 | 2005-03-08 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007528129A JP2007528129A (ja) | 2007-10-04 |
| JP2007528129A5 JP2007528129A5 (https=) | 2008-04-03 |
| JP4847440B2 true JP4847440B2 (ja) | 2011-12-28 |
Family
ID=34915232
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007502910A Expired - Fee Related JP4847440B2 (ja) | 2004-03-08 | 2005-03-08 | ウエハレベルでの光−電子テスト装置および方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7109739B2 (https=) |
| JP (1) | JP4847440B2 (https=) |
| KR (1) | KR101141014B1 (https=) |
| CA (1) | CA2558483C (https=) |
| WO (1) | WO2005086786A2 (https=) |
Families Citing this family (68)
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| US7295783B2 (en) * | 2001-10-09 | 2007-11-13 | Infinera Corporation | Digital optical network architecture |
| US7184626B1 (en) * | 2003-04-07 | 2007-02-27 | Luxtera, Inc | Wafer-level testing of optical and optoelectronic chips |
| US7672558B2 (en) * | 2004-01-12 | 2010-03-02 | Honeywell International, Inc. | Silicon optical device |
| US7177489B2 (en) * | 2004-03-18 | 2007-02-13 | Honeywell International, Inc. | Silicon-insulator-silicon thin-film structures for optical modulators and methods of manufacture |
| US7217584B2 (en) * | 2004-03-18 | 2007-05-15 | Honeywell International Inc. | Bonded thin-film structures for optical modulators and methods of manufacture |
| US7149388B2 (en) * | 2004-03-18 | 2006-12-12 | Honeywell International, Inc. | Low loss contact structures for silicon based optical modulators and methods of manufacture |
| US20050214989A1 (en) * | 2004-03-29 | 2005-09-29 | Honeywell International Inc. | Silicon optoelectronic device |
| US7348786B2 (en) * | 2004-08-31 | 2008-03-25 | Georgia Tech Research Corporation | Probe module for testing chips with electrical and optical input/output interconnects, methods of use, and methods of fabrication |
| WO2006030723A1 (ja) * | 2004-09-13 | 2006-03-23 | Shin-Etsu Handotai Co., Ltd. | 半導体ウェーハの評価方法及び半導体ウェーハの評価装置 |
| US20060063679A1 (en) * | 2004-09-17 | 2006-03-23 | Honeywell International Inc. | Semiconductor-insulator-semiconductor structure for high speed applications |
| US7538564B2 (en) * | 2005-10-18 | 2009-05-26 | Gsi Group Corporation | Methods and apparatus for utilizing an optical reference |
| US20070101927A1 (en) * | 2005-11-10 | 2007-05-10 | Honeywell International Inc. | Silicon based optical waveguide structures and methods of manufacture |
| US7362443B2 (en) * | 2005-11-17 | 2008-04-22 | Honeywell International Inc. | Optical gyro with free space resonator and method for sensing inertial rotation rate |
| US7514285B2 (en) * | 2006-01-17 | 2009-04-07 | Honeywell International Inc. | Isolation scheme for reducing film stress in a MEMS device |
| US7442589B2 (en) * | 2006-01-17 | 2008-10-28 | Honeywell International Inc. | System and method for uniform multi-plane silicon oxide layer formation for optical applications |
| US7463360B2 (en) | 2006-04-18 | 2008-12-09 | Honeywell International Inc. | Optical resonator gyro with integrated external cavity beam generator |
| US7454102B2 (en) * | 2006-04-26 | 2008-11-18 | Honeywell International Inc. | Optical coupling structure |
| US20070274655A1 (en) * | 2006-04-26 | 2007-11-29 | Honeywell International Inc. | Low-loss optical device structure |
| US7535576B2 (en) | 2006-05-15 | 2009-05-19 | Honeywell International, Inc. | Integrated optical rotation sensor and method for sensing rotation rate |
| EP2009416A1 (en) * | 2007-06-29 | 2008-12-31 | Interuniversitair Microelektronica Centrum Vzw | Optical probe |
| KR101334901B1 (ko) * | 2007-07-27 | 2013-12-02 | 삼성전자주식회사 | 전기 신호 전달 모듈 및 방법 그리고 전기 신호 전달모듈을 갖는 전기적 검사 장치 및 신호 전달 방법 |
| KR20090053490A (ko) * | 2007-11-23 | 2009-05-27 | 삼성전자주식회사 | 광학 전송수단을 구비한 프루브 카드 및 메모리 테스터 |
| DE102008011240B4 (de) * | 2008-02-26 | 2016-11-17 | Airbus Ds Electronics And Border Security Gmbh | Vorrichtung zur Kontaktierung eines T/R-Moduls mit einer Testeinrichtung |
| KR101548176B1 (ko) * | 2009-02-02 | 2015-08-31 | 삼성전자주식회사 | 메모리 시스템, 메모리 테스트 시스템 및 이의 테스트 방법 |
| US8952717B2 (en) * | 2009-02-20 | 2015-02-10 | Qmc Co., Ltd. | LED chip testing device |
| US8248097B2 (en) * | 2009-04-02 | 2012-08-21 | International Business Machines Corporation | Method and apparatus for probing a wafer |
| JP5735755B2 (ja) * | 2010-05-17 | 2015-06-17 | 株式会社アドバンテスト | 試験装置及び試験方法 |
| US8654812B2 (en) * | 2011-01-25 | 2014-02-18 | Hewlett-Packard Development Company, L.P. | Q-switched grating vertical-cavity surface-emitting laser system and method for fabricating the same |
| US8625942B2 (en) * | 2011-03-30 | 2014-01-07 | Intel Corporation | Efficient silicon-on-insulator grating coupler |
| SG10201509875XA (en) | 2012-09-12 | 2016-01-28 | Heptagon Micro Optics Pte Ltd | Testing of optical devices |
| US9922887B2 (en) * | 2012-12-11 | 2018-03-20 | Acacia Communications, Inc. | Wafer-scale testing of photonic integrated circuits using horizontal spot-size converters |
| KR20140095387A (ko) * | 2013-01-24 | 2014-08-01 | 삼성전자주식회사 | 광 소자를 포함하는 웨이퍼의 테스트 시스템 및 웨이퍼 테스트 방법 |
| US9234854B2 (en) | 2013-03-15 | 2016-01-12 | International Business Machines Corporation | Single fiber noncritical-alignment wafer-scale optical testing |
| US9397241B2 (en) | 2013-12-10 | 2016-07-19 | University Of Ottawa | Metal-insulator-semiconductor devices based on surface plasmon polaritons |
| US9753220B2 (en) | 2014-09-02 | 2017-09-05 | Huawei Technologies Co., Ltd. | System and method for optical input/output arrays |
| US9383516B2 (en) * | 2014-09-02 | 2016-07-05 | Huawei Technologies Co., Ltd. | System and method for optical input/output arrays |
| CN104362108B (zh) * | 2014-09-23 | 2017-05-24 | 华进半导体封装先导技术研发中心有限公司 | 光电测试装置 |
| WO2016085473A1 (en) * | 2014-11-25 | 2016-06-02 | Hewlett Packard Enterprise Development Lp | Light redirecting test fixture |
| WO2016201289A1 (en) * | 2015-06-10 | 2016-12-15 | Translarity, Inc. | Shaping of contact structures for semiconductor test, and associated systems and methods |
| US10359567B2 (en) | 2015-09-21 | 2019-07-23 | Elenion Technologies, Llc | Test systems and methods for chips in wafer scale photonic systems |
| US10132999B2 (en) | 2016-06-30 | 2018-11-20 | International Business Machines Corporation | Sacrificial grating coupler for testing v-grooved integrated circuits |
| DE112018004026A5 (de) | 2017-08-07 | 2020-05-28 | Jenoptik Optical Systems Gmbh | Lagetoleranzunempfindliches kontaktierungsmodul zur kontaktierung optoelektronischer chips |
| JP6781120B2 (ja) * | 2017-08-18 | 2020-11-04 | 株式会社日本マイクロニクス | 検査装置 |
| CN108152864A (zh) * | 2017-12-14 | 2018-06-12 | 深圳市帝迈生物技术有限公司 | 样本试管类型的识别设备及样本试管类型的检测方法 |
| DE102018108283A1 (de) * | 2018-04-09 | 2019-10-10 | Carl Zeiss Smt Gmbh | Elektro-optische Leiterplatte zur Kontaktierung von photonischen integrierten Schaltungen |
| US10429582B1 (en) | 2018-05-02 | 2019-10-01 | Globalfoundries Inc. | Waveguide-to-waveguide couplers with multiple tapers |
| US10436982B1 (en) | 2018-07-18 | 2019-10-08 | Globalfoundries Inc. | Waveguide bends with field confinement |
| JP7107094B2 (ja) | 2018-08-23 | 2022-07-27 | 富士通オプティカルコンポーネンツ株式会社 | 光デバイスおよび光送受信モジュール |
| KR102594414B1 (ko) * | 2018-10-24 | 2023-10-30 | 삼성전자주식회사 | 프로브 장치 및 이를 포함하는 테스트 장치 |
| US12072445B2 (en) * | 2018-11-27 | 2024-08-27 | Wuhan Vanjee Optoelectronic Technology Co., Ltd. | Phased array LiDAR transmitting chip of multi-layer materials, manufacturing method thereof, and LiDAR device |
| TWI672480B (zh) | 2018-12-03 | 2019-09-21 | 財團法人工業技術研究院 | 光學量測裝置與方法 |
| JP7259431B2 (ja) * | 2019-03-15 | 2023-04-18 | 富士通オプティカルコンポーネンツ株式会社 | 光デバイス、これを用いた光モジュール、及び光デバイスの試験方法 |
| US11280959B2 (en) * | 2019-04-23 | 2022-03-22 | Ayar Labs, Inc. | Photonics systems to enable top-side wafer-level optical and electrical test |
| JP7245721B2 (ja) | 2019-05-31 | 2023-03-24 | 株式会社アドバンテスト | 試験装置、試験方法およびプログラム |
| US20220357532A1 (en) * | 2019-06-17 | 2022-11-10 | Nippon Telegraph And Telephone Corporation | Optical Circuit Wafer |
| WO2021078318A1 (de) * | 2019-10-25 | 2021-04-29 | Jenoptik Optical Systems Gmbh | Wafer-level-testverfahren für opto-elektronische chips |
| TWI733226B (zh) * | 2019-10-25 | 2021-07-11 | 台灣愛司帝科技股份有限公司 | 發光二極體晶圓以及發光二極體晶圓檢測裝置與方法 |
| US11243230B2 (en) * | 2019-12-30 | 2022-02-08 | Juniper Networks, Inc. | Compact opto-electric probe |
| US10955614B1 (en) * | 2020-01-14 | 2021-03-23 | Globalfoundries U.S. Inc. | Optical fiber coupler structure having manufacturing variation-sensitive transmission blocking region |
| JP7374937B2 (ja) | 2021-01-13 | 2023-11-07 | 株式会社アドバンテスト | 試験装置、試験方法およびプログラム |
| JP7386190B2 (ja) | 2021-01-21 | 2023-11-24 | 株式会社アドバンテスト | 試験装置、試験方法およびプログラム |
| CN112924143B (zh) * | 2021-01-29 | 2023-08-29 | 中国科学院微电子研究所 | 一种光子芯片晶圆级测试装置和方法 |
| JP7355773B2 (ja) | 2021-02-26 | 2023-10-03 | 株式会社アドバンテスト | 試験装置、試験方法およびプログラム |
| US12210057B2 (en) * | 2021-04-16 | 2025-01-28 | Jenoptik Optical Systems Gmbh | Wafer-level test method for optoelectronic chips |
| WO2023132785A1 (en) * | 2022-01-06 | 2023-07-13 | Compoundtek Pte. Ltd. | Apparatus for wafer level testing of semicondcutor device |
| WO2023243019A1 (ja) * | 2022-06-15 | 2023-12-21 | 日本電信電話株式会社 | 光半導体集積回路 |
| US12078674B2 (en) * | 2022-09-06 | 2024-09-03 | Ciena Corporation | Managing photonic integrated circuit optical coupling |
| WO2024074782A1 (fr) * | 2022-10-06 | 2024-04-11 | Aryballe | Systeme de test en serie de puces destinees a l'analyse d'un analyte et elaborees sur des plaques en silicium |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0387705A (ja) * | 1989-06-13 | 1991-04-12 | Ricoh Co Ltd | 高効率プリズム結合装置及びその作成方法 |
| GB2332775A (en) * | 1997-12-23 | 1999-06-30 | Lsi Logic Corp | Testing optical/electronic integrated circuits |
| JP2002098849A (ja) * | 2000-09-25 | 2002-04-05 | Nippon Telegr & Teleph Corp <Ntt> | 光プローブ |
| US20030040175A1 (en) * | 2001-05-17 | 2003-02-27 | Optronx, Inc. | Hybrid active and electronic circuit with evanescent coupling |
| US20030123793A1 (en) * | 2001-12-28 | 2003-07-03 | Kjetil Johannessen | Optical probe for wafer testing |
| WO2003067271A2 (en) * | 2002-02-01 | 2003-08-14 | Optonics, Inc. | Apparatus and method for dynamic diagnostic testing of integrated circuits |
| US6686993B1 (en) * | 2001-03-05 | 2004-02-03 | Analog Devices, Inc. | Probe card for testing optical micro electromechanical system devices at wafer level |
| US20040190826A1 (en) * | 2003-03-31 | 2004-09-30 | Margaret Ghiron | Permanent light coupling arrangement and method for use with thin silicon optical waveguides |
| US20040213518A1 (en) * | 2003-04-28 | 2004-10-28 | Margaret Ghiron | Arrangements for reducing wavelength sensitivity in prism-coupled SOI-based optical systems |
| US20050094939A1 (en) * | 2003-09-04 | 2005-05-05 | Margaret Ghiron | Interfacing multiple wavelength sources to thin optical waveguides utilizing evanescent coupling |
| JP2006522943A (ja) * | 2003-04-10 | 2006-10-05 | シオプティカル インコーポレーテッド | ビーム成形と、薄いシリコン導波管への外部ソースおよび光学系の嵌合に関連する損失を減らす実用的方法 |
| JP2006525677A (ja) * | 2003-04-21 | 2006-11-09 | シオプティカル インコーポレーテッド | シリコン・ベースの光デバイスの電子デバイスとのcmos互換集積化 |
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| US5841544A (en) * | 1996-12-13 | 1998-11-24 | Lucent Technologies, Inc. | Method for positioning optical subassembly for testing |
| US6337871B1 (en) * | 1999-07-15 | 2002-01-08 | University Of Maryland Baltimore County (Umbc) | Multiple edge-emitting laser components located on a single wafer and the on-wafer testing of the same |
| US6788847B2 (en) * | 2001-04-05 | 2004-09-07 | Luxtera, Inc. | Photonic input/output port |
| US6731122B2 (en) * | 2001-08-14 | 2004-05-04 | International Business Machines Corporation | Wafer test apparatus including optical elements and method of using the test apparatus |
| EP1432546A4 (en) * | 2001-08-31 | 2006-06-07 | Cascade Microtech Inc | OPTICAL TESTING APPARATUS |
| US6859587B2 (en) * | 2001-12-28 | 2005-02-22 | Intel Corporation | Method and apparatus for wafer level testing of integrated optical waveguide circuits |
| US6925238B2 (en) * | 2002-07-16 | 2005-08-02 | Enablence Holdings Llc | Method and apparatus for on-wafer testing of an individual optical chip |
-
2005
- 2005-03-08 WO PCT/US2005/007473 patent/WO2005086786A2/en not_active Ceased
- 2005-03-08 KR KR1020067019862A patent/KR101141014B1/ko not_active Expired - Fee Related
- 2005-03-08 US US11/075,430 patent/US7109739B2/en active Active
- 2005-03-08 CA CA2558483A patent/CA2558483C/en active Active
- 2005-03-08 JP JP2007502910A patent/JP4847440B2/ja not_active Expired - Fee Related
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0387705A (ja) * | 1989-06-13 | 1991-04-12 | Ricoh Co Ltd | 高効率プリズム結合装置及びその作成方法 |
| GB2332775A (en) * | 1997-12-23 | 1999-06-30 | Lsi Logic Corp | Testing optical/electronic integrated circuits |
| JP2002098849A (ja) * | 2000-09-25 | 2002-04-05 | Nippon Telegr & Teleph Corp <Ntt> | 光プローブ |
| US6686993B1 (en) * | 2001-03-05 | 2004-02-03 | Analog Devices, Inc. | Probe card for testing optical micro electromechanical system devices at wafer level |
| US20030040175A1 (en) * | 2001-05-17 | 2003-02-27 | Optronx, Inc. | Hybrid active and electronic circuit with evanescent coupling |
| US20030123793A1 (en) * | 2001-12-28 | 2003-07-03 | Kjetil Johannessen | Optical probe for wafer testing |
| WO2003067271A2 (en) * | 2002-02-01 | 2003-08-14 | Optonics, Inc. | Apparatus and method for dynamic diagnostic testing of integrated circuits |
| US20040190826A1 (en) * | 2003-03-31 | 2004-09-30 | Margaret Ghiron | Permanent light coupling arrangement and method for use with thin silicon optical waveguides |
| JP2006522943A (ja) * | 2003-04-10 | 2006-10-05 | シオプティカル インコーポレーテッド | ビーム成形と、薄いシリコン導波管への外部ソースおよび光学系の嵌合に関連する損失を減らす実用的方法 |
| JP2006525677A (ja) * | 2003-04-21 | 2006-11-09 | シオプティカル インコーポレーテッド | シリコン・ベースの光デバイスの電子デバイスとのcmos互換集積化 |
| US20040213518A1 (en) * | 2003-04-28 | 2004-10-28 | Margaret Ghiron | Arrangements for reducing wavelength sensitivity in prism-coupled SOI-based optical systems |
| JP2006526808A (ja) * | 2003-04-28 | 2006-11-24 | シオプティカル インコーポレーテッド | プリズム結合したsoiベースの光学系で波長感受性を下げるための構成 |
| US20050094939A1 (en) * | 2003-09-04 | 2005-05-05 | Margaret Ghiron | Interfacing multiple wavelength sources to thin optical waveguides utilizing evanescent coupling |
Also Published As
| Publication number | Publication date |
|---|---|
| CA2558483C (en) | 2015-01-06 |
| US20050194990A1 (en) | 2005-09-08 |
| CA2558483A1 (en) | 2005-09-22 |
| US7109739B2 (en) | 2006-09-19 |
| KR101141014B1 (ko) | 2012-05-02 |
| JP2007528129A (ja) | 2007-10-04 |
| KR20060130679A (ko) | 2006-12-19 |
| WO2005086786A3 (en) | 2006-06-22 |
| WO2005086786A2 (en) | 2005-09-22 |
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