JP4824164B2 - 熱硬化性樹脂組成物のための粘度調節剤 - Google Patents

熱硬化性樹脂組成物のための粘度調節剤 Download PDF

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Publication number
JP4824164B2
JP4824164B2 JP2000565023A JP2000565023A JP4824164B2 JP 4824164 B2 JP4824164 B2 JP 4824164B2 JP 2000565023 A JP2000565023 A JP 2000565023A JP 2000565023 A JP2000565023 A JP 2000565023A JP 4824164 B2 JP4824164 B2 JP 4824164B2
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resin composition
resin
epoxy
thermosetting resin
viscosity modifier
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JP2002527529A (ja
JP2002527529A5 (https=
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ギャン，ジョセフ
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ダウ グローバル テクノロジーズ エルエルシー
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/003—Polymeric products of isocyanates or isothiocyanates with epoxy compounds having no active hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
JP2000565023A 1998-08-14 1999-07-28 熱硬化性樹脂組成物のための粘度調節剤 Expired - Fee Related JP4824164B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB9817799A GB9817799D0 (en) 1998-08-14 1998-08-14 Viscosity modifier for thermosetting resin compositioning
GB9817799.1 1998-08-14
PCT/US1999/016984 WO2000009581A2 (en) 1998-08-14 1999-07-28 Viscosity modifier for thermosetting resin composition

Publications (3)

Publication Number Publication Date
JP2002527529A JP2002527529A (ja) 2002-08-27
JP2002527529A5 JP2002527529A5 (https=) 2006-09-14
JP4824164B2 true JP4824164B2 (ja) 2011-11-30

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JP2000565023A Expired - Fee Related JP4824164B2 (ja) 1998-08-14 1999-07-28 熱硬化性樹脂組成物のための粘度調節剤

Country Status (11)

Country Link
US (2) US6333064B1 (https=)
EP (1) EP1144478B1 (https=)
JP (1) JP4824164B2 (https=)
KR (1) KR100654591B1 (https=)
CN (1) CN1144830C (https=)
AU (1) AU5234499A (https=)
GB (1) GB9817799D0 (https=)
HK (1) HK1041894A1 (https=)
MY (1) MY122590A (https=)
TW (1) TWI237046B (https=)
WO (1) WO2000009581A2 (https=)

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US20070004871A1 (en) * 2005-06-30 2007-01-04 Qiwei Lu Curable composition and method
US7378455B2 (en) * 2005-06-30 2008-05-27 General Electric Company Molding composition and method, and molded article
US7429800B2 (en) * 2005-06-30 2008-09-30 Sabic Innovative Plastics Ip B.V. Molding composition and method, and molded article
US20070066698A1 (en) 2005-09-20 2007-03-22 Yang Wenliang P Dual cure compositions, methods of curing thereof and articles therefrom
US20070066710A1 (en) * 2005-09-21 2007-03-22 Peters Edward N Method for electrical insulation and insulated electrical conductor
US20080071035A1 (en) * 2006-09-15 2008-03-20 Delsman Erik R Curable poly(arylene ether) composition and method
US20080071036A1 (en) * 2006-09-15 2008-03-20 Delsman Erik R Cured poly(arylene ether) composition, method, and article
US7655278B2 (en) * 2007-01-30 2010-02-02 Sabic Innovative Plastics Ip B.V. Composite-forming method, composites formed thereby, and printed circuit boards incorporating them
CN101616949B (zh) * 2007-02-23 2014-01-01 松下电器产业株式会社 环氧树脂组合物、预浸渍体、层合板和印刷配线板
US7678673B2 (en) * 2007-08-01 2010-03-16 International Business Machines Corporation Strengthening of a structure by infiltration
US8337163B2 (en) 2007-12-05 2012-12-25 General Electric Company Fiber composite half-product with integrated elements, manufacturing method therefor and use thereof
US8079820B2 (en) 2008-12-18 2011-12-20 General Electric Company Blade module, a modular rotor blade and a method for assembling a modular rotor blade
US20120083564A1 (en) * 2009-06-22 2012-04-05 Dow Global Technologies Llc Hardener composition for epoxy resins
KR100985998B1 (ko) * 2009-09-29 2010-10-06 백대현 경량 팰릿
CN106751517A (zh) * 2009-11-06 2017-05-31 蓝立方知识产权有限责任公司 用于电层合体的存储稳定的环氧树脂组合物
US8871892B2 (en) * 2009-11-12 2014-10-28 Dow Global Technologies Llc Polyoxazolidone resins
US20120040106A1 (en) 2010-08-16 2012-02-16 Stefan Simmerer Apparatus for impregnating a fiber material with a resin and methods for forming a fiber-reinforced plastic part
MY162968A (en) * 2011-06-03 2017-07-31 Cytec Tech Corp Resin coated radius fillers and system and method of making the same
US20120138223A1 (en) 2011-09-29 2012-06-07 General Electric Company Uv-ir combination curing system and method of use for wind blade manufacture and repair
TWI496804B (zh) * 2011-12-06 2015-08-21 Taiwan Union Technology Corp 環氧樹脂組成物及由其製成的預浸材和印刷電路積層板
BR112014031472A2 (pt) * 2012-06-26 2017-06-27 Dow Global Technologies Llc compósito isolante para transmissão e distribuição de energia e processo de pultrusão para preparar o compósito isolante
CN103937163A (zh) * 2014-05-08 2014-07-23 新誉集团有限公司 一种粘度可控型快速手糊环氧树脂体系及其制备方法

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JPS6424825A (en) * 1987-07-20 1989-01-26 Mitsubishi Gas Chemical Co Epoxy resin composition
JPH04227924A (ja) * 1990-05-21 1992-08-18 Dow Chem Co:The 潜触媒、硬化抑制エポキシ樹脂組成物、およびそれから製造した積層品
JPH04506678A (ja) * 1989-06-06 1992-11-19 ザ　ダウ　ケミカル　カンパニー エポキシを末端とするポリオキサゾリドン、調製方法、及びそれから作られる電気用積層板
JPH0543657A (ja) * 1991-08-19 1993-02-23 Asahi Chiba Kk エポキシ樹脂組成物
JPH05222160A (ja) * 1991-08-15 1993-08-31 Asahi Chiba Kk エポキシ樹脂組成物

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JPS63301283A (ja) * 1987-05-04 1988-12-08 アメリカン・サイアナミド・カンパニ− 高い生強度を有する誘導硬化性接着剤
JPS6424825A (en) * 1987-07-20 1989-01-26 Mitsubishi Gas Chemical Co Epoxy resin composition
JPH04506678A (ja) * 1989-06-06 1992-11-19 ザ　ダウ　ケミカル　カンパニー エポキシを末端とするポリオキサゾリドン、調製方法、及びそれから作られる電気用積層板
JPH04227924A (ja) * 1990-05-21 1992-08-18 Dow Chem Co:The 潜触媒、硬化抑制エポキシ樹脂組成物、およびそれから製造した積層品
JPH05222160A (ja) * 1991-08-15 1993-08-31 Asahi Chiba Kk エポキシ樹脂組成物
JPH0543657A (ja) * 1991-08-19 1993-02-23 Asahi Chiba Kk エポキシ樹脂組成物

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Publication number Publication date
KR20010079646A (ko) 2001-08-22
JP2002527529A (ja) 2002-08-27
US20020076482A1 (en) 2002-06-20
MY122590A (en) 2006-04-29
HK1041894A1 (zh) 2002-07-26
AU5234499A (en) 2000-03-06
EP1144478B1 (en) 2016-12-21
GB9817799D0 (en) 1998-10-14
WO2000009581A2 (en) 2000-02-24
EP1144478A3 (en) 2002-03-13
CN1144830C (zh) 2004-04-07
EP1144478A2 (en) 2001-10-17
US6333064B1 (en) 2001-12-25
WO2000009581A3 (en) 2001-12-13
TWI237046B (en) 2005-08-01
KR100654591B1 (ko) 2006-12-07
CN1315974A (zh) 2001-10-03

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