HK1041894A1 - 用於熱固性樹脂組合物的黏性調節劑 - Google Patents

用於熱固性樹脂組合物的黏性調節劑 Download PDF

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Publication number
HK1041894A1
HK1041894A1 HK02101377.9A HK02101377A HK1041894A1 HK 1041894 A1 HK1041894 A1 HK 1041894A1 HK 02101377 A HK02101377 A HK 02101377A HK 1041894 A1 HK1041894 A1 HK 1041894A1
Authority
HK
Hong Kong
Prior art keywords
viscosity modifier
resin composition
thermosetting resin
optionally substituted
optionally
Prior art date
Application number
HK02101377.9A
Other languages
English (en)
Chinese (zh)
Inventor
Gan Joseph
Original Assignee
The Dow Chemical Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by The Dow Chemical Company filed Critical The Dow Chemical Company
Publication of HK1041894A1 publication Critical patent/HK1041894A1/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/003—Polymeric products of isocyanates or isothiocyanates with epoxy compounds having no active hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
HK02101377.9A 1998-08-14 1999-07-28 用於熱固性樹脂組合物的黏性調節劑 HK1041894A1 (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB9817799.1 1998-08-14
GB9817799A GB9817799D0 (en) 1998-08-14 1998-08-14 Viscosity modifier for thermosetting resin compositioning
PCT/US1999/016984 WO2000009581A2 (en) 1998-08-14 1999-07-28 Viscosity modifier for thermosetting resin composition

Publications (1)

Publication Number Publication Date
HK1041894A1 true HK1041894A1 (zh) 2002-07-26

Family

ID=10837313

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02101377.9A HK1041894A1 (zh) 1998-08-14 1999-07-28 用於熱固性樹脂組合物的黏性調節劑

Country Status (11)

Country Link
US (2) US6333064B1 (https=)
EP (1) EP1144478B1 (https=)
JP (1) JP4824164B2 (https=)
KR (1) KR100654591B1 (https=)
CN (1) CN1144830C (https=)
AU (1) AU5234499A (https=)
GB (1) GB9817799D0 (https=)
HK (1) HK1041894A1 (https=)
MY (1) MY122590A (https=)
TW (1) TWI237046B (https=)
WO (1) WO2000009581A2 (https=)

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US7678673B2 (en) * 2007-08-01 2010-03-16 International Business Machines Corporation Strengthening of a structure by infiltration
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US8079820B2 (en) * 2008-12-18 2011-12-20 General Electric Company Blade module, a modular rotor blade and a method for assembling a modular rotor blade
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US8980376B2 (en) 2009-11-06 2015-03-17 Dow Global Technologies Llc Storage stable epoxy resin compositions for electrical laminates
US8871892B2 (en) * 2009-11-12 2014-10-28 Dow Global Technologies Llc Polyoxazolidone resins
US20120040106A1 (en) 2010-08-16 2012-02-16 Stefan Simmerer Apparatus for impregnating a fiber material with a resin and methods for forming a fiber-reinforced plastic part
AU2012262983B2 (en) * 2011-06-03 2016-06-16 Cytec Technology Corp. Resin coated radius fillers and system and method of making the same
US20120138223A1 (en) 2011-09-29 2012-06-07 General Electric Company Uv-ir combination curing system and method of use for wind blade manufacture and repair
TWI496804B (zh) * 2011-12-06 2015-08-21 Taiwan Union Technology Corp 環氧樹脂組成物及由其製成的預浸材和印刷電路積層板
EP2864418B1 (en) * 2012-06-26 2017-08-16 Dow Global Technologies LLC Insulating composites for power transmission and distribution
CN103937163A (zh) * 2014-05-08 2014-07-23 新誉集团有限公司 一种粘度可控型快速手糊环氧树脂体系及其制备方法

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Also Published As

Publication number Publication date
CN1315974A (zh) 2001-10-03
JP4824164B2 (ja) 2011-11-30
AU5234499A (en) 2000-03-06
KR100654591B1 (ko) 2006-12-07
JP2002527529A (ja) 2002-08-27
WO2000009581A2 (en) 2000-02-24
MY122590A (en) 2006-04-29
US6333064B1 (en) 2001-12-25
GB9817799D0 (en) 1998-10-14
US20020076482A1 (en) 2002-06-20
TWI237046B (en) 2005-08-01
KR20010079646A (ko) 2001-08-22
CN1144830C (zh) 2004-04-07
EP1144478A2 (en) 2001-10-17
EP1144478B1 (en) 2016-12-21
EP1144478A3 (en) 2002-03-13
WO2000009581A3 (en) 2001-12-13

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