JP4820736B2 - 電解めっき装置及び電解めっき方法並びにめっき治具 - Google Patents

電解めっき装置及び電解めっき方法並びにめっき治具 Download PDF

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Publication number
JP4820736B2
JP4820736B2 JP2006309608A JP2006309608A JP4820736B2 JP 4820736 B2 JP4820736 B2 JP 4820736B2 JP 2006309608 A JP2006309608 A JP 2006309608A JP 2006309608 A JP2006309608 A JP 2006309608A JP 4820736 B2 JP4820736 B2 JP 4820736B2
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Japan
Prior art keywords
anode plate
cathode
plating
anode
electronic component
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JP2006309608A
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English (en)
Japanese (ja)
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JP2008121097A (ja
JP2008121097A5 (enExample
Inventor
陽子 中林
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2006309608A priority Critical patent/JP4820736B2/ja
Priority to TW096140697A priority patent/TW200825211A/zh
Priority to KR1020070112485A priority patent/KR20080044162A/ko
Priority to CN2007101872661A priority patent/CN101240443B/zh
Publication of JP2008121097A publication Critical patent/JP2008121097A/ja
Publication of JP2008121097A5 publication Critical patent/JP2008121097A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C25D17/22—Apparatus for electrolytic coating of small objects in bulk having open containers

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2006309608A 2006-11-15 2006-11-15 電解めっき装置及び電解めっき方法並びにめっき治具 Active JP4820736B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2006309608A JP4820736B2 (ja) 2006-11-15 2006-11-15 電解めっき装置及び電解めっき方法並びにめっき治具
TW096140697A TW200825211A (en) 2006-11-15 2007-10-30 Electroplating apparatus, electroplating method and plating jig
KR1020070112485A KR20080044162A (ko) 2006-11-15 2007-11-06 전해 도금 장치와 전해 도금 방법 및 도금 지그
CN2007101872661A CN101240443B (zh) 2006-11-15 2007-11-15 电镀装置、电镀方法以及电镀夹具

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006309608A JP4820736B2 (ja) 2006-11-15 2006-11-15 電解めっき装置及び電解めっき方法並びにめっき治具

Publications (3)

Publication Number Publication Date
JP2008121097A JP2008121097A (ja) 2008-05-29
JP2008121097A5 JP2008121097A5 (enExample) 2009-09-03
JP4820736B2 true JP4820736B2 (ja) 2011-11-24

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ID=39506168

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006309608A Active JP4820736B2 (ja) 2006-11-15 2006-11-15 電解めっき装置及び電解めっき方法並びにめっき治具

Country Status (4)

Country Link
JP (1) JP4820736B2 (enExample)
KR (1) KR20080044162A (enExample)
CN (1) CN101240443B (enExample)
TW (1) TW200825211A (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4164435B2 (ja) * 2003-11-05 2008-10-15 新光電気工業株式会社 電子部品用めっき治具及び電解めっき装置
TWI385605B (zh) * 2009-12-30 2013-02-11 Univ Ishou Applicable to the fuzzy control teaching of the card plating device
CN102337577B (zh) * 2010-07-22 2014-03-12 富葵精密组件(深圳)有限公司 电镀装置
CN102080253B (zh) * 2010-12-23 2012-07-25 北大方正集团有限公司 电镀夹具及印制线路板电镀系统
CN102776551B (zh) * 2012-07-04 2015-11-25 中国电子科技集团公司第四十一研究所 一种硬质微带电路电镀夹具
JP6193005B2 (ja) * 2013-06-14 2017-09-06 Ｋｙｂ株式会社 保持装置及びそれを備えた高速めっき装置
CN103436946A (zh) * 2013-08-01 2013-12-11 黄海 一种自动化电镀系统
CN104711656B (zh) * 2015-03-23 2017-06-06 河南理工大学 一种用于电镀平面薄片件的挂具
TW201720969A (zh) * 2015-12-14 2017-06-16 台灣先進系統股份有限公司 可調控式不溶性陽極板及其應用於銅柱電鍍之方法
JP6709727B2 (ja) * 2016-12-14 2020-06-17 株式会社荏原製作所 電解めっき装置
CN107904632B (zh) * 2017-04-24 2020-05-12 张碧海 一种电镀设备
CN107287626A (zh) * 2017-08-11 2017-10-24 杭州帝洛森科技有限公司 一种防短路的阳极板及应用其的电解装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6890413B2 (en) * 2002-12-11 2005-05-10 International Business Machines Corporation Method and apparatus for controlling local current to achieve uniform plating thickness
JP4164435B2 (ja) * 2003-11-05 2008-10-15 新光電気工業株式会社 電子部品用めっき治具及び電解めっき装置
JP4164443B2 (ja) * 2003-11-26 2008-10-15 新光電気工業株式会社 電子部品用めっき治具及び電解めっき装置
JP2006193806A (ja) * 2005-01-17 2006-07-27 Matsushita Electric Ind Co Ltd めっき電極、めっき治具およびそれを用いた電子部品のめっき方法

Also Published As

Publication number Publication date
JP2008121097A (ja) 2008-05-29
CN101240443B (zh) 2011-02-09
CN101240443A (zh) 2008-08-13
KR20080044162A (ko) 2008-05-20
TW200825211A (en) 2008-06-16

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