JP2008121097A5 - - Google Patents
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- Publication number
- JP2008121097A5 JP2008121097A5 JP2006309608A JP2006309608A JP2008121097A5 JP 2008121097 A5 JP2008121097 A5 JP 2008121097A5 JP 2006309608 A JP2006309608 A JP 2006309608A JP 2006309608 A JP2006309608 A JP 2006309608A JP 2008121097 A5 JP2008121097 A5 JP 2008121097A5
- Authority
- JP
- Japan
- Prior art keywords
- cathode portion
- anode
- insulating layer
- anode plate
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 description 2
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006309608A JP4820736B2 (ja) | 2006-11-15 | 2006-11-15 | 電解めっき装置及び電解めっき方法並びにめっき治具 |
| TW096140697A TW200825211A (en) | 2006-11-15 | 2007-10-30 | Electroplating apparatus, electroplating method and plating jig |
| KR1020070112485A KR20080044162A (ko) | 2006-11-15 | 2007-11-06 | 전해 도금 장치와 전해 도금 방법 및 도금 지그 |
| CN2007101872661A CN101240443B (zh) | 2006-11-15 | 2007-11-15 | 电镀装置、电镀方法以及电镀夹具 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006309608A JP4820736B2 (ja) | 2006-11-15 | 2006-11-15 | 電解めっき装置及び電解めっき方法並びにめっき治具 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008121097A JP2008121097A (ja) | 2008-05-29 |
| JP2008121097A5 true JP2008121097A5 (enExample) | 2009-09-03 |
| JP4820736B2 JP4820736B2 (ja) | 2011-11-24 |
Family
ID=39506168
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006309608A Active JP4820736B2 (ja) | 2006-11-15 | 2006-11-15 | 電解めっき装置及び電解めっき方法並びにめっき治具 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4820736B2 (enExample) |
| KR (1) | KR20080044162A (enExample) |
| CN (1) | CN101240443B (enExample) |
| TW (1) | TW200825211A (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4164435B2 (ja) * | 2003-11-05 | 2008-10-15 | 新光電気工業株式会社 | 電子部品用めっき治具及び電解めっき装置 |
| TWI385605B (zh) * | 2009-12-30 | 2013-02-11 | Univ Ishou | Applicable to the fuzzy control teaching of the card plating device |
| CN102337577B (zh) * | 2010-07-22 | 2014-03-12 | 富葵精密组件(深圳)有限公司 | 电镀装置 |
| CN102080253B (zh) * | 2010-12-23 | 2012-07-25 | 北大方正集团有限公司 | 电镀夹具及印制线路板电镀系统 |
| CN102776551B (zh) * | 2012-07-04 | 2015-11-25 | 中国电子科技集团公司第四十一研究所 | 一种硬质微带电路电镀夹具 |
| JP6193005B2 (ja) * | 2013-06-14 | 2017-09-06 | Kyb株式会社 | 保持装置及びそれを備えた高速めっき装置 |
| CN103436946A (zh) * | 2013-08-01 | 2013-12-11 | 黄海 | 一种自动化电镀系统 |
| CN104711656B (zh) * | 2015-03-23 | 2017-06-06 | 河南理工大学 | 一种用于电镀平面薄片件的挂具 |
| TW201720969A (zh) * | 2015-12-14 | 2017-06-16 | 台灣先進系統股份有限公司 | 可調控式不溶性陽極板及其應用於銅柱電鍍之方法 |
| JP6709727B2 (ja) * | 2016-12-14 | 2020-06-17 | 株式会社荏原製作所 | 電解めっき装置 |
| CN107904632B (zh) * | 2017-04-24 | 2020-05-12 | 张碧海 | 一种电镀设备 |
| CN107287626A (zh) * | 2017-08-11 | 2017-10-24 | 杭州帝洛森科技有限公司 | 一种防短路的阳极板及应用其的电解装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6890413B2 (en) * | 2002-12-11 | 2005-05-10 | International Business Machines Corporation | Method and apparatus for controlling local current to achieve uniform plating thickness |
| JP4164435B2 (ja) * | 2003-11-05 | 2008-10-15 | 新光電気工業株式会社 | 電子部品用めっき治具及び電解めっき装置 |
| JP4164443B2 (ja) * | 2003-11-26 | 2008-10-15 | 新光電気工業株式会社 | 電子部品用めっき治具及び電解めっき装置 |
| JP2006193806A (ja) * | 2005-01-17 | 2006-07-27 | Matsushita Electric Ind Co Ltd | めっき電極、めっき治具およびそれを用いた電子部品のめっき方法 |
-
2006
- 2006-11-15 JP JP2006309608A patent/JP4820736B2/ja active Active
-
2007
- 2007-10-30 TW TW096140697A patent/TW200825211A/zh unknown
- 2007-11-06 KR KR1020070112485A patent/KR20080044162A/ko not_active Withdrawn
- 2007-11-15 CN CN2007101872661A patent/CN101240443B/zh active Active
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