200825211 九、發明說明： 【發明所屬之技術領域】 本發明為有關於電解電鍍裝置和電解電錢方法既 讀夾具’詳細地說，亦即有關於對從帽蓋部之一 多根之引線延伸而出之電子零」有 鍍裝置及電解電鍍方法暨電解電㈣具$鍍之電解電 【先前技術】 帽蓋部之—面側有多根之引線延伸而出 电子善件（以下簡稱為電子零件）施 : 術是採用滾筒電鍍（barre i p丄at f电鍍守先别技 -, + PiaUnW方法，在此種滾筒電 Γ有陽&納有多個之電子零件之籠狀之滾筒，在浸 極之電解電㈣中旋轉，同時對被設在滾筒内之阶 電鍍和%極之間施加電流，用來對各個電子零件施加電解 兩在此種滾筒電鑛方法中，存在之問題是由於電子 ::此間之接觸，容易發生刮傷或引線之彎曲，或是電 子苓件彼此間之糾結。 屯 為解決此種問題’在下面所述之專利文獻^提 所不之電解電鍍裝置。 口 4 4所示之電解電㈣置中，將排列和保持有多個之 1〇2、1〇2…之電鑛夹具100 ’浸潰到被館存於電 =104之電解電鍍液中，以電子零件繼、默面對陽 古f之方式，垂直地浸潰，利用上下滑動機構1〇6在上下 方向振動，同時對陽極板和被設在電鍍夾具1〇〇内之陰極 1明書(補件)/96· 12/%140697 6 200825211 ::間施加電流’用來對各個之電子零件雨、102...施加 電解電鍍。 X所示之電鍵失具雇，如圖5所示，以指定 内包有磁鐵112、m.·.，在與磁鐵112、112相當之位 置形成有凹部114、114 。名兮ππμ „ , ··在該凹部114、114···之各個 開口邛經由間隙118設有陰極板116、116。 裝載在該陰極板116、116上之電子零件ι〇2之 l〇2b、l〇2b··.之各個前端被磁鐵112之磁力吸著，電子跫 件102被把持成為立設在陰極板ll6、ii6上之狀態。-200825211 IX. Description of the Invention: [Technical Field] The present invention relates to an electrolytic plating apparatus and an electrolytic electricity money method, which are both a reading fixture and a detailed description of a plurality of leads extending from one of the cap portions. And the electronic zero" has plating equipment and electrolytic plating method and electrolytic electricity (four) with electroplating of electroplating [prior art] - the cap side has a plurality of leads extending from the side of the electronic parts (hereinafter referred to as electronic Parts): The machine is made of roller plating (barre ip丄at f electroplating first-hand--, + PiaUnW method, in this type of drum electric amp has a cage with a number of electronic parts, in Rotating in the electrolysis (4) of the dip electrode, and applying a current between the step plating and the % pole set in the drum to apply electrolysis to each electronic component. In this method of drum electro-minening, the problem is due to Electronics:: Contact between them is prone to scratching or bending of leads, or entanglement of electronic components. 屯In order to solve this problem, the patent document described below does not provide an electrolytic plating device. 4 In the electrolytic electricity (4) shown in Fig. 4, the electric ore jig 100' which is arranged and held with a plurality of 1〇2, 1〇2... is dipped into the electrolytic plating solution stored in the electricity = 104, and is electronically The part is followed by the way of facing the sun and the ancient f, vertically immersed, vibrating in the up and down direction by the upper and lower sliding mechanism 1〇6, and at the same time, the anode plate and the cathode 1 which is set in the plating fixture 1 ()) / 96 · 12 /% 140697 6 200825211 :: between the application of current 'used to apply electroplating to each electronic component rain, 102... The key shown by X is unemployed, as shown in Figure 5, The magnets 112 and m.. are included in the design, and the recesses 114 and 114 are formed at positions corresponding to the magnets 112 and 112. The names 兮ππμ „, the openings 144 in the recesses 114, 114··· pass through the gap 118. The cathode plates 116 and 116 are provided. The front ends of the electronic components 〇2b, l〇2b··. mounted on the cathode plates 116 and 116 are attracted by the magnetic force of the magnet 112, and the electronic components 102 are The grip is placed on the cathode plates ll6 and ii6.-
此種把持電子零件1 02 > U 7什1之把持力，如圖4所示之方式， 即使使電鍍夾具1〇〇成為φ古 i〇2、ig2。 成為μ ’亦可以把持電子零件 [專利文獻1]日本專利特開2〇〇6_1938〇6號公報 【發明内容】 (發明所欲解決之問題） 依照使用有圖4和圖5所示之電鍍夾具刚之電解· 裝置時，可以以保持排列有電子零件1〇2、1〇2…之狀熊: 浸潰到電解電鍍液中’並且對電子零件1()2、iG2之^個 帽盍部102a和引線1 〇2b施加電解電鍍。 因此，利用圖4和圖5所示之使用有電鍍夾具之電解带 鑛裝置，可以Βίτ止由;^電子零件彼此間之接觸造成刮傷2 引線之彎曲，或是電子零件彼此間之糾結之發生。 但是，在使时® 4和® 5所示之電鑛夾具之電解電聲 裝置中，通常陽極板之位置係面對排列在電鍍夾具丨⑽^ 312ΧΡ/發明說明書(補件)/96-12/96140697 η 200825211 子，件102、102...之各個帽蓋部1〇2a。 極::帽過？電鍍之電子零件1〇2，於接近陽 容易變大電子零件間之電鍍皮膜之厚度之不均 因此，本發明係用來解決先前技術之使用在且 =鐵之電料具，當對從帽蓋部之—面侧以多根之 •而出之電子零件施加電解電鍍時， 和 ;件間之電錢皮膜之厚度不均容易變大之問題=3 =供電解電鑛裝置及電解電鍍方法暨電解電鑛夾具，俾使 内盍部之一面側以多根之引線延伸而出之電子零件 膜。电子夺件間，可以儘可能地形成均—厚度之電鏟皮 (解決問題之手段） 本發明人為解決上述問題’首先，檢討在利用使用有圖 4和圖5所示之電鍍炎具之電解電職置施加過電解電鍛 之電子零件m，電鍍皮膜之厚度容易不均之原因，發現 電解電渡液中之電流，容易在極板之直角方向流動所以 在電子零件102 $易存在有電流易於集中之位置和電流 難以流入之位置，和施加過電解電鍍之電子零件丨〇2之帽 蓋部102a之電鑛皮膜，容易形成比引線祕之電鍛皮膜 為厚。 因此’本發明人認為因為電子零件1〇2之帽蓋部術 比引線102b接近陽極板，比引線1〇2b易於使電流集中， 312XP/發明說明書(補件)/96-12/96140697 8 200825211 所以在施加過電解電鍍之電子零件1G2，電鑛皮膜 谷易不均。因此’檢討之結果認為在施加電解電鍍時，ς 只是電子零件1()2之帽蓋部1G2a之近旁，在接近引線之 位置亦形成陽極’可以使電流分散到電子零件1()2之 部102a和引線i〇2b，其因而達成本發明。 孤Such a holding force of the electronic component 1 02 > U 7 is as shown in Fig. 4, even if the plating jig 1 is made φ 〇 i 〇 2, ig 2 . It is also possible to hold an electronic component as a μ'. [Patent Document 1] Japanese Patent Laid-Open Publication No. Hei 2〇〇6_1938〇6 (Invention) In the case of the electrolysis and the device, it is possible to keep the bears of the electronic components 1〇2, 1〇2, ..., immersed in the electrolytic plating solution, and to the cap parts of the electronic parts 1 (2) and 2, iG2. Electroplating is applied to 102a and lead 1 〇 2b. Therefore, by using the electroplating jig apparatus using the electroplating jig shown in FIG. 4 and FIG. 5, it is possible to prevent the bending of the 2 lead wires caused by the contact of the electronic parts with each other, or the entanglement of the electronic parts with each other. occur. However, in the electro-acoustic electro-acoustic device of the electro-metal fixture shown in the time plates 4 and 5, the position of the anode plate is usually arranged in the plating fixture 丨(10)^ 312ΧΡ/invention specification (supplement)/96-12 /96140697 η 200825211 The respective cap portions 1〇2a of the members 102, 102.... Extreme:: Hat over? The electroplated electronic component 1〇2 is uneven in the thickness of the plating film between the electronic parts which is easily close to the yang. Therefore, the present invention is used to solve the prior art use and = iron electric material, when the pair of caps When the electronic parts of the cover are applied by electrolysis, the thickness of the electric film between the parts is likely to become large, and the problem is that the thickness of the electric film is easily increased. The electro-chemical ore fixture is used to make the electronic part film which is extended by a plurality of leads on one side of the inner crotch. Between the electronic parts, it is possible to form a uniform-thickness shovel skin (a means to solve the problem). The present inventors have solved the above problems. First, review the use of electrolysis using the electroplating apparatus shown in Figs. 4 and 5. In the electric service, the electronic parts of the electrolytic forging m are applied, and the thickness of the plating film is easily uneven. It is found that the current in the electrolysis liquid is easy to flow in the direction perpendicular to the plate, so there is a current in the electronic component 102 The position where the concentration is easy to concentrate and the position where the current is difficult to flow, and the electric ore film applied to the cap portion 102a of the electroplated electronic component 2 are likely to be thicker than the electric forging film of the wire. Therefore, the inventor believes that since the cap portion of the electronic component 1〇2 is closer to the anode plate than the lead 102b, it is easier to concentrate the current than the lead wire 1〇2b, 312XP/invention specification (supplement)/96-12/96140697 8 200825211 Therefore, in the application of the electroplated electronic component 1G2, the electric ore film is easy to be uneven. Therefore, as a result of the review, it is considered that when electrolytic plating is applied, ς is only the vicinity of the cap portion 1G2a of the electronic component 1 () 2, and an anode is formed near the lead wire to disperse current to the portion of the electronic component 1 () 2 102a and lead i〇2b, which thus achieve the invention. solitary
亦本發明是-種電解電鍍裝置’其特徵在於具備 有··第1陽極板，被浸潰在電鍍槽之電解電鍍液中；和電 鑛夾具，係用來使從電解電㈣象之帽蓋部之—面側有多 根之引線延伸而出之t子零件，則线面對上述電解電鑛 液中之上述第1陽極板之一面側之位置之方式，而保持上 述電=零件；在上述電鍍夾具設有：陰極部，其内包有磁 鐵；第2陽極板，在上述陰極部之第丨陽極板側，被絕緣 層包夾而形成；和凹部，係貫穿上述絕緣層和第2陽極 板，使上述陰極部之陰極面在底面露出，並且使上述第2 陽極板之陽極面沿著内壁面露出，而在該凹部並插入有上 述$子零件之引線；和設有電源，用來對上述第丨陽極板 和第2陽極板與陰極部之間施加電流，成為使插入到上述 電鍍夾具之凹部之引線之前端，抵接在上述凹部之底面所 露出之陰極面，利用上述磁鐵之磁力吸著在上述陰極面， 對被上述電鍍夾具保持之電子零件之帽蓋部和引線施加 電解電鍍之方式。 另外，本發明是一種電解電鍍方法，其特徵在於所具備 之步驟包含有··用來保持從電解電鍍對象之帽蓋部之一面 側有多根之引線延伸而出之電子零件之電鍍夾具，在内包 312XP/發明說明書(補件)/96_12/9614〇697 9 200825211 ::鐵之陰極部之—面側，形成有 貫穿上述第2陽極板和絕 表面在底面露出之同時1之 極面沿著内壁面露屮> /成有上述弟2陽極板之陽 有門土面路出之凹部之電鍍夾且 :引:插入到上述電鍍夾具之凹部内，利用上述:鐵:： 極面極面之引線之前端吸著在上述陰 述電鍍夹且浸、科保持在電鍍夾具後；然後使上 鑛液，而成：:;在之電㈣之電解電 X1蓋部朝向上述第1陽極板之-面侧之方式;其次= :險極與上述第1陽極板和第2陽極板連接，並且使 述电源之陰極和上述陰極部連接，對上述帽蓋部和 施加電解電鍍。 ^ 另外，本發明是-種電解電鍍夾具，細成為使從電解 电，對象之帽蓋部之—面侧有多根之引線延伸而出之電 _子令件，位於面對被浸潰在電鍍槽之電解電鍍液之第^陽 極板之位置之方式，而絲㈣上述電子零件之電鏟夾 具；/其特徵在於具備有：陰極部，由内包有磁鐵之金屬構 件形成，成為與電解電鍍用之電源之陰極連接；第2陽極 板係在上述陰極部之第1陽極板侧被絕緣層包夾而形 -成，成為與上述電源之陽極連接；和凹部，係貫穿上述絕 ，緣層和第2陽極板，使上述陰極部之陰極面在底面露出， 並且使上述第2陽極板之陽極面沿著内壁面露出，利用上 述磁鐵之磁力吸著插入而抵接在上述底面之上述電子零 mxp/發明說明書(補件)/96-12/96140697 10 200825211 件之引線之前端，用來保持上述電子零件。 在本發明中，以包圍雷+焚 国包千令件之引線之方式，使第2陽 板之陽極面沿著電鍍夾具之凹部之㈣面露出，可以用 來對電子零件之引線之各個普遍地施加電解電錢。 一另外’經由將連接電源之陽極和第2陽極板之導電線之 部份配設在覆蓋陰極部之表面之絕緣層内，可以使 夾具之處理變為容易。 另外，α置對第1陽極板和陰極部施加電流之第 L’lt對第2陽極板和陰極部施加電流之第2電源，經由 痒別地控制施加之電流值，可以使形成在被施加過電解電 鍵之電子零件之帽蓋部和引線之電鍍皮膜更進—步一層 地均一化。 ^ (發明效果） 中發明時’在多根之引線插入到電錢夹具之凹部之 部之近旁，設置第1陽極板，並且使引線 之别鳊抵接在凹部之底面露出之陰極面。 之二卜’ ί入到凹部之電子零件之引線，係位於沿著凹部 出之出之第2陽極板之露出面和在凹部之底面露 ® <陰極面之間。 加第1陽極板和第2陽極板與陰極部之間施 之二邱Ϊ弟1陽極板與陰極部之間，主要地在電子零件 之形成電解電鑛皮膜’在第2陽極板和陰極部 u士要^在電子零件之引線可以形成電解電鍍皮膜。 〇疋結束電解電鍍之電子零件，於該帽蓋部和多 312轉明說明書(補件)/96-勘麵97 n 200825211 根之引線可以儘可能地形成 R . ^ ? ^ Α 明知度之電解電鍍皮膜，而 且在電子零件間亦可以儘可能 反胰而 鑛皮膜。 均一厚度之電解電 【實施方式】 ―本^之電解電鍍裝置之—實例以…表示。在圖 ::_鍍裳置中’在電鍍槽12之電解電鍍液14中， 浸潰矩形形狀之第丨陽極板16和電鍍夾具Μ。在與 1陽極板16之-面侧所面對之電鑛夾具1G之面對面側， 保持為排列有電解電鍍對象之多個之電子零件“'Μ 狀態"此種電子零件18如圖2所示之方式，使多根之·= 線18b、18b…從帽蓋部i8a之一面侧延伸而出。 在電鍍夾具10,如圖2所示，設有陰極部22，由 構件構成，並在内部内包有永久磁鐵2()。在該陰極部『 連接有導電線25，該導電、線25連接到圖j所示之直流· 源32之陰極。 μ免 ⑩在該陰極部22之一面側配設有被絕緣層24a、24b包夾 之第2陽極板26。該第2陽極板26係由與第}陽極^ 16 相同之金屬形成。 在陰極部22之一面侧形成有凹部28、28···，貫穿第2 陽極板26和絕緣層24a、24b，用來使陰極部22之陰極 -面22a在底面露出。在該凹部28、28…之各個内壁面，第 2 %極板2 6之陽極面2 6 a沿著内壁面而露出。 在該凹部28，如圖2所示之方式，插入有電子零件工8 之多根之引線18b、18b···。因此，在凹部28，以包圍插 312XP/發明說明書(補件)/96-12/96140697 12 200825211 入之電子零件18之引線18b、18b.之方式，沿著凹部Μ 之内壁面使第2陽極板26之陽極面26a露出。 另外，形成在陰極部22之—面侧之絕緣層⑽之一部 伤，亦在陰極部22之側面側延伸而出。在延伸到該陰極 部22之側面側之絕緣層14㈣，連接第2陽極板託和直 流電源之陽極之導電線3G之—部份，被配設成與陰極部 22之間包夾有絕緣層14b之一部份。依照此種方式，經 由將導電線3G之電鍍夾具1G之近旁配設在絕緣層施之 延伸部内，可以使電鍍夾具1〇和導電線3〇之一部份一體 化’而可以提尚電鑛夾具10之處理效率。 當對圖2所示之電鍍夾具1〇之凹部28、28••之各個， 插入電子零件18之引線18b、18b··時，各個引線18b之 前端抵接在凹部28之底面露出之陰極面22a。前端抵接 在凹部28之陰極面22a之引線18b，利用配設在陰極部 22内之永久磁鐵2〇之磁力，被吸著在凹部28之陰極面 22a。因此，電子零件18以其帽蓋部18a位於凹部28之 外方之狀態，被保持在電鍍夾具〗〇之一面侧。 依知此種方式’當在電鍍夾具10之凹部28、28···之各 個保持有電子零件18之狀態時，即使使水平裝載之電鍍 夾具10成為如圖2所示之垂直時，亦可以將電子零件18、 18···之各個保持在電鍍夾具1〇中之指定位置。 其次，將圖2所示之電鍍夾具1〇，如圖丨所示地浸潰 到電鍍槽12之電解電鍍液丨4中。這時，以被保持之電子 零件18、18…朝向第1陽極板16之方式，將電鍍夾具1〇 312XP/發明說明書(補件y96-12/9614〇697 13 200825211 浸潰到電解電鍍液14。 然後，如圖1 % — 丄b 夾具10之第2陽不之，，連接第1陽極板16和電鍍 接電鍍夾not 直流1源32之陽極，並且連 用來對被電鍍夾且:部22與直流電源32之陰極，藉以 〇 28之夂個广又用在弟1陽極板16和在凹部28、 ·.， Q &面露出之陰極面22a之間流動之電浐， 地用來對電子烫氹,〇 备 j机勒怎私桃，主要 子令件18之帽蓋部18a施加電解電鍍。 另外，利用在凹立β & π ^ & 陽極面％ ^ 面露出之第2陽極板^之 : 和於其底面露出之陰極Φ 22a之間流動之電 、肌，主要地用來對電子 解電鑛。 “子令件18之引線18b、18b...施加電 因此，可以對電子零件18、18. 和引線18b、18之令舻浐士认 ^ 1 1ΰα 零件間亦可以儘可能地形成均而在電子 〜取g y子度之電解電鍍皮膜。 在此處之圖1所示之電解錢裝置、 第2陽極板26係使用由镍制忐夕铱^ ^ ^ 文用由錄衣成之弟1陽極板16和第2陽 極板26 ’對被電鍍夾具1〇保持之電子零件18、18施加 電解鐘錄。此時，電解電鍍液14係使用市售之錄電解電 鍍液，在第1陽極板16和第2陽極板26與陰極部22之 間，對在凹部28、28，..之底面露出之陰極面他，以使電 流密度成為5Α/αη2之方式，施加直流電流。 在被施加過電解鍍錄之電子零件18之帽蓋部⑽和引 線18b所形成之鍍錄皮膜之厚度之不均為4 6_，電子 312XP/發明說明書(補件)/96-12/96140697 14 200825211 零件18、18…間之鍍鎳皮膜之厚度之不均為4 3以讯。 另外一方面，在圖1所示之電解電鍍裝置中，對第2陽 極板26和陰極部22之間不施加直流電流，除此之外，與 上述同樣地，對被電鍍夾具10保持之電子零件i8、l/、 施加電解鍍鎳。在被施加過電解鍍鎳之電子零件Μ之帽 蓋部18a和引線18b所形成之鍍鎳皮膜之厚度之不均= 9. 4/z m，電子零件18、18…間之鍍鎳皮膜之厚度之不均為 5. 3/zm。當與在第2陽極板26和陰極部22之間施加直流 電流之上述情況進行比較，該等之鍍鎳皮膜之不均為2The present invention is also an electroplating apparatus which is characterized in that it has a first anode plate which is impregnated in an electroplating bath of an electroplating bath, and an electric ore jig which is used to make a cap from an electrolysis (4) elephant. a part of the cover portion having a plurality of leads extending from the surface of the cover portion, wherein the line faces the surface side of the first anode plate in the electrolytic electric ore solution, and the electric component is held; The plating jig includes a cathode portion in which a magnet is housed, a second anode plate formed on the second anode plate side of the cathode portion by an insulating layer, and a concave portion penetrating the insulating layer and the second portion. In the anode plate, the cathode surface of the cathode portion is exposed at the bottom surface, and the anode surface of the second anode plate is exposed along the inner wall surface, and the lead of the sub-component is inserted into the recess; and a power source is provided. An electric current is applied between the second anode plate and the second anode plate and the cathode portion, and the leading end of the lead inserted into the concave portion of the plating jig is brought into contact with the cathode surface exposed on the bottom surface of the concave portion, and the magnet is used. Magnetic suction In the cathode surface, the cap of the electronic component held by the lid portion of the plating jig and the lead of the embodiment is applied to electroless plating. Further, the present invention is an electrolytic plating method, characterized in that the step includes a plating jig for holding an electronic component extending from a plurality of leads on one side of a cap portion of an electrolytic plating object, In the inner package 312XP/invention specification (supplement)/96_12/9614〇697 9 200825211: the side of the cathode portion of the iron is formed with a pole face that penetrates through the second anode plate and the surface of the outer surface is exposed at the same time. The inner wall surface dew 屮 / 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成The front end of the lead wire is sucked in the above-mentioned descriptive electroplating clip and the dip is kept in the electroplating jig; then the ore liquid is made to be::; in the electric (4) electrolysis electric X1 cover portion faces the first anode plate The method of the surface side; secondly, the dangerous electrode is connected to the first anode plate and the second anode plate, and the cathode of the power source is connected to the cathode portion, and electrolytic plating is applied to the cap portion. In addition, the present invention is an electroplating jig which is made to be an electric splicing piece which is extended from the electrolysis electric power and has a plurality of leads on the surface side of the cap portion of the object, and is placed in the face to be immersed in the face. a method of arranging the position of the first anode plate of the electrolytic plating solution of the plating tank, and the wire (4) the electric shovel clamp of the electronic component; or characterized in that: the cathode portion is formed by a metal member containing a magnet, and is electroplated a cathode connection of the power source; the second anode plate is formed by being sandwiched by an insulating layer on the first anode plate side of the cathode portion, and is connected to the anode of the power source; and the recessed portion penetrates the above-mentioned absolute edge layer And the second anode plate, the cathode surface of the cathode portion is exposed at the bottom surface, and the anode surface of the second anode plate is exposed along the inner wall surface, and the electrons are inserted into the bottom surface by the magnetic force of the magnet. Zero mxp / invention manual (supplement) / 96-12/96140697 10 200825211 The front end of the lead wire is used to hold the above electronic parts. In the present invention, the anode surface of the second male panel is exposed along the (four) surface of the concave portion of the plating fixture in such a manner as to surround the lead of the lightning + burning national package, which can be used for the common lead of the electronic component. Apply electrolytic electricity money. Alternatively, the processing of the jig can be facilitated by disposing a portion of the conductive line connecting the anode of the power source and the second anode plate in the insulating layer covering the surface of the cathode portion. Further, α is applied to the first anode plate and the cathode portion, and the second power source that applies a current to the second anode plate and the cathode portion is controlled by the itch to control the applied current value. The cap portion of the electronic component of the electrolysis key and the plating film of the lead are further step by step uniform. (Effect of the Invention) In the case of the invention, the first anode plate is provided in the vicinity of the portion where the plurality of leads are inserted into the concave portion of the money chuck, and the lead wire is abutted against the cathode surface exposed on the bottom surface of the concave portion. The lead wire of the electronic component that is inserted into the recess is located between the exposed surface of the second anode plate which is formed along the concave portion and the surface of the recessed portion between the cathode and the cathode surface. Between the first anode plate and the second anode plate and the cathode portion, between the anode plate and the cathode portion of the Erqiu dynasty 1 and the cathode portion, the electrolytic coating film is formed mainly in the electronic component 'in the second anode plate and the cathode portion u Shi wants to form an electrolytic plating film on the lead of the electronic parts. 〇疋 End of electrolytic plating of electronic parts, in the cap section and more 312 transcripts (supplement) / 96 - survey surface 97 n 200825211 root lead can form R as much as possible. ^ ^ ^ Α Electrolysis of awareness Electroplated film, and the anti-pancreas can be as much as possible between the electronic parts. Electrolytic power of uniform thickness [Embodiment] An example of the electrolytic plating apparatus of the present embodiment is denoted by . In the electrolytic plating solution 14 of the plating tank 12, the rectangular anode-shaped anode plate 16 and the plating jig 浸 are immersed in the drawing of the plating solution. On the face-to-face side of the electro-metal jig 1G facing the surface side of the anode plate 16 is held as an electronic component in which a plurality of electroplated objects are arranged "'Μ state"; such an electronic component 18 is as shown in FIG. In the manner shown, a plurality of the ? lines 18b, 18b are extended from one surface side of the cap portion i8a. The plating jig 10 is provided with a cathode portion 22 as shown in Fig. 2, and is composed of a member. The inside is internally provided with a permanent magnet 2 (). A conductive line 25 is connected to the cathode portion, and the conductive line 25 is connected to the cathode of the DC source 32 shown in Fig. j. μ is 10 on one side of the cathode portion 22. The second anode plate 26 sandwiched by the insulating layers 24a and 24b is disposed. The second anode plate 26 is formed of the same metal as the first electrode 16. The concave portion 28, 28 is formed on one surface side of the cathode portion 22. The second anode plate 26 and the insulating layers 24a and 24b are formed to expose the cathode-surface 22a of the cathode portion 22 on the bottom surface. On the inner wall surfaces of the recesses 28, 28, ..., the second % plate 2 The anode surface 2 6 a of 6 is exposed along the inner wall surface. In the recess 28, as shown in FIG. 2, a plurality of leads of the electronic component worker 8 are inserted. Lines 18b, 18b.. Therefore, in the recess 28, along the recess 18b, 18b. of the electronic component 18 that is inserted into the 312XP/invention specification (supplement)/96-12/96140697 12 200825211, along the recess The inner surface of the second anode plate 26 is exposed on the inner wall surface of the second anode plate 26. The one of the insulating layers (10) formed on the surface side of the cathode portion 22 is also wound on the side surface side of the cathode portion 22. The insulating layer 14 (four) to the side of the cathode portion 22, the portion of the conductive line 3G connecting the second anode plate holder and the anode of the direct current power source, is disposed so as to sandwich the insulating layer 14b with the cathode portion 22. In this manner, by arranging the vicinity of the plating jig 1G of the conductive wire 3G in the extension portion of the insulating layer, one part of the plating jig 1 and the conductive wire 3 can be integrated. The processing efficiency of the electric iron jig 10 is increased. When the lead wires 18b, 18b·· of the electronic component 18 are inserted into the recesses 28, 28 of the plating jig 1 shown in Fig. 2, the front ends of the respective lead wires 18b are abutted. The cathode surface 22a exposed at the bottom surface of the concave portion 28 is abutted at the concave portion 28 The lead 18b of the pole face 22a is attracted to the cathode face 22a of the recess 28 by the magnetic force of the permanent magnet 2〇 disposed in the cathode portion 22. Therefore, the electronic component 18 is located outside the recess 28 with the cap portion 18a thereof. The state of the square is held on one side of the plating jig. In this manner, when the electronic components 18 are held in the recesses 28, 28, ... of the plating jig 10, even if the horizontal loading is performed When the plating jig 10 is vertical as shown in FIG. 2, each of the electronic components 18, 18, ... may be held at a predetermined position in the plating jig 1". Next, the plating jig shown in Fig. 2 is immersed in the electrolytic plating bath 4 of the plating bath 12 as shown in Fig. 2 . At this time, the plating jig 1 312XP/invention specification (supplied y96-12/9614〇697 13 200825211 is immersed in the electrolytic plating solution 14 so that the held electronic components 18, 18... are directed toward the first anode plate 16. Then, as shown in Fig. 1% - 丄b, the second anode of the jig 10 is connected, the first anode plate 16 and the plated plating plate are not the anode of the direct current source 32, and are connected to the plated plate and the portion 22 is The cathode of the DC power source 32 is used to illuminate the electrons between the anode 1 and the cathode surface 22a of the recesses 28, . . . , Q & The scalding is applied to the cap portion 18a of the main sub-assembly 18 by electrolytic plating. In addition, the second anode plate exposed on the concave surface of the β & π ^ & π ^ & ^: The electricity and muscle flowing between the cathode Φ 22a exposed at the bottom surface thereof are mainly used to de-electrolyze the electrons. "The wires 18b, 18b of the sub-piece 18 are electrically applied. Therefore, the electrons can be applied to the electrons. Parts 18, 18. and leads 18b, 18 can also be formed as much as possible between the parts of the gentleman. The electrolysis plating film of the gy sub-degree is used. The electrolysis money device and the second anode plate 26 shown in Fig. 1 here are made of nickel-made 铱 铱 ^ ^ ^ And the second anode plate 26' applies an electrolytic clock to the electronic components 18 and 18 held by the plating jig 1 。. At this time, the electrolytic plating solution 14 uses a commercially available electrolytic plating solution, in the first anode plate 16 and the first Between the anode plate 26 and the cathode portion 22, a direct current is applied to the cathode surface exposed at the bottom surface of the concave portions 28, 28, .. so that the current density is 5 Α / α η 2 . The thickness of the plating film formed by the cap portion (10) and the lead wire 18b of the electronic component 18 is not limited to 4 6_, electronic 312XP/invention specification (supplement)/96-12/96140697 14 200825211 between parts 18, 18... The thickness of the nickel-plated film is not the same as that of the fourth embodiment. In the electrolytic plating apparatus shown in Fig. 1, no direct current is applied between the second anode plate 26 and the cathode portion 22, and In the same manner as described above, electrolytic nickel plating is applied to the electronic components i8, l/ held by the plating jig 10 The thickness of the nickel-plated film formed by the cap portion 18a and the lead 18b of the electronic component to which the electrolytic nickel plating is applied is 9. 4/zm, and the thickness of the nickel plating film between the electronic components 18, 18, ... Not all of them are 5. 3/zm. When compared with the above case where a direct current is applied between the second anode plate 26 and the cathode portion 22, the nickel plating films are not all 2
—在圖3所示之電解電㈣置中’可以獨立地控制施加在 弟1陽極板14與在凹部28、28..之各個底面露出 面22a之間之直流電流值，和施加在於凹部之内辟而 露出之第2陽極板26之陽極面26a與在其底面露出= 極面22a之間之直流電流值。因此，對於施加過電解電^ —在圖1所示之電解電鍍裝置中，不能獨立地控制施加在 弟1陽極板16與在凹部28、28.··之各個底面露出之陰極 面22a之間之直流電流值，和施加在凹部28之内壁面霖 出之第2陽極板26之陽極面26a與在該底面露出之陰= 面22a之間之直流電流。因此，電子零件内和電子焚: 之電解電鍍皮膜之厚度之均-化存在有—定之界限' β 在此種情況’如圖3所示’最好設有對第i陽極板 和陰極部22施加直流電流之第！電源如，和對第 極板26和陰極部22施加直流電流之第2電源3孔。 312XP/發明說明書(補件)/96-12/96140697 15 200825211 之電子零件18’在電子零件内和電子零件間，在電解電 鍍皮膜之厚度存在有不均之情況時，為使電解電鍍皮膜之 、厚度仏可能地均一化，可以獨立地變更來自第工電源 或第2電源32b之直流電流值。 在此處使用圖3所示之電解電鍍裝置，將由第1電源 所施加在第1陽極板16和凹部28、28.··之各個底面 f出之陰極部22之表面之間之直流電流值，調整對在凹 _ 15 28 =·..之底面露出之陰極面22a之電流密度而成為 2.5A/cm2。另外，將由第2電源32b所施加在凹部之 内壁面路出之第2陽極板26之露出面26a和在凹部28、 28…之各個底面露出之陰極面22a之間之直流電流值，調 整對凹部28、28...底面之電流密度而成為2.5八/(^2。另 外，與使用圖1所示之電解電鑛裝置之電解鑛錄同樣地， 對被電鍍夾具10保持之電子零件18、18..施加電解鑛錄。 在被施加過電解鍍鎳之電子零件18之帽蓋部m和引 鲁線18b所形成之鍍錄皮臈之厚度之不均為37㈣，電子 零件18、18…間之鍍鎳皮膜之厚度之不均為41"。 該等之鍍鎳皮狀*均，當與❹圖之電解電錢 裝置之情況進行比較時，成為較小。 以上，在所說明之圖2阱；a ^ 口 ^所不之電鍍夾具10中是涵蓋凹 *部28、28…之底面全體地設置—片之永久磁鐵20’但是 .亦可以在凹部28、28·..之各個底面，設置對應之永久磁鐵。 另外’亦可以使用電磁鐵代替永久磁鐵20。 【圖式簡單說明】 312ΧΡ/發明說明書(補件)/96·12/96140697 16 200825211 例 回疋概略圖，用來說明本發明之電解電鍍裝置 Ο 圖2是剖面圖 用之電鑛夾具。 圖3是概略圖 實例。 圖4是概略圖 圖5是剖面圖 電鑛夾具。 用來表示圖1所示之電解電鍍裝置所使 用來說明本發明之電解電鍍裝置之另一 用來說明先前技術之電解電鍍裝置。 用來說明圖4之電解電鍍裝置所使用之 【主要元件符號說明 10 電鍍夾具 12 電鍍槽 14 電解電鍍液 16 弟1陽極板 18 電子零件 18a 帽蓋部 18b 引線 20 永久磁鐵 22 陰極部 22a 陰極面 24a、24b 絕緣層 25、30 導電線 26 第2陽極板 26a 陽極面 M2XP/發明說明書(補件)/96-12/90140697 17 200825211 28 凹部 32 電源 32a 第1電源 32b 第2電源- In the electrolysis (four) center shown in Fig. 3, the direct current value applied between the anode plate 14 and the respective bottom surface exposed faces 22a of the recesses 28, 28 can be independently controlled, and applied to the recesses. The direct current surface 26a of the second anode plate 26 exposed and exposed is exposed to a direct current value between the bottom surface 22a and the bottom surface 22a. Therefore, in the electrolytic plating apparatus shown in Fig. 1, it is not possible to independently control the application between the anode plate 16 of the anode 1 and the cathode face 22a exposed at the respective bottom faces of the recesses 28, 28. The DC current value is a direct current between the anode surface 26a of the second anode plate 26 and the cathode surface 22a exposed on the bottom surface of the recessed portion 28. Therefore, the uniformity of the thickness of the electrolytic plating film in the electronic part and the electron incineration has a certain limit 'β. In this case, 'as shown in FIG. 3', it is preferable to provide the ith anode plate and the cathode portion 22 Apply DC current! The power source is, for example, a second power source 3 hole that applies a direct current to the first plate 26 and the cathode portion 22. 312XP / invention manual (supplement) / 96-12/96140697 15 200825211 electronic parts 18' between the electronic parts and the electronic parts, in the case of uneven thickness of the electrolytic plating film, in order to make the electrolytic plating film The thickness 仏 may be uniform, and the DC current value from the power source or the second power source 32b may be independently changed. Here, using the electrolytic plating apparatus shown in FIG. 3, the direct current value between the surfaces of the cathode portions 22 from the respective bottom surfaces f of the first anode plate 16 and the concave portions 28, 28, . . . by the first power source is used. The current density of the cathode surface 22a exposed on the bottom surface of the concave _ 15 28 =·. was adjusted to 2.5 A/cm 2 . Further, the DC current value between the exposed surface 26a of the second anode plate 26 which is applied to the inner wall surface of the recessed portion by the second power source 32b and the cathode surface 22a which is exposed at each of the bottom surfaces of the recesses 28, 28, ... is adjusted. The current density of the bottom surfaces of the recesses 28, 28, ... is 2.5 octaves/(2). In addition, the electronic component 18 held by the plating fixture 10 is used in the same manner as the electrolytic mine recording of the electrolytic ore apparatus shown in Fig. 1. 18. Electrolytic mining is applied. The thickness of the plated skin formed by the cap portion m and the lead wire 18b of the electronic component 18 to which the electrolytic nickel plating is applied is not 37 (four), and the electronic components 18 and 18 The thickness of the nickel-plated film between the two is not the same as 41. These nickel-plated skins* are smaller when compared with the case of the electrolytic money-selling device of the present invention. Fig. 2 is a well; a ^ port is not included in the plating jig 10, which is provided with a permanent magnet 20' which is provided on the bottom surface of the recessed portions 28, 28, ..., but may also be in the recesses 28, 28, . On the bottom surface, the corresponding permanent magnet is set. In addition, an electromagnet can be used instead of the permanent magnet 20. BRIEF DESCRIPTION OF THE DRAWINGS 312 ΧΡ / Invention Manual (Supplement) / 96·12/96140697 16 200825211 A schematic diagram for explaining the electrolytic plating apparatus of the present invention Ο FIG. 2 is an electric mine fixture for a sectional view. Fig. 4 is a schematic view. Fig. 5 is a cross-sectional view of an electrowinning jig. Another electrolytic electroplating apparatus shown in Fig. 1 is used to illustrate the electrolytic electroplating apparatus of the present invention. Electroplating device. Used to illustrate the electroplating device used in Figure 4. [Main component symbol description 10 Plating fixture 12 Plating tank 14 Electrolytic plating solution 16 Brother 1 Anode plate 18 Electronic component 18a Cap portion 18b Lead wire 20 Permanent magnet 22 Cathode portion 22a cathode surface 24a, 24b insulating layer 25, 30 conductive wire 26 second anode plate 26a anode surface M2XP / invention manual (supplement) / 96-12/90140697 17 200825211 28 recess 32 power supply 32a first power supply 32b second power supply
312XP/發明說明書(補件)/96-12/96140697 18312XP/Invention Manual (supplement)/96-12/96140697 18