TW544475B - Device and method for continuous electroplating treatment - Google Patents

Abstract

The present invention discloses a device and a method for a continuous electroplating treatment. The invented device includes: an electroplating tank having an electrolysis region and an electroplating region; a plurality of rollers for guiding a conductive plate sequentially through the electrolysis region and the electroplating region; a plurality of electrode plates located in pairs in the electrolysis region and the electroplating region, in which the electrodes in the electrolysis region and the electroplating region are switched at a specified time interval, thereby maintaining the distances between the electrode in the electrolysis region having a thickness increased along with process time, the electrode in the electroplating region having a thickness reduced along with process time, and the conductive plate.

Description

544475

The invention relates to a device for continuous electroplating treatment and 4 ± j?, F ^ Renai / 2 :,... The invention relates to a device and method for electroplating treatment of electrodes 1 in the electrolysis area and electroplating area at a predetermined time. This is used to maintain the thickness of the electrode in the electrolytic zone that increases during the plating process, and to decrease the distance between the electrode in the tail region and the object to be plated. Traditional metal plate electroplating, especially the continuous surface of steel plate, such as galvanized steel plate (for galvanized steel plate), tin plated (^), chromium (for Tin Free Steel), and nickel plated. Xi, σ 4 As shown in the first figure, the steel sheet 3 continuously immersed in the electroplating bath is turned on by the rollers U, 18, 20, and 22 to the negative output of the rectifier 10, and the current converter 1 〇 The positive output terminal is connected to the electrode plate 1 2 and 1 4 for the ore reduction reaction of Ϊ Ϊ ΐ metal ion. However, the surface of the conductive Xingkun must have a mouth, and the two steel plates contact, so it often causes defects on the surface of the steel plate, which affects the production: the quality of the button, such as friction marks, and the electric roller marks that are unique to the CAROSEL · process ( band mark). In view of the above problems, there are currently two improved methods. The speed of the roller is consistent with the speed of the steel sheet to avoid phase rotation. The surface of the conductive roller is kept clean to avoid the supply of pollutants. The two methods are Using an acid or an alkaline solution, the plating layer on the surface of the steel sheet after electroplating is used as a micro-etched polishing place, and the outer layer is 妯 π ^ ^ ^. However, it cannot completely affect the quality of the product. The electric shoe still has more yttrium here. The present invention provides a novel plate device and a square plate. It is necessary to use a light guide / :: plating treatment to conduct electricity. Galvanic

544475 V. Description of the invention (2) The design of the dipolar circui t (i.e., 仏, 丄, 丄, 丄) induces electricity to conduct electrolysis, which can completely avoid the problem of Λ solution / surface quality of the electrode plate. In addition, through the production of the electrolytic area and the electroplating area at the back, the repair can be repaired μ μ 邋 valent price 马 杈 β, „^ ^ ^ ^ repair the original surface of the conductive plate. The electrodes in the electrolysis zone and the electroplating zone are exchanged at the same time to maintain the distance between the electrode in the electrolytic zone that increases in thickness over time and the electrode plate in the electric mining zone that decreases in thickness over time. .1g of the original circuit of the coupler circuit, providing a continuous plating treatment device 'suitable for conductivity; I j 〒Dian "Wang Yueyue's non-contact type plating treatment, including: :: plating tank' with an electrolysis zone and a plating zone; A plurality of rollers are used to guide the processed conductive sheet through the above electrolysis zone and the above electroplating zone; exchange the electrolysis zone and the "plating zone on the power mine" at a predetermined time, and the electrode switch By this, the thickness is increased by the last name, and the distance between the electrode in the electrolytic zone and the electrode in the plated zone, which decreases with each other, decreases. Among them, each of the above-mentioned double-thickness tail plates is composed of one of the M # double electrode plates at the bottom of the plating tank and is composed of a plurality of strips. In addition, the present invention provides a processing method. The method includes: providing an electroplating tank 1 with electricity J = mining area, providing at least one each of the above electrolysis area and the above electricity mining area to form a board, and guiding the processed conductive plates successively. α In the middle of the double electrode plate in the electroplating area, in the electrode area of the electrolysis area and the above area and the electrode plate of the electric power area, so that: = the thickness increases with time in the process, and is held in the electroplating; electrolysis ^ Electrode and over time

544475 V. Description of the invention (3): Ionization of the above plated area with reduced thickness. Wherein, the distance between each of the two double electrodes is formed by a plurality of strips, such as the distance between the conductive plates. Furthermore, it is located at the bottom of the plating tank and is machined. When the electrode is used, the electrode can be shaped in order to make the above purpose of the present invention; Wen specifically cited the preferred embodiment, and the point y is easy to understand. »彳 At first, a detailed description such as a simple diagram::; It shows the method of conventional electroplating; the figure shows the schematic diagram of the graying-out trace of the present invention; the principle diagram of the double galvanic circuit is shown with the mark of the conductive roller in the known solution; the figure; the embodiment of the present invention The cross-section of the continuous electroplating device shows the charged diagram of the embodiment of the present invention; FIG. 7 is a circuit diagram of the embodiment of the present invention; The method of exchanging the electrodes in the electrolysis area and the electroplating area. The above figure shows the description of the symbols: Nai 1 ~ metal conductor; Γ 二 12, 14, 112, 114, 124, ⑵ ~ electrode. 4 ~ electroplating solution; potential , 5, 1 Q, 1 1 0 ~ rectifier; 16 '18' 20, 22 ~ conductive roller;

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V. Description of the invention (4) 30, 1 30 ~ steel sheet; 100 ~ metal sheet; 101 ~ electroplated layer; 102 ~ new plating layer 1 0 3 ~ defect; 1 2 2, 1 2 0, 1 16、11 8 ～ rollers; 140 ～ isolation plate; 150 ～ electrolyte; 960 ～ plating tank; 901, 902, 903 ～ long electrode. Examples

First, explain the principle of the above-mentioned double galvanic circuit. Referring to FIG. 3, the -metal conductor 1 is placed between the electrodes 2 and 3 in the plating solution 4, and the electrode is connected to the positive and negative output terminals of the rectifier 5, and the metal conductor 丨The ^ position near the negative terminal 3 is induced & positively charged, where the metal will be gradually dissolved out by electrolysis. The part of the metal conductor 1 near the positive terminal 2 is induced to be negatively charged, and =: metal ions are electrically precipitated. The current is transmitted from the positive terminal 2 of the rectifier 5 to the positive terminal 2 of the electroplating tank, and is conducted to the negative terminal of gold = 2 through the plating solution 4, and the electroplating operation is performed here. Looking for temptation ^

The negative terminal flows to the positive terminal and passes through the plating solution; the metal conductor 1 is pressed to the negative output terminal of the rectifier 5 to complete a loop. Wait until the negative electrode 3, and finally, in this embodiment, an electro-galvanized steel sheet having a conductive roller Mark defect on the surface is used as a test piece. Traces (Band 20 g / cm2, continuous plating according to the present invention, = surface galvanizing amount is the clothes placement and method removal section

544475 V. Description of the invention (5) Surface defects. The above-mentioned 锖 锖 thunder shot; ♦ As shown in Figure 4, the electroplating device is in the liquid 150, and the steel sheet to be processed 乂 6: '# stores the electrolysis core absorption 130 疋 through the rollers 122, 120, 116, 118, and into and out of the continuous plating treatment tank. m, a plurality of isolation plates are provided with an insulating material in the middle of the Λ electric Λ slot 160: 'and the slot 16 is divided into an electrolytic area A and a plating area B. There are no special restrictions on these intervals. Set in two areas of AB respectively-set of electricity = 124, 126 and 112, u4, the steel sheet to be processed is lost in the middle: the electrode plate 126 is connected to the negative terminal of the rectifier 110, and the electrode "= to the device 110" Positive end. Similarly, the electrode plates 124 and ι2 are also connected to another rectifier (not shown) and each has a negative electrode and is positively charged. Start U | 'The charging diagram of the above device is shown in Fig. 5, H zone A The electrode plate 126 is charged with electricity, so that the steel plate 130 close to the electrode plate is positively charged and emits electrons (Zn — zp + k); on the other hand, the other area is separated by the isolation plate 140. The electrode plate is an electrode plate. 114 is positively charged, so that the steel sheet 130 near the open electrode plate becomes negative t, and + 2e-Zn).

5 The purpose of placing an isolation plate 14 is: because the entire electrode plate and the steel sheet are located in the electrolyte, the circuit diagram of the entire device is shown in Figure 6, and AB * and j represent the electrode plate 126 and the corresponding steel. And ⑶ respectively means = plate U4 and the corresponding steel plate; because the flow of electrons may enter the lamp in the solution, that is, from A to D, this electron flow will reduce the electrolytic plating on the steel plate Reaction, so it is necessary to set an isolation board, increase the resistance from A to D, so that the reaction is concentrated on the steel sheet, that is, between the teams. The above isolation

544475 V. Description of the invention (7) According to the above-mentioned continuous electroplating treatment device and method of the present invention, the metal sheet 100 shown in FIG. 2 has a plating layer 101 formed thereon, and the defects 103 on the plating layer 101 may be Then it is electrolytically electroplated to form a new thin layer [layer 1 0 2 '. The original surface defects can be removed to form a metal sheet with good surface quality. Ben Moming's continuous power money processing device and method are not limited to processing steel = any contactless electroplating place for conductive plates can be used to limit this hair ^ hair Γ has been disclosed as above with a preferred embodiment, However, it is not intended to be used as :::::: =, without departing from the spirit of the present invention, as the attached Shenli J2 retouch, so the protection of the present invention. The monthly patent consumption is defined.

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Claims (1)

Said person-1 No. 901324¾) α, patent application sharp-type electric: processing unit, used for "―" contact point :: plating tank, with electrolysis area and electroplating area; the last few Xingkun tubes, It is used to guide the upper electrolysis area and the above electroplating area; the conductive plates with ^, pass through successively and are located in: Lei ^ is located in the above electrolysis area and the above-mentioned electric mining area, and the brother changes the electrolysis area and electroplating area. The scope of the application for the scope of the item i: State: ί: one of the two electrode plates is located in the electric plate ^ one of the continuous electroplating treatment devices, the type of electroplating treatment J: treatment method '• for conductive plates without contact The above has an electrolysis area and a plating area, and at least one bi-electrode plate is provided in each of the electro-plating areas and the electro-plating areas; the bi-electrode plates for guiding the processed lightning-conducting cup Uα electric money area pass through the electrolysis area and the above慯 Electrode: The electrode of the electrolysis zone is exchanged with the continuous electroplating method described in item 4 of the 5th patent scope of the above-mentioned electroplating zone for a predetermined time. The electrode plate is located at the bottom of the plating bath and is composed of a plurality of 6 Production: Patent Application The continuous plating method described in the fourth item of the scope, ^ can shape and shape the electrode when the parent changes the electrode. 〇l〇9-7449TWFl; ALEXLIN.pt page 11