JP4813567B2 - 高温両端開放型ゼロ挿入力(zif)試験ソケット - Google Patents
高温両端開放型ゼロ挿入力(zif)試験ソケット Download PDFInfo
- Publication number
- JP4813567B2 JP4813567B2 JP2008550313A JP2008550313A JP4813567B2 JP 4813567 B2 JP4813567 B2 JP 4813567B2 JP 2008550313 A JP2008550313 A JP 2008550313A JP 2008550313 A JP2008550313 A JP 2008550313A JP 4813567 B2 JP4813567 B2 JP 4813567B2
- Authority
- JP
- Japan
- Prior art keywords
- socket
- support frame
- leads
- socket according
- lateral movement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000012360 testing method Methods 0.000 title claims description 31
- 238000003780 insertion Methods 0.000 title claims description 4
- 230000037431 insertion Effects 0.000 title claims description 4
- 239000000919 ceramic Substances 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 5
- 230000009977 dual effect Effects 0.000 claims description 3
- 238000013461 design Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
- H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
- H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S439/00—Electrical connectors
- Y10S439/912—Electrical connectors with testing means
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Connecting Device With Holders (AREA)
- Measuring Leads Or Probes (AREA)
Description
Claims (10)
- 複数のリードが伸びたパッケージ化集積回路素子の試験に用いるソケットであって、
a)集積回路パッケージを受け入れるための第1の部材であって、前記パッケージから伸びるリードを受け入れ、かつ保持するための複数の穴を有する第1の部材と、
b)前記リードと接続するための複数のワイヤ接点を有する第2の部材と、
c)前記第1および第2の部材のための支持フレームと
を備え、
前記第1および第2の部材は、前記第1の部材と前記第2の部材の間での相対的な横移動が可能になるように構成されており、
前記支持フレームは、素子のリードが前記ワイヤに接触しない素子の出し入れ位置から、素子のリードが前記ワイヤに接触する素子試験位置まで、前記第1の部材と前記第2の部材との間の相対的な横移動を可能とするための案内を備え、さらに、前記第1の部材と物理的に係合する第1の部分と、前記第2の部材と物理的に係合する第2の部分と、前記第2の部分に旋回可能に取り付けられて前記第1の部分に接触することで、前記第1の部材と前記第2の部材との間の前記相対的な横移動を可能とする横移動レバーとを備え、
前記支持フレームの前記第1の部分は、2つのレールを備え、前記第1の部材が前記2つのレールに取り付けられており、前記レールには、前記第2の部材を摺動可能に受け入れるための前記案内が形成され、
前記横移動レバーはカム面を有し、前記2つのレールは、前記第1の部材と前記第2の部材との間の相対的な横移動が行われた時に、前記カム面と係合するカム従動子を有するソケット。 - 請求項1に記載のソケットであって、前記第1および第2の部材はセラミックプレートであるソケット。
- 請求項2に記載のソケットであって、前記支持フレームは金属であるソケット。
- 請求項1に記載のソケットであって、前記支持フレームは金属であるソケット。
- 請求項1に記載のソケットであって、前記カム従動子として軸受を備えるソケット。
- 請求項1に記載のソケットであって、前記ソケットの両端は、様々な長さ、および、様々な数のリードを有するパッケージの挿入を可能にするよう開いているソケット。
- 請求項6に記載のソケットであって、複数のパッケージ化素子が挿入可能であるソケット。
- 請求項1に記載のソケットであって、さらに、前記支持フレームの前記第1の部分と前記第2の部分との間に接続されて、前記カム従動子が係合されていない時に、開位置に戻るように、前記フレームの前記第1の部分を付勢するバネを備えるソケット。
- 請求項1に記載のソケットであって、前記第2の部材の前記ワイヤは、前記ソケットを取り付け可能なプリント基板状の電気リードと電気的に接触するよう構成されているソケット。
- 請求項1に記載のソケットであって、前記第1の部材の前記穴は、デュアル・インライン・集積回路パッケージからのリードを受け入れるために、平行な列として配列されているソケット。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/306,797 US7172450B1 (en) | 2006-01-11 | 2006-01-11 | High temperature open ended zero insertion force (ZIF) test socket |
US11/306,797 | 2006-01-11 | ||
PCT/US2006/046798 WO2007081464A2 (en) | 2006-01-11 | 2006-12-06 | High temperature open ended zero insertion force (zif) test socket |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009523307A JP2009523307A (ja) | 2009-06-18 |
JP4813567B2 true JP4813567B2 (ja) | 2011-11-09 |
Family
ID=37696561
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008550313A Active JP4813567B2 (ja) | 2006-01-11 | 2006-12-06 | 高温両端開放型ゼロ挿入力(zif)試験ソケット |
Country Status (9)
Country | Link |
---|---|
US (1) | US7172450B1 (ja) |
EP (1) | EP1972038B1 (ja) |
JP (1) | JP4813567B2 (ja) |
KR (1) | KR101020984B1 (ja) |
CN (1) | CN101356698B (ja) |
IL (1) | IL192714A0 (ja) |
MY (1) | MY145354A (ja) |
TW (1) | TWI318302B (ja) |
WO (1) | WO2007081464A2 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2917031Y (zh) * | 2006-07-11 | 2007-06-27 | 富士康(昆山)电脑接插件有限公司 | 电连接器 |
US7602201B2 (en) * | 2007-06-22 | 2009-10-13 | Qualitau, Inc. | High temperature ceramic socket configured to test packaged semiconductor devices |
JP4921348B2 (ja) * | 2007-12-28 | 2012-04-25 | 矢崎総業株式会社 | 導通検査具の導通ピン保護構造 |
US9804223B2 (en) * | 2009-11-30 | 2017-10-31 | Essai, Inc. | Systems and methods for conforming test tooling to integrated circuit device with heater socket |
CN104022405B (zh) * | 2014-05-28 | 2016-07-06 | 格力电器(合肥)有限公司 | 插座装置 |
JP2017050202A (ja) * | 2015-09-03 | 2017-03-09 | 株式会社エンプラス | 電気部品用ソケット |
JP6653340B2 (ja) * | 2018-02-01 | 2020-02-26 | Jx金属株式会社 | バーンインテストソケット用表面処理金属材料、それを用いたバーンインテストソケット用コネクタ及びバーンインテストソケット |
TWI667484B (zh) * | 2018-08-03 | 2019-08-01 | 矽品精密工業股份有限公司 | 檢測裝置 |
JP2021086807A (ja) * | 2019-11-29 | 2021-06-03 | 株式会社エンプラス | ソケット及び検査用ソケット |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60162391U (ja) * | 1984-04-06 | 1985-10-28 | 日本航空電子工業株式会社 | 分割型軸直角移動コネクタ |
JPH04135189U (ja) * | 1991-04-26 | 1992-12-16 | ミネソタ マイニング アンド マニユフアクチヤリング カンパニー | 低挿入力ソケツト |
JPH07201427A (ja) * | 1993-12-29 | 1995-08-04 | Nec Corp | 電子部品用ソケット |
JP2004227907A (ja) * | 2003-01-22 | 2004-08-12 | Moldec Kk | 集積回路用コネクタ及びコネクタと回路基板との組立体 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4478472A (en) * | 1981-10-26 | 1984-10-23 | Rca Corporation | Electrical connector |
FR2608777B1 (fr) * | 1986-12-23 | 1989-03-24 | Trt Telecom Radio Electr | Dispositif de detection d'intrusion et de reconnaissance de vehicules terrestres |
US4744768A (en) * | 1987-02-10 | 1988-05-17 | Minnesota Mining And Manufacturing Company | Coupling connector |
US5073117A (en) * | 1989-03-30 | 1991-12-17 | Texas Instruments Incorporated | Flip-chip test socket adaptor and method |
US5482471A (en) * | 1993-02-24 | 1996-01-09 | Texas Instruments Incorporated | Socket apparatus for IC package testing |
US6229320B1 (en) * | 1994-11-18 | 2001-05-08 | Fujitsu Limited | IC socket, a test method using the same and an IC socket mounting mechanism |
US5966023A (en) * | 1996-09-16 | 1999-10-12 | Virginia Panel Corporation | Rapid action engagement interface connection system |
US6162066A (en) * | 1997-05-16 | 2000-12-19 | Wells-Cti, Inc. | Socket for positioning and installing an integrated circuit chip on a flexible connector sheet |
TW437037B (en) * | 1998-09-23 | 2001-05-28 | Wells Cti Inc | Vertically actuated bag socket |
TW421333U (en) * | 1999-02-24 | 2001-02-01 | Hung Rung Fang | IC socket |
US6179640B1 (en) | 1999-04-01 | 2001-01-30 | Qualitau, Inc. | High temperature minimal (zero) insertion force socket |
US6722896B2 (en) * | 2001-03-22 | 2004-04-20 | Molex Incorporated | Stitched LGA connector |
JP4615151B2 (ja) * | 2001-06-19 | 2011-01-19 | モレックス インコーポレイテド | 半導体パッケージ用ソケット |
US6565373B2 (en) * | 2001-06-27 | 2003-05-20 | Qualitau, Inc. | ZIF socket and actuator for DIP |
JP3703741B2 (ja) * | 2001-07-04 | 2005-10-05 | 山一電機株式会社 | Icソケット |
US6514097B1 (en) * | 2001-08-01 | 2003-02-04 | Micro Control Company | Test and burn-in socket clamping mechanism |
US6920689B2 (en) * | 2002-12-06 | 2005-07-26 | Formfactor, Inc. | Method for making a socket to perform testing on integrated circuits |
US6811421B1 (en) * | 2003-06-06 | 2004-11-02 | Hon Hai Precision Ind. Co., Ltd | Socket connector with pivoting operating members |
TWM243802U (en) * | 2003-10-16 | 2004-09-11 | Tai Sol Electronics Co Ltd | Conducting wire terminal of all-in one card connector |
JP4098231B2 (ja) * | 2003-12-19 | 2008-06-11 | 山一電機株式会社 | 半導体装置用ソケット |
CN2684418Y (zh) * | 2004-02-16 | 2005-03-09 | 钜航科技股份有限公司 | 集成电路测试用插座 |
US7331820B2 (en) * | 2005-09-19 | 2008-02-19 | Corning Gilbert Inc. | Chemically attached coaxial connector |
-
2006
- 2006-01-11 US US11/306,797 patent/US7172450B1/en active Active
- 2006-12-06 KR KR1020087016023A patent/KR101020984B1/ko active IP Right Grant
- 2006-12-06 CN CN2006800509585A patent/CN101356698B/zh active Active
- 2006-12-06 MY MYPI20082529A patent/MY145354A/en unknown
- 2006-12-06 JP JP2008550313A patent/JP4813567B2/ja active Active
- 2006-12-06 EP EP06844994.1A patent/EP1972038B1/en active Active
- 2006-12-06 WO PCT/US2006/046798 patent/WO2007081464A2/en active Application Filing
- 2006-12-20 TW TW095147961A patent/TWI318302B/zh active
-
2008
- 2008-07-09 IL IL192714A patent/IL192714A0/en unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60162391U (ja) * | 1984-04-06 | 1985-10-28 | 日本航空電子工業株式会社 | 分割型軸直角移動コネクタ |
JPH04135189U (ja) * | 1991-04-26 | 1992-12-16 | ミネソタ マイニング アンド マニユフアクチヤリング カンパニー | 低挿入力ソケツト |
JPH07201427A (ja) * | 1993-12-29 | 1995-08-04 | Nec Corp | 電子部品用ソケット |
JP2004227907A (ja) * | 2003-01-22 | 2004-08-12 | Moldec Kk | 集積回路用コネクタ及びコネクタと回路基板との組立体 |
Also Published As
Publication number | Publication date |
---|---|
WO2007081464A2 (en) | 2007-07-19 |
CN101356698B (zh) | 2012-06-20 |
EP1972038B1 (en) | 2013-09-04 |
EP1972038A2 (en) | 2008-09-24 |
TW200741223A (en) | 2007-11-01 |
MY145354A (en) | 2012-01-31 |
US7172450B1 (en) | 2007-02-06 |
JP2009523307A (ja) | 2009-06-18 |
CN101356698A (zh) | 2009-01-28 |
WO2007081464A3 (en) | 2008-06-26 |
KR101020984B1 (ko) | 2011-03-09 |
TWI318302B (en) | 2009-12-11 |
KR20080081945A (ko) | 2008-09-10 |
EP1972038A4 (en) | 2012-05-30 |
IL192714A0 (en) | 2009-02-11 |
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