JP4812139B2 - マイクロ機械加工されたマイクロフォンおよびマルチセンサ、ならびにそれらを生産する方法 - Google Patents

マイクロ機械加工されたマイクロフォンおよびマルチセンサ、ならびにそれらを生産する方法 Download PDF

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Publication number
JP4812139B2
JP4812139B2 JP2008508951A JP2008508951A JP4812139B2 JP 4812139 B2 JP4812139 B2 JP 4812139B2 JP 2008508951 A JP2008508951 A JP 2008508951A JP 2008508951 A JP2008508951 A JP 2008508951A JP 4812139 B2 JP4812139 B2 JP 4812139B2
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Prior art keywords
polysilicon
layer
microphone
oxide layer
silicon layer
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Expired - Fee Related
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Japanese (ja)
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JP2008539666A (ja
JP2008539666A5 (enExample
Inventor
ジョン アール． マーティン，
ティモシー ジェイ． ブロスニハン，
クレイグ コア，
トーマス ヌナン，
ジェイソン ウェイゴールド，
シン チャン，
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アナログ デバイシス， インコーポレイテッド
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R3/00—Circuits for transducers, loudspeakers or microphones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/00182—Arrangements of deformable or non-deformable structures, e.g. membrane and cavity for use in a transducer
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0235—Accelerometers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
JP2008508951A 2005-04-25 2006-04-21 マイクロ機械加工されたマイクロフォンおよびマルチセンサ、ならびにそれらを生産する方法 Expired - Fee Related JP4812139B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/113,925 US7825484B2 (en) 2005-04-25 2005-04-25 Micromachined microphone and multisensor and method for producing same
US11/113,925 2005-04-25
PCT/US2006/014982 WO2006116017A2 (en) 2005-04-25 2006-04-21 Micromachined microphone and multisensor and method for producing same

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011164611A Division JP5317231B2 (ja) 2005-04-25 2011-07-27 マイクロ機械加工されたマイクロフォンおよびマルチセンサ、ならびにそれらを生産する方法

Publications (3)

Publication Number Publication Date
JP2008539666A JP2008539666A (ja) 2008-11-13
JP2008539666A5 JP2008539666A5 (enExample) 2009-09-10
JP4812139B2 true JP4812139B2 (ja) 2011-11-09

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JP2008508951A Expired - Fee Related JP4812139B2 (ja) 2005-04-25 2006-04-21 マイクロ機械加工されたマイクロフォンおよびマルチセンサ、ならびにそれらを生産する方法
JP2011164611A Expired - Fee Related JP5317231B2 (ja) 2005-04-25 2011-07-27 マイクロ機械加工されたマイクロフォンおよびマルチセンサ、ならびにそれらを生産する方法
JP2013097305A Expired - Fee Related JP5950863B2 (ja) 2005-04-25 2013-05-07 マイクロ機械加工されたマイクロフォンおよびマルチセンサ、ならびにそれらを生産する方法

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JP2011164611A Expired - Fee Related JP5317231B2 (ja) 2005-04-25 2011-07-27 マイクロ機械加工されたマイクロフォンおよびマルチセンサ、ならびにそれらを生産する方法
JP2013097305A Expired - Fee Related JP5950863B2 (ja) 2005-04-25 2013-05-07 マイクロ機械加工されたマイクロフォンおよびマルチセンサ、ならびにそれらを生産する方法

Country Status (5)

Country Link
US (4) US7825484B2 (enExample)
EP (1) EP1878306B1 (enExample)
JP (3) JP4812139B2 (enExample)
CN (2) CN102572662B (enExample)
WO (1) WO2006116017A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014517912A (ja) * 2011-04-14 2014-07-24 ロベルト・ボッシュ・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング アウトオブプレーンスペーサが画成する電極

Families Citing this family (194)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7825484B2 (en) 2005-04-25 2010-11-02 Analog Devices, Inc. Micromachined microphone and multisensor and method for producing same
US7449356B2 (en) 2005-04-25 2008-11-11 Analog Devices, Inc. Process of forming a microphone using support member
US20070071268A1 (en) * 2005-08-16 2007-03-29 Analog Devices, Inc. Packaged microphone with electrically coupled lid
JP4559993B2 (ja) * 2006-03-29 2010-10-13 株式会社東芝 半導体装置の製造方法
US20080083958A1 (en) * 2006-10-05 2008-04-10 Wen-Chieh Wei Micro-electromechanical system package
US20080083957A1 (en) * 2006-10-05 2008-04-10 Wen-Chieh Wei Micro-electromechanical system package
JP2010506532A (ja) * 2006-10-11 2010-02-25 メムス テクノロジー ビーエイチディー 極低圧力センサーおよびその製造方法
EP1931173B1 (en) 2006-12-06 2011-07-20 Electronics and Telecommunications Research Institute Condenser microphone having flexure hinge diaphragm and method of manufacturing the same
US9078068B2 (en) * 2007-06-06 2015-07-07 Invensense, Inc. Microphone with aligned apertures
US8542850B2 (en) 2007-09-12 2013-09-24 Epcos Pte Ltd Miniature microphone assembly with hydrophobic surface coating
JP2009164475A (ja) * 2008-01-09 2009-07-23 Yamaha Corp マイクロフォンパッケージ、リードフレーム、モールド基板及びマイクロフォンパッケージの実装構造
US8327711B2 (en) * 2008-02-20 2012-12-11 Omron Corporation Electrostatic capacitive vibrating sensor
JP5258908B2 (ja) * 2008-03-03 2013-08-07 ティエンシェン・ジョウ モノリシック静電容量トランスデューサ
SG155795A1 (en) * 2008-03-19 2009-10-29 Sensfab Pte Ltd Water resistant ultra-low pressure sensor and method of fabrication of same
DE102008002332B4 (de) * 2008-06-10 2017-02-09 Robert Bosch Gmbh Verfahren zur Herstellung einer mikromechanischen Membranstruktur mit Zugang von der Substratrückseite
US8215151B2 (en) 2008-06-26 2012-07-10 Analog Devices, Inc. MEMS stiction testing apparatus and method
US8351634B2 (en) * 2008-11-26 2013-01-08 Analog Devices, Inc. Side-ported MEMS microphone assembly
KR101065292B1 (ko) * 2008-12-22 2011-09-19 한국전자통신연구원 멤스 마이크로폰 및 그 제조 방법
EP2406964B1 (en) 2009-03-09 2013-04-17 Nxp B.V. Microphone and accelerometer
US8124953B2 (en) 2009-03-12 2012-02-28 Infineon Technologies Ag Sensor device having a porous structure element
US8580596B2 (en) * 2009-04-10 2013-11-12 Nxp, B.V. Front end micro cavity
US8106470B2 (en) * 2009-06-09 2012-01-31 Taiwan Semiconductor Manufacturing Company, Ltd. Triple-axis MEMS accelerometer having a bottom capacitor
US8897470B2 (en) * 2009-07-31 2014-11-25 Macronix International Co., Ltd. Method of fabricating integrated semiconductor device with MOS, NPN BJT, LDMOS, pre-amplifier and MEMS unit
WO2011019702A1 (en) 2009-08-13 2011-02-17 Analog Devices, Inc. Mems in-plane resonators
WO2011025939A1 (en) * 2009-08-28 2011-03-03 Analog Devices, Inc. Dual single-crystal backplate microphone system and method of fabricating same
EP2320678B1 (en) * 2009-10-23 2013-08-14 Nxp B.V. Microphone device with accelerometer for vibration compensation
US8617960B2 (en) * 2009-12-31 2013-12-31 Texas Instruments Incorporated Silicon microphone transducer
TWI468027B (zh) * 2010-02-03 2015-01-01 United Microelectronics Corp 微機電麥克風的製作方法
US8865500B2 (en) * 2010-02-03 2014-10-21 United Microelectronics Corp. Method of fabricating a MEMS microphone with trenches serving as vent pattern
DE102010001711A1 (de) * 2010-02-09 2011-08-11 Robert Bosch GmbH, 70469 Halbleiter-Bauelement und entsprechendes Herstellungsverfahren
CN102036159A (zh) * 2010-04-12 2011-04-27 瑞声声学科技(深圳)有限公司 硅基麦克风制造方法
EP2432249A1 (en) 2010-07-02 2012-03-21 Knowles Electronics Asia PTE. Ltd. Microphone
US9258634B2 (en) 2010-07-30 2016-02-09 Invensense, Inc. Microphone system with offset apertures
US8631700B2 (en) 2010-11-05 2014-01-21 Analog Devices, Inc. Resonating sensor with mechanical constraints
US9091544B2 (en) 2010-11-05 2015-07-28 Analog Devices, Inc. XY-axis shell-type gyroscopes with reduced cross-talk sensitivity and/or mode matching
US8616056B2 (en) 2010-11-05 2013-12-31 Analog Devices, Inc. BAW gyroscope with bottom electrode
EP2646773B1 (en) 2010-12-01 2015-06-24 Analog Devices, Inc. Apparatus and method for anchoring electrodes in mems devices
DE102011002457A1 (de) * 2011-01-05 2012-07-05 Robert Bosch Gmbh Mikromechanische Mikrofoneinrichtung und Verfahren zum Herstellen einer mikromechanischen Mikrofoneinrichtung
US9039976B2 (en) 2011-01-31 2015-05-26 Analog Devices, Inc. MEMS sensors with closed nodal anchors for operation in an in-plane contour mode
US8852984B1 (en) 2011-03-30 2014-10-07 Silicon Laboratories Technique for forming a MEMS device
US8877536B1 (en) * 2011-03-30 2014-11-04 Silicon Laboratories Inc. Technique for forming a MEMS device using island structures
US8647930B2 (en) 2011-04-14 2014-02-11 Robert Bosch Gmbh Wafer with recessed plug
US8580691B2 (en) 2011-04-14 2013-11-12 Robert Bosch Gmbh Method of forming non-planar membranes using CMP
US8906730B2 (en) 2011-04-14 2014-12-09 Robert Bosch Gmbh Method of forming membranes with modified stress characteristics
US8426289B2 (en) 2011-04-14 2013-04-23 Robert Bosch Gmbh Wafer with spacer including horizontal member
US20120288130A1 (en) * 2011-05-11 2012-11-15 Infineon Technologies Ag Microphone Arrangement
CN102164325A (zh) * 2011-05-16 2011-08-24 瑞声声学科技(深圳)有限公司 微型麦克风
KR20140059242A (ko) 2011-08-18 2014-05-15 노우레스 일렉트로닉스, 엘엘시 엠이엠에스 기기들을 위한 민감도 조절 장치 및 방법
KR101267436B1 (ko) 2011-10-28 2013-05-31 앰코 테크놀로지 코리아 주식회사 압력센서용 멤스 디바이스
KR101511946B1 (ko) 2011-11-17 2015-04-14 인벤센스, 인크. 사운드 파이프를 갖춘 마이크로폰 모듈
US8455963B1 (en) 2011-12-02 2013-06-04 Texas Instruments Incorporated Low frequency CMUT with vent holes
GB201120741D0 (en) * 2011-12-02 2012-01-11 Soundchip Sa Transducer
US9329199B2 (en) * 2011-12-06 2016-05-03 Knowles Electronics, Llc MEMS tilt sensor
US8440523B1 (en) * 2011-12-07 2013-05-14 International Business Machines Corporation Micromechanical device and methods to fabricate same using hard mask resistant to structure release etch
JP5914010B2 (ja) * 2012-01-30 2016-05-11 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
US9485560B2 (en) 2012-02-01 2016-11-01 Knowles Electronics, Llc Embedded circuit in a MEMS device
CN102625224B (zh) * 2012-03-31 2015-07-01 歌尔声学股份有限公司 一种电容式硅微麦克风与集成电路单片集成的方法及芯片
US8748999B2 (en) 2012-04-20 2014-06-10 Taiwan Semiconductor Manufacturing Company, Ltd. Capacitive sensors and methods for forming the same
JP2013255974A (ja) * 2012-06-14 2013-12-26 Canon Inc マイクロ構造体及びその製造方法
US9402118B2 (en) 2012-07-27 2016-07-26 Knowles Electronics, Llc Housing and method to control solder creep on housing
US9491539B2 (en) 2012-08-01 2016-11-08 Knowles Electronics, Llc MEMS apparatus disposed on assembly lid
US9078063B2 (en) 2012-08-10 2015-07-07 Knowles Electronics, Llc Microphone assembly with barrier to prevent contaminant infiltration
US9556016B2 (en) 2012-08-20 2017-01-31 Robert Bosch Gmbh Capacitive MEMS sensor and method
US10183857B2 (en) 2012-08-21 2019-01-22 Robert Bosch Gmbh MEMS pressure sensor with multiple membrane electrodes
US10160632B2 (en) 2012-08-21 2018-12-25 Robert Bosch Gmbh System and method for forming a buried lower electrode in conjunction with an encapsulated MEMS device
JP6095308B2 (ja) * 2012-09-25 2017-03-15 株式会社東芝 半導体装置とその製造方法
US9181086B1 (en) 2012-10-01 2015-11-10 The Research Foundation For The State University Of New York Hinged MEMS diaphragm and method of manufacture therof
US8841738B2 (en) 2012-10-01 2014-09-23 Invensense, Inc. MEMS microphone system for harsh environments
JP5649636B2 (ja) * 2012-11-08 2015-01-07 ティエンシェン・ジョウ 静電容量トランスデューサの製造方法
US9226052B2 (en) 2013-01-22 2015-12-29 Invensense, Inc. Microphone system with non-orthogonally mounted microphone die
US8809973B2 (en) 2013-01-23 2014-08-19 Infineon Technologies Ag Chip package comprising a microphone structure and a method of manufacturing the same
US9469522B2 (en) 2013-03-15 2016-10-18 Robert Bosch Gmbh Epi-poly etch stop for out of plane spacer defined electrode
US9467785B2 (en) 2013-03-28 2016-10-11 Knowles Electronics, Llc MEMS apparatus with increased back volume
US9503814B2 (en) 2013-04-10 2016-11-22 Knowles Electronics, Llc Differential outputs in multiple motor MEMS devices
US9301075B2 (en) 2013-04-24 2016-03-29 Knowles Electronics, Llc MEMS microphone with out-gassing openings and method of manufacturing the same
US9711166B2 (en) 2013-05-23 2017-07-18 Knowles Electronics, Llc Decimation synchronization in a microphone
US10028054B2 (en) 2013-10-21 2018-07-17 Knowles Electronics, Llc Apparatus and method for frequency detection
US20180317019A1 (en) 2013-05-23 2018-11-01 Knowles Electronics, Llc Acoustic activity detecting microphone
US9712923B2 (en) 2013-05-23 2017-07-18 Knowles Electronics, Llc VAD detection microphone and method of operating the same
US10020008B2 (en) 2013-05-23 2018-07-10 Knowles Electronics, Llc Microphone and corresponding digital interface
CN104185099A (zh) 2013-05-28 2014-12-03 上海耐普微电子有限公司 微机械麦克风及包含所述微机械麦克风的电子设备
CN103442324B (zh) * 2013-08-22 2017-08-18 上海华虹宏力半导体制造有限公司 背板及其制造方法
US9386370B2 (en) 2013-09-04 2016-07-05 Knowles Electronics, Llc Slew rate control apparatus for digital microphones
US20200322731A1 (en) * 2013-10-17 2020-10-08 Merry Electronics(Shenzhen) Co., Ltd. Acoustic transducer
US9502028B2 (en) 2013-10-18 2016-11-22 Knowles Electronics, Llc Acoustic activity detection apparatus and method
US9147397B2 (en) 2013-10-29 2015-09-29 Knowles Electronics, Llc VAD detection apparatus and method of operating the same
US9709595B2 (en) 2013-11-14 2017-07-18 Analog Devices, Inc. Method and apparatus for detecting linear and rotational movement
US9599471B2 (en) 2013-11-14 2017-03-21 Analog Devices, Inc. Dual use of a ring structure as gyroscope and accelerometer
KR20150058780A (ko) * 2013-11-21 2015-05-29 삼성전기주식회사 마이크로폰 패키지 및 그 실장 구조
US10317211B2 (en) 2013-12-30 2019-06-11 Robert Bosch Gmbh Robust inertial sensors
US10812900B2 (en) * 2014-06-02 2020-10-20 Invensense, Inc. Smart sensor for always-on operation
DE102014108984B4 (de) 2014-06-26 2017-04-06 Tdk Corporation Wandlerelement
US9831844B2 (en) 2014-09-19 2017-11-28 Knowles Electronics, Llc Digital microphone with adjustable gain control
US9554214B2 (en) 2014-10-02 2017-01-24 Knowles Electronics, Llc Signal processing platform in an acoustic capture device
US9743191B2 (en) 2014-10-13 2017-08-22 Knowles Electronics, Llc Acoustic apparatus with diaphragm supported at a discrete number of locations
US10746548B2 (en) 2014-11-04 2020-08-18 Analog Devices, Inc. Ring gyroscope structural features
TWI513981B (zh) * 2014-11-13 2015-12-21 Ind Tech Res Inst 具多重氣密空腔的微機電裝置及其製作方法
US9743167B2 (en) 2014-12-17 2017-08-22 Knowles Electronics, Llc Microphone with soft clipping circuit
WO2016112113A1 (en) 2015-01-07 2016-07-14 Knowles Electronics, Llc Utilizing digital microphones for low power keyword detection and noise suppression
US9830080B2 (en) 2015-01-21 2017-11-28 Knowles Electronics, Llc Low power voice trigger for acoustic apparatus and method
US10121472B2 (en) 2015-02-13 2018-11-06 Knowles Electronics, Llc Audio buffer catch-up apparatus and method with two microphones
US9866938B2 (en) 2015-02-19 2018-01-09 Knowles Electronics, Llc Interface for microphone-to-microphone communications
US9800971B2 (en) 2015-03-17 2017-10-24 Knowles Electronics, Llc Acoustic apparatus with side port
US9869552B2 (en) * 2015-03-20 2018-01-16 Analog Devices, Inc. Gyroscope that compensates for fluctuations in sensitivity
DE102015206863B3 (de) * 2015-04-16 2016-05-25 Robert Bosch Gmbh Verfahren zur Herstellung einer Mikrofonstruktur und einer Drucksensorstruktur im Schichtaufbau eines MEMS-Bauelements
US9762992B2 (en) * 2015-05-08 2017-09-12 Kabushiki Kaisha Audio-Technica Condenser microphone unit, condenser microphone, and method of manufacturing condenser microphone unit
US10291973B2 (en) * 2015-05-14 2019-05-14 Knowles Electronics, Llc Sensor device with ingress protection
WO2016183494A1 (en) 2015-05-14 2016-11-17 Knowles Electronics, Llc Microphone with coined area
KR101731043B1 (ko) * 2015-07-02 2017-04-27 (주)파트론 마이크로폰 패키지
US9478234B1 (en) 2015-07-13 2016-10-25 Knowles Electronics, Llc Microphone apparatus and method with catch-up buffer
US9794661B2 (en) 2015-08-07 2017-10-17 Knowles Electronics, Llc Ingress protection for reducing particle infiltration into acoustic chamber of a MEMS microphone package
US10405106B2 (en) 2015-11-19 2019-09-03 Knowles Electronics, Llc Differential MEMS microphone
WO2017105851A1 (en) 2015-12-18 2017-06-22 Knowles Electronics, Llc Microphone with hydrophobic ingress protection
US9516421B1 (en) 2015-12-18 2016-12-06 Knowles Electronics, Llc Acoustic sensing apparatus and method of manufacturing the same
CN108605181A (zh) 2016-02-01 2018-09-28 美商楼氏电子有限公司 用于偏置mems马达的设备
WO2017136744A1 (en) 2016-02-04 2017-08-10 Knowles Electronics, Llc Microphone and pressure sensor
WO2017136763A1 (en) 2016-02-04 2017-08-10 Knowles Electronics, Llc Differential mems microphone
US20170240418A1 (en) * 2016-02-18 2017-08-24 Knowles Electronics, Llc Low-cost miniature mems vibration sensor
US20170325012A1 (en) * 2016-05-06 2017-11-09 Infineon Technologies Ag Device for detecting acoustic waves
CN109314828B (zh) 2016-05-26 2021-05-11 美商楼氏电子有限公司 具有集成压力传感器的麦克风装置
EP3472829B1 (en) 2016-06-17 2023-08-16 InvenSense, Inc. Piezoelectric micromachined ultrasonic transducers having stress relief features
US11104571B2 (en) 2016-06-24 2021-08-31 Knowles Electronics, Llc Microphone with integrated gas sensor
US10499150B2 (en) 2016-07-05 2019-12-03 Knowles Electronics, Llc Microphone assembly with digital feedback loop
US10206023B2 (en) 2016-07-06 2019-02-12 Knowles Electronics, Llc Transducer package with through-vias
US10153740B2 (en) * 2016-07-11 2018-12-11 Knowles Electronics, Llc Split signal differential MEMS microphone
US9860623B1 (en) 2016-07-13 2018-01-02 Knowles Electronics, Llc Stacked chip microphone
US10257616B2 (en) 2016-07-22 2019-04-09 Knowles Electronics, Llc Digital microphone assembly with improved frequency response and noise characteristics
WO2018022773A1 (en) 2016-07-27 2018-02-01 Knowles Electronics, Llc Microelectromechanical system (mems) device packaging
US10281485B2 (en) 2016-07-29 2019-05-07 Invensense, Inc. Multi-path signal processing for microelectromechanical systems (MEMS) sensors
DE17165245T1 (de) 2016-08-02 2020-12-24 Sonion Nederland B.V. Vibrationssensor mit niederfrequenter dämpfungsreaktionskurve
CN110024281B (zh) 2016-10-28 2024-05-07 三星电子株式会社 换能器组件和方法
US10549985B2 (en) * 2016-11-25 2020-02-04 Infineon Technologies Ag Semiconductor package with a through port for sensor applications
US11142451B2 (en) 2016-12-05 2021-10-12 Knowles Electronics, Llc Ramping of sensor power in a microelectromechanical system device
DE112017006664T5 (de) 2016-12-28 2019-09-26 Knowles Electronics, Llc Mikroelektromechaniksystem-Mikrofon
US10616453B2 (en) * 2017-01-11 2020-04-07 Nokia Technologies Oy Audio and visual system including a mask functioning for a camera module and an audio transducer module
DE102017201481A1 (de) * 2017-01-31 2018-08-02 Robert Bosch Gmbh Mikromechanische Modul und Verfahren zum Erfassen von Schwingungen, insbesondere Körperschall
CN110291718B (zh) 2017-02-14 2023-04-07 美商楼氏电子有限公司 校准麦克风截止频率的系统和方法
EP3855129B1 (en) 2017-03-22 2023-10-25 Knowles Electronics, LLC Interface circuit for a capacitive sensor
US10167191B2 (en) * 2017-04-04 2019-01-01 Kionix, Inc. Method for manufacturing a micro electro-mechanical system
DE112018002672B4 (de) 2017-05-25 2020-09-10 Knowles Electronics, Llc Mikrofongehäuse für vollummantelte asic und drähte und darauf gerichtetes herstellungsverfahren
WO2019005885A1 (en) 2017-06-27 2019-01-03 Knowles Electronics, Llc POST-LINEARIZATION SYSTEM AND METHOD USING A TRACKING SIGNAL
CN110800317B (zh) * 2017-07-26 2021-11-30 美商楼氏电子有限公司 微机电系统电机和麦克风
US10455320B2 (en) 2017-08-02 2019-10-22 Body Beats, Llc System, method and apparatus for translating, converting and/or transforming audio energy into haptic and/or visual representation
DE102017213636A1 (de) * 2017-08-07 2019-02-07 Robert Bosch Gmbh Verfahren zur Herstellung von dünnen MEMS Chips auf SOI Substrat und mikromechanisches Bauelement
DE112018004659T5 (de) 2017-09-08 2020-06-10 Knowles Electronics, Llc Digitale Mikrofon-Rauschdämpfung
US11228845B2 (en) 2017-09-18 2022-01-18 Knowles Electronics, Llc Systems and methods for acoustic hole optimization
CN111133768A (zh) 2017-09-21 2020-05-08 美商楼氏电子有限公司 具有进入保护的麦克风中的提升mems器件
CN111344248A (zh) 2017-11-14 2020-06-26 美商楼氏电子有限公司 具有入口保护的传感器封装件
DE102018203098B3 (de) * 2018-03-01 2019-06-19 Infineon Technologies Ag MEMS-Sensor
DE112019001416T5 (de) 2018-03-21 2021-02-04 Knowles Electronics, Llc Dielektrischer kamm für mems-vorrichtung
WO2019209976A1 (en) 2018-04-26 2019-10-31 Knowles Electronics, Llc Acoustic assembly having an acoustically permeable membrane
WO2019222106A1 (en) 2018-05-18 2019-11-21 Knowles Electronics, Llc Systems and methods for reducing noise in microphones
WO2019246151A1 (en) 2018-06-19 2019-12-26 Knowles Electronics, Llc Transconductance amplifier
DE112019003110T5 (de) 2018-06-19 2021-03-04 Knowles Electronics, Llc Mikrofonanordnung mit reduziertem Rauschen
CN112789239A (zh) 2018-10-05 2021-05-11 美商楼氏电子有限公司 形成包括褶皱的mems振膜的方法
WO2020072920A1 (en) 2018-10-05 2020-04-09 Knowles Electronics, Llc Microphone device with ingress protection
CN112840676B (zh) 2018-10-05 2022-05-03 美商楼氏电子有限公司 响应于声学信号来生成电信号的声学换能器和麦克风组件
US11564041B2 (en) 2018-10-09 2023-01-24 Knowles Electronics, Llc Digital transducer interface scrambling
WO2020083791A1 (en) * 2018-10-23 2020-04-30 Ams Ag Sensors with corrugated diaphragms
CN109327784B (zh) * 2018-12-03 2024-03-29 钰太芯微电子科技（上海）有限公司 一种无边框设备的mems麦克风
US11743647B2 (en) 2018-12-11 2023-08-29 Knowles Electronics, Llc. Multi-rate integrated circuit connectable to a sensor
WO2020154066A1 (en) 2019-01-22 2020-07-30 Knowles Electronics, Llc Leakage current detection from bias voltage supply of mems microphone assembly
US11197104B2 (en) 2019-01-25 2021-12-07 Knowles Electronics, Llc MEMS transducer including free plate diaphragm with spring members
US11656077B2 (en) 2019-01-31 2023-05-23 Analog Devices, Inc. Pseudo-extensional mode MEMS ring gyroscope
CN113383557B (zh) 2019-02-01 2024-04-30 美商楼氏电子有限公司 具有后腔容积通风孔的麦克风组件
EP3694222B1 (en) 2019-02-06 2024-05-15 Knowles Electronics, LLC Sensor arrangement and method
EP3550286B1 (en) 2019-04-17 2021-01-27 Sensirion AG Photoacoustic gas sensor device
US11462478B2 (en) * 2019-05-30 2022-10-04 Taiwan Semiconductor Manufacturing Company Ltd. Layer for buffer semiconductor device including microelectromechnical system (MEMS) device
US12091313B2 (en) 2019-08-26 2024-09-17 The Research Foundation For The State University Of New York Electrodynamically levitated actuator
US11778390B2 (en) 2019-11-07 2023-10-03 Knowles Electronics, Llc. Microphone assembly having a direct current bias circuit
US11634899B2 (en) * 2019-11-07 2023-04-25 Ervin E. Salazar Toilet and bathroom exhaust system
DE202020107185U1 (de) 2019-12-23 2021-01-13 Knowles Electronics, Llc Mikrofonanordnung, die eine Gleichstrom-Vorspannungsschaltung mit tiefer Grabenisolation aufweist
WO2021134688A1 (zh) * 2019-12-31 2021-07-08 瑞声声学科技(深圳)有限公司 一种制作mems驱动器的方法
CN111170267A (zh) * 2019-12-31 2020-05-19 瑞声声学科技(深圳)有限公司 一种制作mems驱动器的方法
US11787690B1 (en) 2020-04-03 2023-10-17 Knowles Electronics, Llc. MEMS assembly substrates including a bond layer
US11240600B1 (en) 2020-11-12 2022-02-01 Knowles Electronics, Llc Sensor assembly and electrical circuit therefor
US11743666B2 (en) 2020-12-30 2023-08-29 Knowles Electronics, Llc. Microphone assembly with transducer sensitivity drift compensation and electrical circuit therefor
US11671775B2 (en) 2020-12-30 2023-06-06 Knowles Electronics, Llc Microphone assembly with transducer sensitivity drift compensation and electrical circuit therefor
US11916575B2 (en) 2020-12-31 2024-02-27 Knowleselectronics, Llc. Digital microphone assembly with improved mismatch shaping
US11909387B2 (en) 2021-03-17 2024-02-20 Knowles Electronics, Llc. Microphone with slew rate controlled buffer
US12240748B2 (en) 2021-03-21 2025-03-04 Knowles Electronics, Llc MEMS die and MEMS-based sensor
US11897762B2 (en) 2021-03-27 2024-02-13 Knowles Electronics, Llc. Digital microphone with over-voltage protection
US11528546B2 (en) 2021-04-05 2022-12-13 Knowles Electronics, Llc Sealed vacuum MEMS die
US11540048B2 (en) 2021-04-16 2022-12-27 Knowles Electronics, Llc Reduced noise MEMS device with force feedback
US11649161B2 (en) 2021-07-26 2023-05-16 Knowles Electronics, Llc Diaphragm assembly with non-uniform pillar distribution
US11772961B2 (en) 2021-08-26 2023-10-03 Knowles Electronics, Llc MEMS device with perimeter barometric relief pierce
US11780726B2 (en) 2021-11-03 2023-10-10 Knowles Electronics, Llc Dual-diaphragm assembly having center constraint
US11826799B2 (en) 2021-11-09 2023-11-28 Joseph McDonnell Drain cleaner apparatus
CN114804008B (zh) * 2022-05-15 2025-08-12 中北大学 单晶硅振膜的mems电容式声传感器结构及制备方法
USD1077989S1 (en) 2022-09-14 2025-06-03 Joseph McDonnell Holster device
US11654462B1 (en) 2022-10-26 2023-05-23 Joseph McDonnell Air conditioning system heat exchanger cleaner apparatus
US12241651B1 (en) 2024-03-26 2025-03-04 Joseph McDonnell Geographic location based control of cleaner dispensing system
US12331867B1 (en) 2024-03-26 2025-06-17 Joey Mac Inventions Llc Adaptor devices, installation guide devices, and methods
US12140337B1 (en) 2024-03-26 2024-11-12 Joseph McDonnell Conduit access adaptor devices and methods

Family Cites Families (109)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1094229A (en) * 1976-11-08 1981-01-20 Henry Guckel Electrostatically deformable thin silicon membranes
SE428081B (sv) 1981-10-07 1983-05-30 Ericsson Telefon Ab L M Tilledningsram for en elektretmikrofon
US4492825A (en) * 1982-07-28 1985-01-08 At&T Bell Laboratories Electroacoustic transducer
US4558184A (en) * 1983-02-24 1985-12-10 At&T Bell Laboratories Integrated capacitive transducer
US4533795A (en) * 1983-07-07 1985-08-06 American Telephone And Telegraph Integrated electroacoustic transducer
US4524247A (en) * 1983-07-07 1985-06-18 At&T Bell Laboratories Integrated electroacoustic transducer with built-in bias
US4996082A (en) * 1985-04-26 1991-02-26 Wisconsin Alumni Research Foundation Sealed cavity semiconductor pressure transducers and method of producing the same
US4744863A (en) * 1985-04-26 1988-05-17 Wisconsin Alumni Research Foundation Sealed cavity semiconductor pressure transducers and method of producing the same
US4853669A (en) * 1985-04-26 1989-08-01 Wisconsin Alumni Research Foundation Sealed cavity semiconductor pressure transducers and method of producing the same
JPH0726887B2 (ja) * 1986-05-31 1995-03-29 株式会社堀場製作所 コンデンサマイクロフオン型検出器用ダイアフラム
US4825335A (en) * 1988-03-14 1989-04-25 Endevco Corporation Differential capacitive transducer and method of making
JP2681207B2 (ja) * 1989-02-01 1997-11-26 株式会社 オーディオテクニカ 静電型電気音響変換器の振動板
US5146435A (en) * 1989-12-04 1992-09-08 The Charles Stark Draper Laboratory, Inc. Acoustic transducer
US5188983A (en) * 1990-04-11 1993-02-23 Wisconsin Alumni Research Foundation Polysilicon resonating beam transducers and method of producing the same
US5090254A (en) * 1990-04-11 1992-02-25 Wisconsin Alumni Research Foundation Polysilicon resonating beam transducers
US5314572A (en) * 1990-08-17 1994-05-24 Analog Devices, Inc. Method for fabricating microstructures
US5113466A (en) * 1991-04-25 1992-05-12 At&T Bell Laboratories Molded optical packaging arrangement
US5178015A (en) * 1991-07-22 1993-01-12 Monolithic Sensors Inc. Silicon-on-silicon differential input sensors
US5490220A (en) * 1992-03-18 1996-02-06 Knowles Electronics, Inc. Solid state condenser and microphone devices
US5317107A (en) * 1992-09-24 1994-05-31 Motorola, Inc. Shielded stripline configuration semiconductor device and method for making the same
US5303210A (en) * 1992-10-29 1994-04-12 The Charles Stark Draper Laboratory, Inc. Integrated resonant cavity acoustic transducer
FR2697675B1 (fr) 1992-11-05 1995-01-06 Suisse Electronique Microtech Procédé de fabrication de transducteurs capacitifs intégrés.
US5258097A (en) * 1992-11-12 1993-11-02 Ford Motor Company Dry-release method for sacrificial layer microstructure fabrication
US5332469A (en) * 1992-11-12 1994-07-26 Ford Motor Company Capacitive surface micromachined differential pressure sensor
JPH06163941A (ja) * 1992-11-24 1994-06-10 Fujikura Ltd 半導体圧力センサ
US5633552A (en) * 1993-06-04 1997-05-27 The Regents Of The University Of California Cantilever pressure transducer
US5393647A (en) * 1993-07-16 1995-02-28 Armand P. Neukermans Method of making superhard tips for micro-probe microscopy and field emission
JPH07111254A (ja) * 1993-10-12 1995-04-25 Sumitomo Electric Ind Ltd 半導体装置の製造方法
US5596222A (en) * 1994-08-12 1997-01-21 The Charles Stark Draper Laboratory, Inc. Wafer of transducer chips
US5452268A (en) * 1994-08-12 1995-09-19 The Charles Stark Draper Laboratory, Inc. Acoustic transducer with improved low frequency response
JPH08240609A (ja) 1995-03-02 1996-09-17 Fuji Electric Co Ltd 静電容量式加速度センサ
US5956292A (en) * 1995-04-13 1999-09-21 The Charles Stark Draper Laboratory, Inc. Monolithic micromachined piezoelectric acoustic transducer and transducer array and method of making same
US5692060A (en) * 1995-05-01 1997-11-25 Knowles Electronics, Inc. Unidirectional microphone
US5632854A (en) * 1995-08-21 1997-05-27 Motorola, Inc. Pressure sensor method of fabrication
IL116536A0 (en) * 1995-12-24 1996-03-31 Harunian Dan Direct integration of sensing mechanisms with single crystal based micro-electric-mechanics systems
DE19600399C1 (de) 1996-01-08 1997-08-21 Siemens Ag Herstellverfahren für ein mikromechanisches Bauteil mit einer beweglichen Struktur
EP0981823A1 (en) * 1996-04-18 2000-03-01 California Institute Of Technology Thin film electret microphone
JPH1062177A (ja) * 1996-08-15 1998-03-06 Murata Mfg Co Ltd 角速度検出装置
US5740261A (en) * 1996-11-21 1998-04-14 Knowles Electronics, Inc. Miniature silicon condenser microphone
DE19648424C1 (de) * 1996-11-22 1998-06-25 Siemens Ag Mikromechanischer Sensor
US5870482A (en) * 1997-02-25 1999-02-09 Knowles Electronics, Inc. Miniature silicon condenser microphone
US5923995A (en) * 1997-04-18 1999-07-13 National Semiconductor Corporation Methods and apparatuses for singulation of microelectromechanical systems
US5939633A (en) * 1997-06-18 1999-08-17 Analog Devices, Inc. Apparatus and method for multi-axis capacitive sensing
DE69736630D1 (de) * 1997-06-19 2006-10-19 St Microelectronics Srl Hermetisch abgeschlossener Sensor mit beweglicher Mikrostruktur
US6122961A (en) * 1997-09-02 2000-09-26 Analog Devices, Inc. Micromachined gyros
US6156585A (en) * 1998-02-02 2000-12-05 Motorola, Inc. Semiconductor component and method of manufacture
US5960093A (en) * 1998-03-30 1999-09-28 Knowles Electronics, Inc. Miniature transducer
AU4317099A (en) * 1998-06-05 1999-12-20 Knowles Electronics, Inc. Solid-state receiver
JP2000022172A (ja) * 1998-06-30 2000-01-21 Matsushita Electric Ind Co Ltd 変換装置及びその製造方法
NL1009544C2 (nl) * 1998-07-02 2000-01-10 Microtronic Nederland Bv Stelsel bestaande uit een microfoon en een voorversterker.
JP2000121473A (ja) * 1998-10-14 2000-04-28 Fuji Electric Co Ltd 静電容量式絶対圧検出器
JP4214584B2 (ja) * 1998-11-27 2009-01-28 株式会社デンソー 半導体力学量センサおよびその製造方法
EP1063866B1 (en) * 1999-05-28 2008-11-26 Texas Instruments Inc. Digital loudspeaker
US6816301B1 (en) * 1999-06-29 2004-11-09 Regents Of The University Of Minnesota Micro-electromechanical devices and methods of manufacture
US6535663B1 (en) * 1999-07-20 2003-03-18 Memlink Ltd. Microelectromechanical device with moving element
US6732588B1 (en) * 1999-09-07 2004-05-11 Sonionmems A/S Pressure transducer
US6522762B1 (en) * 1999-09-07 2003-02-18 Microtronic A/S Silicon-based sensor system
US6829131B1 (en) 1999-09-13 2004-12-07 Carnegie Mellon University MEMS digital-to-acoustic transducer with error cancellation
US6249075B1 (en) * 1999-11-18 2001-06-19 Lucent Technologies Inc. Surface micro-machined acoustic transducers
US6324907B1 (en) 1999-11-29 2001-12-04 Microtronic A/S Flexible substrate transducer assembly
JP3611779B2 (ja) * 1999-12-09 2005-01-19 シャープ株式会社 電気信号−音響信号変換器及びその製造方法並びに電気信号−音響変換装置
US6586841B1 (en) * 2000-02-23 2003-07-01 Onix Microsystems, Inc. Mechanical landing pad formed on the underside of a MEMS device
EP1258167B1 (en) * 2000-02-24 2009-09-30 Knowles Electronics, LLC Acoustic transducer with improved acoustic damper
US6987859B2 (en) * 2001-07-20 2006-01-17 Knowles Electronics, Llc. Raised microstructure of silicon based device
DK1310136T3 (da) * 2000-08-11 2006-07-31 Knowles Electronics Llc Bredbåndsminiaturetransducer
US6535460B2 (en) * 2000-08-11 2003-03-18 Knowles Electronics, Llc Miniature broadband acoustic transducer
EP1312241B1 (en) * 2000-08-24 2004-03-17 Fachhochschule Furtwangen Electrostatic electroacoustical transducer
US7439616B2 (en) * 2000-11-28 2008-10-21 Knowles Electronics, Llc Miniature silicon condenser microphone
US7166910B2 (en) 2000-11-28 2007-01-23 Knowles Electronics Llc Miniature silicon condenser microphone
US7434305B2 (en) * 2000-11-28 2008-10-14 Knowles Electronics, Llc. Method of manufacturing a microphone
US6741709B2 (en) * 2000-12-20 2004-05-25 Shure Incorporated Condenser microphone assembly
GB2386030B (en) * 2000-12-22 2004-08-18 Bruel & Kjaer Sound & Vibratio A micromachined capacitive transducer
GB2386031B (en) 2000-12-22 2004-08-18 Bruel & Kjaer Sound & Vibratio A highly stable micromachined capacitive transducer
US6847090B2 (en) * 2001-01-24 2005-01-25 Knowles Electronics, Llc Silicon capacitive microphone
JP3873630B2 (ja) 2001-01-29 2007-01-24 セイコーエプソン株式会社 コンデンサマイクロホンの製造方法
US6859542B2 (en) * 2001-05-31 2005-02-22 Sonion Lyngby A/S Method of providing a hydrophobic layer and a condenser microphone having such a layer
US6688169B2 (en) * 2001-06-15 2004-02-10 Textron Systems Corporation Systems and methods for sensing an acoustic signal using microelectromechanical systems technology
US6912759B2 (en) * 2001-07-20 2005-07-05 Rosemount Aerospace Inc. Method of manufacturing a thin piezo resistive pressure sensor
JP3794311B2 (ja) * 2001-10-25 2006-07-05 株式会社デンソー 薄膜構造部を有するセンサおよびその製造方法
US7023066B2 (en) 2001-11-20 2006-04-04 Knowles Electronics, Llc. Silicon microphone
US7146016B2 (en) * 2001-11-27 2006-12-05 Center For National Research Initiatives Miniature condenser microphone and fabrication method therefor
JP2003163998A (ja) * 2001-11-27 2003-06-06 Seiko Epson Corp コンデンサマイクロホンの製造方法、コンデンサマイクロホンおよび電子機器
US6677176B2 (en) * 2002-01-18 2004-01-13 The Hong Kong University Of Science And Technology Method of manufacturing an integrated electronic microphone having a floating gate electrode
US6781231B2 (en) 2002-09-10 2004-08-24 Knowles Electronics Llc Microelectromechanical system package with environmental and interference shield
US6667189B1 (en) * 2002-09-13 2003-12-23 Institute Of Microelectronics High performance silicon condenser microphone with perforated single crystal silicon backplate
JP4102158B2 (ja) * 2002-10-24 2008-06-18 富士通株式会社 マイクロ構造体の製造方法
US7142682B2 (en) * 2002-12-20 2006-11-28 Sonion Mems A/S Silicon-based transducer for use in hearing instruments and listening devices
US6883903B2 (en) * 2003-01-21 2005-04-26 Martha A. Truninger Flextensional transducer and method of forming flextensional transducer
US7501703B2 (en) * 2003-02-28 2009-03-10 Knowles Electronics, Llc Acoustic transducer module
US7382048B2 (en) * 2003-02-28 2008-06-03 Knowles Electronics, Llc Acoustic transducer module
JP2005020411A (ja) * 2003-06-26 2005-01-20 Nippon Hoso Kyokai <Nhk> シリコンマイクの作製方法
JP2005039652A (ja) * 2003-07-17 2005-02-10 Hosiden Corp 音響検出機構
CN100515119C (zh) * 2003-08-12 2009-07-15 中国科学院声学研究所 一种用于硅微电容传声器中的芯片及其制备方法
US7075161B2 (en) * 2003-10-23 2006-07-11 Agilent Technologies, Inc. Apparatus and method for making a low capacitance artificial nanopore
JP3103711U (ja) * 2003-10-24 2004-08-19 台湾楼氏電子工業股▼ふん▲有限公司 高効率コンデンサマイクロホン
DE10352001A1 (de) * 2003-11-07 2005-06-09 Robert Bosch Gmbh Mikromechanisches Bauelement mit einer Membran und Verfahren zur Herstellung eines solchen Bauelements
EP1720794A2 (en) 2004-03-01 2006-11-15 Tessera, Inc. Packaged acoustic and electromagnetic transducer chips
US7138694B2 (en) 2004-03-02 2006-11-21 Analog Devices, Inc. Single crystal silicon sensor with additional layer and method of producing the same
DE102004011148B3 (de) 2004-03-08 2005-11-10 Infineon Technologies Ag Mikrophon und Verfahren zum Herstellen eines Mikrophons
JP2005331281A (ja) 2004-05-18 2005-12-02 Hosiden Corp 振動センサ
US7346178B2 (en) * 2004-10-29 2008-03-18 Silicon Matrix Pte. Ltd. Backplateless silicon microphone
US7329933B2 (en) * 2004-10-29 2008-02-12 Silicon Matrix Pte. Ltd. Silicon microphone with softly constrained diaphragm
US7718457B2 (en) 2005-04-05 2010-05-18 Analog Devices, Inc. Method for producing a MEMS device
US7825484B2 (en) 2005-04-25 2010-11-02 Analog Devices, Inc. Micromachined microphone and multisensor and method for producing same
US20060280319A1 (en) * 2005-06-08 2006-12-14 General Mems Corporation Micromachined Capacitive Microphone
US7202552B2 (en) 2005-07-15 2007-04-10 Silicon Matrix Pte. Ltd. MEMS package using flexible substrates, and method thereof
US8130979B2 (en) * 2005-08-23 2012-03-06 Analog Devices, Inc. Noise mitigating microphone system and method
JP2007081614A (ja) * 2005-09-13 2007-03-29 Star Micronics Co Ltd コンデンサマイクロホン
SG131039A1 (en) * 2005-09-14 2007-04-26 Bse Co Ltd Condenser microphone and packaging method for the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014517912A (ja) * 2011-04-14 2014-07-24 ロベルト・ボッシュ・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング アウトオブプレーンスペーサが画成する電極

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US7825484B2 (en) 2010-11-02
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