JP4788932B2 - 相互接続構造を含む能動画素センサ - Google Patents
相互接続構造を含む能動画素センサ Download PDFInfo
- Publication number
- JP4788932B2 JP4788932B2 JP27617399A JP27617399A JP4788932B2 JP 4788932 B2 JP4788932 B2 JP 4788932B2 JP 27617399 A JP27617399 A JP 27617399A JP 27617399 A JP27617399 A JP 27617399A JP 4788932 B2 JP4788932 B2 JP 4788932B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- pixel
- substrate
- interconnect structure
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
- H10F39/026—Wafer-level processing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/93—Interconnections
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/548—Amorphous silicon PV cells
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US174,718 | 1998-10-19 | ||
| US09/174,718 US6018187A (en) | 1998-10-19 | 1998-10-19 | Elevated pin diode active pixel sensor including a unique interconnection structure |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2000133792A JP2000133792A (ja) | 2000-05-12 |
| JP2000133792A5 JP2000133792A5 (enExample) | 2007-01-25 |
| JP4788932B2 true JP4788932B2 (ja) | 2011-10-05 |
Family
ID=22637230
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27617399A Expired - Lifetime JP4788932B2 (ja) | 1998-10-19 | 1999-09-29 | 相互接続構造を含む能動画素センサ |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US6018187A (enExample) |
| EP (1) | EP0996164B1 (enExample) |
| JP (1) | JP4788932B2 (enExample) |
| DE (1) | DE69932132T2 (enExample) |
Families Citing this family (55)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7534254B1 (en) * | 1988-06-13 | 2009-05-19 | Warsaw Orthopedic, Inc. | Threaded frusto-conical interbody spinal fusion implants |
| US6114739A (en) * | 1998-10-19 | 2000-09-05 | Agilent Technologies | Elevated pin diode active pixel sensor which includes a patterned doped semiconductor electrode |
| US6545711B1 (en) * | 1998-11-02 | 2003-04-08 | Agilent Technologies, Inc. | Photo diode pixel sensor array having a guard ring |
| US6384460B1 (en) * | 1999-06-07 | 2002-05-07 | Agilent Technologies, Inc. | Self-aligned metal electrode structure for elevated sensors |
| US6215164B1 (en) * | 1999-07-26 | 2001-04-10 | Agilent Technologies, Inc. | Elevated image sensor array which includes isolation between uniquely shaped image sensors |
| US6229191B1 (en) * | 1999-11-19 | 2001-05-08 | Agilent Technologies, Inc. | Conductive guard rings for elevated active pixel sensors |
| US6396118B1 (en) * | 2000-02-03 | 2002-05-28 | Agilent Technologies, Inc. | Conductive mesh bias connection for an array of elevated active pixel sensors |
| US20040113220A1 (en) * | 2000-12-21 | 2004-06-17 | Peter Rieve | Optoelectronic component for conversion electromagnetic radiation into an intensity-dependent photocurrent |
| US7038242B2 (en) | 2001-02-28 | 2006-05-02 | Agilent Technologies, Inc. | Amorphous semiconductor open base phototransistor array |
| US6649993B2 (en) * | 2001-03-16 | 2003-11-18 | Agilent Technologies, Inc. | Simplified upper electrode contact structure for PIN diode active pixel sensor |
| US7382034B2 (en) * | 2001-05-16 | 2008-06-03 | Stmicroelectronics Nv | Optoelectronic component having a conductive contact structure |
| US6759262B2 (en) | 2001-12-18 | 2004-07-06 | Agilent Technologies, Inc. | Image sensor with pixel isolation system and manufacturing method therefor |
| US7196829B2 (en) * | 2002-01-10 | 2007-03-27 | Micron Technology Inc. | Digital image system and method for combining sensing and image processing on sensor with two-color photo-detector |
| US6730914B2 (en) * | 2002-02-05 | 2004-05-04 | E-Phocus, Inc. | Photoconductor-on-active-pixel (POAP) sensor utilizing equal-potential pixel electrodes |
| US6798033B2 (en) * | 2002-08-27 | 2004-09-28 | E-Phocus, Inc. | Photoconductor-on-active-pixel (POAP) sensor utilizing a multi-layered radiation absorbing structure |
| US6791130B2 (en) * | 2002-08-27 | 2004-09-14 | E-Phocus, Inc. | Photoconductor-on-active-pixel (POAP) sensor utilizing a multi-layered radiation absorbing structure |
| US7411233B2 (en) * | 2002-08-27 | 2008-08-12 | E-Phocus, Inc | Photoconductor-on-active-pixel (POAP) sensor utilizing a multi-layered radiation absorbing structure |
| US6940061B2 (en) * | 2002-02-27 | 2005-09-06 | Agilent Technologies, Inc. | Two-color photo-detector and methods for demosaicing a two-color photo-detector array |
| US7179654B2 (en) * | 2002-03-18 | 2007-02-20 | Agilent Technologies, Inc. | Biochemical assay with programmable array detection |
| FR2841382B1 (fr) * | 2002-06-25 | 2005-01-07 | Commissariat Energie Atomique | Imageur pour lumiere visible |
| WO2004001853A2 (fr) * | 2002-06-25 | 2003-12-31 | Commissariat A L'energie Atomique | Imageur |
| FR2841383B1 (fr) * | 2002-06-25 | 2005-01-07 | Commissariat Energie Atomique | Imageur pour ultraviolet |
| US20040085463A1 (en) * | 2002-11-06 | 2004-05-06 | Manish Sharma | Imaging system with non-volatile memory |
| JP2004343031A (ja) * | 2002-12-03 | 2004-12-02 | Advanced Lcd Technologies Development Center Co Ltd | 誘電体膜およびその形成方法ならびに誘電体膜を用いた半導体装置およびその製造方法 |
| US7566964B2 (en) * | 2003-04-10 | 2009-07-28 | Agere Systems Inc. | Aluminum pad power bus and signal routing for integrated circuit devices utilizing copper technology interconnect structures |
| US7067891B2 (en) * | 2003-11-04 | 2006-06-27 | Taiwan Semiconductor Manufacturing Co., Ltd. | Sensor element having elevated diode with sidewall passivated bottom electrode |
| KR100539253B1 (ko) | 2004-03-10 | 2005-12-27 | 삼성전자주식회사 | 폴리실리콘 콘택 스터드를 갖는 cmos 이미지 디바이스 |
| TWI324332B (en) * | 2004-03-30 | 2010-05-01 | Au Optronics Corp | Display array and display panel |
| US7285796B2 (en) * | 2004-06-02 | 2007-10-23 | Micron Technology, Inc. | Raised photodiode sensor to increase fill factor and quantum efficiency in scaled pixels |
| US7939022B2 (en) * | 2004-08-05 | 2011-05-10 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Integration of colorimetric transducers and detector |
| US7096716B2 (en) | 2004-11-03 | 2006-08-29 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Integration of thermal regulation and electronic fluid sensing |
| US20060138312A1 (en) * | 2004-12-22 | 2006-06-29 | Butterworth Mark M | Solid-state spectrophotomer |
| US20070262296A1 (en) * | 2006-05-11 | 2007-11-15 | Matthias Bauer | Photodetectors employing germanium layers |
| US7777290B2 (en) * | 2006-06-13 | 2010-08-17 | Wisconsin Alumni Research Foundation | PIN diodes for photodetection and high-speed, high-resolution image sensing |
| US7679157B2 (en) * | 2006-08-21 | 2010-03-16 | Powerchip Semiconductor Corp. | Image sensor and fabrication method thereof |
| US7960218B2 (en) * | 2006-09-08 | 2011-06-14 | Wisconsin Alumni Research Foundation | Method for fabricating high-speed thin-film transistors |
| US7482646B2 (en) * | 2006-10-18 | 2009-01-27 | Hejian Technology (Suzhou) Co., Ltd. | Image sensor |
| CN100573850C (zh) * | 2006-11-03 | 2009-12-23 | 力晶半导体股份有限公司 | 图像传感器结构及其制造方法 |
| KR101186296B1 (ko) | 2006-12-01 | 2012-09-27 | 삼성전자주식회사 | 포토 다이오드 및 이를 채용한 이미지센서 |
| KR20080083971A (ko) * | 2007-03-14 | 2008-09-19 | 동부일렉트로닉스 주식회사 | 이미지센서 및 그 제조방법 |
| JP4309928B2 (ja) | 2007-03-15 | 2009-08-05 | アイシン精機株式会社 | 瞼検出装置、瞼検出方法、及び、プログラム |
| KR100894391B1 (ko) * | 2007-06-12 | 2009-04-20 | 주식회사 동부하이텍 | 이미지 센서 및 그 제조방법 |
| KR100922921B1 (ko) * | 2007-12-28 | 2009-10-22 | 주식회사 동부하이텍 | 이미지센서 및 그 제조방법 |
| US8228409B2 (en) * | 2008-10-24 | 2012-07-24 | Dongbu Hitek Co., Ltd. | Image sensor and method for manufacturing the same |
| US8531565B2 (en) | 2009-02-24 | 2013-09-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Front side implanted guard ring structure for backside illuminated image sensor |
| US9142586B2 (en) | 2009-02-24 | 2015-09-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Pad design for backside illuminated image sensor |
| JP2011071482A (ja) * | 2009-08-28 | 2011-04-07 | Fujifilm Corp | 固体撮像装置,固体撮像装置の製造方法,デジタルスチルカメラ,デジタルビデオカメラ,携帯電話,内視鏡 |
| US20120217498A1 (en) * | 2009-09-01 | 2012-08-30 | Rohm Co., Ltd. | Photoelectric converter and method for manufacturing the same |
| WO2014002367A1 (ja) | 2012-06-25 | 2014-01-03 | パナソニック株式会社 | 固体撮像装置 |
| US10094988B2 (en) * | 2012-08-31 | 2018-10-09 | Micron Technology, Inc. | Method of forming photonics structures |
| JP5728451B2 (ja) * | 2012-09-19 | 2015-06-03 | 富士フイルム株式会社 | 有機固体撮像素子およびその製造方法 |
| KR102282493B1 (ko) * | 2014-08-12 | 2021-07-26 | 삼성전자주식회사 | 이미지 센서 및 이를 포함하는 전자 장치 |
| JP2016096233A (ja) * | 2014-11-14 | 2016-05-26 | ソニー株式会社 | 固体撮像素子、製造方法、および電子装置 |
| US10254417B2 (en) * | 2015-11-19 | 2019-04-09 | Shimadzu Corporation | Semiconductor detector |
| WO2019131134A1 (ja) | 2017-12-28 | 2019-07-04 | ソニーセミコンダクタソリューションズ株式会社 | 受光素子および電子機器 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60171A (ja) * | 1984-05-30 | 1985-01-05 | Hitachi Ltd | 固体撮像素子 |
| JPS61296762A (ja) * | 1985-06-26 | 1986-12-27 | Toshiba Corp | 固体撮像装置 |
| JPS6218755A (ja) * | 1985-07-18 | 1987-01-27 | Toshiba Corp | 固体撮像装置 |
| JPH02128468A (ja) * | 1988-11-08 | 1990-05-16 | Fujitsu Ltd | 固体撮像装置及びその製造方法 |
| US5182624A (en) * | 1990-08-08 | 1993-01-26 | Minnesota Mining And Manufacturing Company | Solid state electromagnetic radiation detector fet array |
| JPH07118527B2 (ja) * | 1990-10-18 | 1995-12-18 | 富士ゼロックス株式会社 | イメージセンサの製造方法 |
| JP2765635B2 (ja) * | 1991-01-11 | 1998-06-18 | キヤノン株式会社 | 光電変換装置 |
| JPH04261071A (ja) * | 1991-01-11 | 1992-09-17 | Canon Inc | 光電変換装置 |
| GB9202693D0 (en) * | 1992-02-08 | 1992-03-25 | Philips Electronics Uk Ltd | A method of manufacturing a large area active matrix array |
| JPH06204450A (ja) * | 1992-12-28 | 1994-07-22 | Toshiba Corp | 固体撮像装置 |
| JPH07115184A (ja) * | 1993-08-24 | 1995-05-02 | Canon Inc | 積層型固体撮像装置及びその製造方法 |
| JP3579194B2 (ja) * | 1996-09-17 | 2004-10-20 | 株式会社東芝 | 固体撮像装置の駆動方法 |
-
1998
- 1998-10-19 US US09/174,718 patent/US6018187A/en not_active Expired - Lifetime
-
1999
- 1999-09-29 JP JP27617399A patent/JP4788932B2/ja not_active Expired - Lifetime
- 1999-09-30 EP EP99307737A patent/EP0996164B1/en not_active Expired - Lifetime
- 1999-09-30 DE DE69932132T patent/DE69932132T2/de not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| DE69932132T2 (de) | 2007-01-04 |
| EP0996164A2 (en) | 2000-04-26 |
| DE69932132D1 (de) | 2006-08-10 |
| EP0996164A3 (en) | 2000-05-24 |
| EP0996164B1 (en) | 2006-06-28 |
| US6018187A (en) | 2000-01-25 |
| JP2000133792A (ja) | 2000-05-12 |
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