JP4784945B2 - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法 Download PDF

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Publication number
JP4784945B2
JP4784945B2 JP2008297133A JP2008297133A JP4784945B2 JP 4784945 B2 JP4784945 B2 JP 4784945B2 JP 2008297133 A JP2008297133 A JP 2008297133A JP 2008297133 A JP2008297133 A JP 2008297133A JP 4784945 B2 JP4784945 B2 JP 4784945B2
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JP
Japan
Prior art keywords
island
element mounting
semiconductor device
resin
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008297133A
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English (en)
Japanese (ja)
Other versions
JP2009065201A5 (https=
JP2009065201A (ja
Inventor
治雄 兵藤
孝行 谷
隆生 渋谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
On Semiconductor Trading Ltd
Original Assignee
On Semiconductor Trading Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by On Semiconductor Trading Ltd filed Critical On Semiconductor Trading Ltd
Priority to JP2008297133A priority Critical patent/JP4784945B2/ja
Publication of JP2009065201A publication Critical patent/JP2009065201A/ja
Publication of JP2009065201A5 publication Critical patent/JP2009065201A5/ja
Application granted granted Critical
Publication of JP4784945B2 publication Critical patent/JP4784945B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP2008297133A 2008-11-20 2008-11-20 半導体装置の製造方法 Expired - Fee Related JP4784945B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008297133A JP4784945B2 (ja) 2008-11-20 2008-11-20 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008297133A JP4784945B2 (ja) 2008-11-20 2008-11-20 半導体装置の製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2006243624A Division JP4383436B2 (ja) 2006-09-08 2006-09-08 半導体装置

Publications (3)

Publication Number Publication Date
JP2009065201A JP2009065201A (ja) 2009-03-26
JP2009065201A5 JP2009065201A5 (https=) 2010-10-14
JP4784945B2 true JP4784945B2 (ja) 2011-10-05

Family

ID=40559433

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008297133A Expired - Fee Related JP4784945B2 (ja) 2008-11-20 2008-11-20 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP4784945B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6744149B2 (ja) * 2016-06-20 2020-08-19 ローム株式会社 半導体装置およびその製造方法
JP7268988B2 (ja) * 2018-11-08 2023-05-08 新光電気工業株式会社 電子部品及び電子部品の製造方法
CN116313940B (zh) * 2023-05-18 2023-08-11 上海聚跃检测技术有限公司 一种引线键合结构的切割方法及切割辅助装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6022822B2 (ja) * 1979-06-13 1985-06-04 日本電気株式会社 リ−ドフレ−ム
JPS62150868A (ja) * 1985-12-25 1987-07-04 Hitachi Micro Comput Eng Ltd 半導体装置用リ−ドフレ−ムとそれを使用する樹脂封止方法
JPH04129233A (ja) * 1990-09-19 1992-04-30 Fujitsu Ltd 半導体ｈブリッジ回路
JP3304705B2 (ja) * 1995-09-19 2002-07-22 セイコーエプソン株式会社 チップキャリアの製造方法
JP3261965B2 (ja) * 1996-02-21 2002-03-04 富士電機株式会社 半導体装置
JP3209696B2 (ja) * 1996-03-07 2001-09-17 松下電器産業株式会社 電子部品の製造方法

Also Published As

Publication number Publication date
JP2009065201A (ja) 2009-03-26

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