JP4776792B2 - 発光装置および電気器具 - Google Patents
発光装置および電気器具 Download PDFInfo
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- JP4776792B2 JP4776792B2 JP2001053361A JP2001053361A JP4776792B2 JP 4776792 B2 JP4776792 B2 JP 4776792B2 JP 2001053361 A JP2001053361 A JP 2001053361A JP 2001053361 A JP2001053361 A JP 2001053361A JP 4776792 B2 JP4776792 B2 JP 4776792B2
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- 238000007789 sealing Methods 0.000 description 1
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- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
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- 229910021341 titanium silicide Inorganic materials 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
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- ODHXBMXNKOYIBV-UHFFFAOYSA-N triphenylamine Chemical class C1=CC=CC=C1N(C=1C=CC=CC=1)C1=CC=CC=C1 ODHXBMXNKOYIBV-UHFFFAOYSA-N 0.000 description 1
- WQJQOUPTWCFRMM-UHFFFAOYSA-N tungsten disilicide Chemical compound [Si]#[W]#[Si] WQJQOUPTWCFRMM-UHFFFAOYSA-N 0.000 description 1
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- 239000012808 vapor phase Substances 0.000 description 1
Images
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- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Thin Film Transistor (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001053361A JP4776792B2 (ja) | 2000-02-28 | 2001-02-28 | 発光装置および電気器具 |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000-50584 | 2000-02-28 | ||
| JP2000050584 | 2000-02-28 | ||
| JP2000050584 | 2000-02-28 | ||
| JP2001053361A JP4776792B2 (ja) | 2000-02-28 | 2001-02-28 | 発光装置および電気器具 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001318628A JP2001318628A (ja) | 2001-11-16 |
| JP2001318628A5 JP2001318628A5 (enExample) | 2008-04-10 |
| JP4776792B2 true JP4776792B2 (ja) | 2011-09-21 |
Family
ID=26586176
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001053361A Expired - Lifetime JP4776792B2 (ja) | 2000-02-28 | 2001-02-28 | 発光装置および電気器具 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4776792B2 (enExample) |
Families Citing this family (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100637433B1 (ko) | 2004-05-24 | 2006-10-20 | 삼성에스디아이 주식회사 | 발광 표시 장치 |
| US7483001B2 (en) * | 2001-11-21 | 2009-01-27 | Seiko Epson Corporation | Active matrix substrate, electro-optical device, and electronic device |
| JP3939666B2 (ja) * | 2002-01-18 | 2007-07-04 | 株式会社半導体エネルギー研究所 | 発光装置及び電子機器 |
| JP4490403B2 (ja) * | 2002-01-18 | 2010-06-23 | 株式会社半導体エネルギー研究所 | 発光装置 |
| CN101673508B (zh) * | 2002-01-18 | 2013-01-09 | 株式会社半导体能源研究所 | 发光器件 |
| JP3706107B2 (ja) * | 2002-01-18 | 2005-10-12 | 株式会社半導体エネルギー研究所 | 発光装置及び電子機器 |
| JP3818261B2 (ja) * | 2002-01-24 | 2006-09-06 | セイコーエプソン株式会社 | 発光装置及び電子機器 |
| JP2003255858A (ja) * | 2002-02-28 | 2003-09-10 | Sanyo Electric Co Ltd | 表示装置 |
| US7230592B2 (en) | 2002-03-04 | 2007-06-12 | Hitachi, Ltd. | Organic electroluminescent light emitting display device |
| JP3989761B2 (ja) * | 2002-04-09 | 2007-10-10 | 株式会社半導体エネルギー研究所 | 半導体表示装置 |
| US7038239B2 (en) | 2002-04-09 | 2006-05-02 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor element and display device using the same |
| JP4463493B2 (ja) | 2002-04-15 | 2010-05-19 | 株式会社半導体エネルギー研究所 | 表示装置及びその作製方法 |
| JP3989763B2 (ja) | 2002-04-15 | 2007-10-10 | 株式会社半導体エネルギー研究所 | 半導体表示装置 |
| JP2003330388A (ja) * | 2002-05-15 | 2003-11-19 | Semiconductor Energy Lab Co Ltd | 半導体装置及びその作製方法 |
| US7256421B2 (en) | 2002-05-17 | 2007-08-14 | Semiconductor Energy Laboratory, Co., Ltd. | Display device having a structure for preventing the deterioration of a light emitting device |
| JP4640690B2 (ja) | 2002-07-24 | 2011-03-02 | 日本電気株式会社 | アクティブマトリクス有機el表示装置の製造方法 |
| KR100768972B1 (ko) | 2002-11-25 | 2007-10-22 | 도시바 마쯔시따 디스플레이 테크놀로지 컴퍼니, 리미티드 | 유기 el 표시 패널 |
| US8937580B2 (en) * | 2003-08-08 | 2015-01-20 | Semiconductor Energy Laboratory Co., Ltd. | Driving method of light emitting device and light emitting device |
| JP4287337B2 (ja) * | 2003-11-24 | 2009-07-01 | 三星モバイルディスプレイ株式會社 | 有機電界発光表示装置及びその製造方法 |
| KR100684825B1 (ko) * | 2003-11-24 | 2007-02-20 | 삼성에스디아이 주식회사 | 유기 전계발광 표시 장치 및 그 제조 방법 |
| KR100612392B1 (ko) | 2004-10-13 | 2006-08-16 | 삼성에스디아이 주식회사 | 발광 표시 장치 및 발광 표시 패널 |
| KR100688801B1 (ko) | 2004-11-22 | 2007-03-02 | 삼성에스디아이 주식회사 | 델타 화소회로 및 발광 표시장치 |
| KR100688802B1 (ko) | 2004-11-22 | 2007-03-02 | 삼성에스디아이 주식회사 | 화소 및 발광 표시장치 |
| JP5177962B2 (ja) * | 2005-05-20 | 2013-04-10 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US7705346B2 (en) * | 2005-06-06 | 2010-04-27 | Xerox Corporation | Barrier layer for an organic electronic device |
| KR101324756B1 (ko) | 2005-10-18 | 2013-11-05 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시장치 및 그의 구동방법 |
| JP4661557B2 (ja) * | 2005-11-30 | 2011-03-30 | セイコーエプソン株式会社 | 発光装置および電子機器 |
| KR101433680B1 (ko) * | 2005-12-02 | 2014-08-25 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치, 디스플레이 장치, 및 전자 장치 |
| JP5250960B2 (ja) * | 2006-01-24 | 2013-07-31 | セイコーエプソン株式会社 | 発光装置および電子機器 |
| KR20070092455A (ko) | 2006-03-10 | 2007-09-13 | 삼성전자주식회사 | 표시 장치 및 그 제조 방법 |
| JP5026019B2 (ja) * | 2006-08-08 | 2012-09-12 | 三菱電機株式会社 | 薄膜トランジスタ基板、薄膜トランジスタの製造方法、及び表示装置 |
| US20100224878A1 (en) | 2009-03-05 | 2010-09-09 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JP6122275B2 (ja) * | 2011-11-11 | 2017-04-26 | 株式会社半導体エネルギー研究所 | 表示装置 |
| JP6056175B2 (ja) * | 2012-04-03 | 2017-01-11 | セイコーエプソン株式会社 | 電気光学装置及び電子機器 |
| US9905585B2 (en) * | 2012-12-25 | 2018-02-27 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device comprising capacitor |
| KR102479472B1 (ko) * | 2013-04-15 | 2022-12-19 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 장치 |
| JP5979272B2 (ja) * | 2015-04-07 | 2016-08-24 | セイコーエプソン株式会社 | 発光装置および電子機器 |
| JP6702492B2 (ja) * | 2019-09-02 | 2020-06-03 | セイコーエプソン株式会社 | 電気光学装置及び電子機器 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04313729A (ja) * | 1991-04-09 | 1992-11-05 | Mitsubishi Electric Corp | 液晶表示装置 |
| US5550066A (en) * | 1994-12-14 | 1996-08-27 | Eastman Kodak Company | Method of fabricating a TFT-EL pixel |
| JP3383535B2 (ja) * | 1995-12-14 | 2003-03-04 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JPH1027913A (ja) * | 1996-07-09 | 1998-01-27 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
| JPH11231805A (ja) * | 1998-02-10 | 1999-08-27 | Sanyo Electric Co Ltd | 表示装置 |
| DE69925216T2 (de) * | 1998-03-12 | 2005-10-06 | Seiko Epson Corp. | Aktivmatrix-lichtemittierende vorrichtung und herstellungsverfahren |
| JP3807096B2 (ja) * | 1998-05-15 | 2006-08-09 | セイコーエプソン株式会社 | アクティブマトリクス基板及びこれを備えた電気光学パネル |
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