JP4775993B2 - 半導体素子封止剤、半導体装置および半導体装置の実装方法 - Google Patents

半導体素子封止剤、半導体装置および半導体装置の実装方法 Download PDF

Info

Publication number
JP4775993B2
JP4775993B2 JP2004105620A JP2004105620A JP4775993B2 JP 4775993 B2 JP4775993 B2 JP 4775993B2 JP 2004105620 A JP2004105620 A JP 2004105620A JP 2004105620 A JP2004105620 A JP 2004105620A JP 4775993 B2 JP4775993 B2 JP 4775993B2
Authority
JP
Japan
Prior art keywords
semiconductor element
semiconductor device
component
group
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004105620A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005294437A5 (enExample
JP2005294437A (ja
Inventor
実 一色
博司 江南
好次 森田
勝利 峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Priority to JP2004105620A priority Critical patent/JP4775993B2/ja
Publication of JP2005294437A publication Critical patent/JP2005294437A/ja
Publication of JP2005294437A5 publication Critical patent/JP2005294437A5/ja
Application granted granted Critical
Publication of JP4775993B2 publication Critical patent/JP4775993B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H01L2924/15155—Shape the die mounting substrate comprising a recess for hosting the device the shape of the recess being other than a cuboid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
    • H01L2924/15321—Connection portion the connection portion being formed on the die mounting surface of the substrate being a ball array, e.g. BGA

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2004105620A 2004-03-31 2004-03-31 半導体素子封止剤、半導体装置および半導体装置の実装方法 Expired - Fee Related JP4775993B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004105620A JP4775993B2 (ja) 2004-03-31 2004-03-31 半導体素子封止剤、半導体装置および半導体装置の実装方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004105620A JP4775993B2 (ja) 2004-03-31 2004-03-31 半導体素子封止剤、半導体装置および半導体装置の実装方法

Publications (3)

Publication Number Publication Date
JP2005294437A JP2005294437A (ja) 2005-10-20
JP2005294437A5 JP2005294437A5 (enExample) 2007-05-24
JP4775993B2 true JP4775993B2 (ja) 2011-09-21

Family

ID=35327052

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004105620A Expired - Fee Related JP4775993B2 (ja) 2004-03-31 2004-03-31 半導体素子封止剤、半導体装置および半導体装置の実装方法

Country Status (1)

Country Link
JP (1) JP4775993B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5259947B2 (ja) * 2006-11-24 2013-08-07 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 半導体封止用シリコーン組成物および半導体装置
JP5014774B2 (ja) * 2006-12-26 2012-08-29 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 付加反応硬化型シリコーン組成物および半導体装置
JP5552958B2 (ja) * 2010-08-17 2014-07-16 Ｔｄｋ株式会社 端子構造、プリント配線板、モジュール基板及び電子デバイス
JP6524879B2 (ja) * 2015-10-13 2019-06-05 信越化学工業株式会社 付加一液硬化型熱伝導性シリコーングリース組成物
JP2021075655A (ja) * 2019-11-12 2021-05-20 信越化学工業株式会社 導電性シリコーン組成物、導電性シリコーン硬化物、導電性シリコーン硬化物の製造方法、及び導電性シリコーン積層体
US20240002605A1 (en) * 2020-06-30 2024-01-04 Dow Toray Co., Ltd. Curable organopolysiloxane composition and use therefor

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3207929B2 (ja) * 1992-07-16 2001-09-10 東レ・ダウコーニング・シリコーン株式会社 半導体素子被覆剤および半導体装置
JPH11199677A (ja) * 1997-11-12 1999-07-27 Kanegafuchi Chem Ind Co Ltd 硬化性組成物及びそれを用いた成形体の作製方法
JP2001089662A (ja) * 1999-09-22 2001-04-03 Kanegafuchi Chem Ind Co Ltd 硬化性組成物及びそれを用いた成形体の作製方法
JP4889867B2 (ja) * 2001-03-13 2012-03-07 株式会社カネカ 末端にアルケニル基を有するビニル系重合体の製造方法、ビニル系重合体および硬化性組成物
JP3865639B2 (ja) * 2002-01-28 2007-01-10 信越化学工業株式会社 半導体封止用シリコーン組成物および半導体装置

Also Published As

Publication number Publication date
JP2005294437A (ja) 2005-10-20

Similar Documents

Publication Publication Date Title
US6235862B1 (en) Adhesive silicone sheet, method for the preparation thereof and semiconductor devices
EP0757080B1 (en) Curable organosiloxane compositions and semiconductor devices
CN1328770C (zh) 半导体封装件及其制备方法
KR101313671B1 (ko) 반도체 소자 및 이의 제조방법
TWI621664B (zh) 半導體裝置及半導體元件密封用硬化性聚矽氧組合物
EP2582214B1 (en) Method for Forming Conductive Circuit
JP2010001336A (ja) 硬化性オルガノポリシロキサン組成物及び半導体装置
JP6356581B2 (ja) 半導体装置の製造方法
JPH11181289A (ja) 硬化性シリコーン組成物および電子部品
JP4839041B2 (ja) 絶縁性液状ダイボンディング剤および半導体装置
EP2305755B1 (en) Resin composition
EP3587498B1 (en) Curable organopolysiloxane composition and semiconductor device
KR20010049725A (ko) 접착제 및 반도체 장치
JP3207929B2 (ja) 半導体素子被覆剤および半導体装置
JP4775993B2 (ja) 半導体素子封止剤、半導体装置および半導体装置の実装方法
JP4393817B2 (ja) 熱伝導性充填剤、熱伝導性シリコーンエラストマー組成物および半導体装置
JP3691587B2 (ja) 硬化性オルガノポリシロキサン組成物および半導体装置
JP2015053426A (ja) 支持基材付封止材、封止後半導体素子搭載基板、半導体装置、及び半導体装置の製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070327

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070327

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20090511

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090609

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090730

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20091020

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100120

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20100301

A912 Re-examination (zenchi) completed and case transferred to appeal board

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20100326

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110627

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140708

Year of fee payment: 3

LAPS Cancellation because of no payment of annual fees