JP4771714B2 - パターン検査装置および方法 - Google Patents
パターン検査装置および方法 Download PDFInfo
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- JP4771714B2 JP4771714B2 JP2005039871A JP2005039871A JP4771714B2 JP 4771714 B2 JP4771714 B2 JP 4771714B2 JP 2005039871 A JP2005039871 A JP 2005039871A JP 2005039871 A JP2005039871 A JP 2005039871A JP 4771714 B2 JP4771714 B2 JP 4771714B2
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- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Image Processing (AREA)
- Image Analysis (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005039871A JP4771714B2 (ja) | 2004-02-23 | 2005-02-16 | パターン検査装置および方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004047098 | 2004-02-23 | ||
| JP2004047098 | 2004-02-23 | ||
| JP2005039871A JP4771714B2 (ja) | 2004-02-23 | 2005-02-16 | パターン検査装置および方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010188301A Division JP4827269B2 (ja) | 2004-02-23 | 2010-08-25 | パターン検査装置および方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005277395A JP2005277395A (ja) | 2005-10-06 |
| JP2005277395A5 JP2005277395A5 (enrdf_load_stackoverflow) | 2008-03-27 |
| JP4771714B2 true JP4771714B2 (ja) | 2011-09-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005039871A Expired - Fee Related JP4771714B2 (ja) | 2004-02-23 | 2005-02-16 | パターン検査装置および方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4771714B2 (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10103071B2 (en) | 2016-11-04 | 2018-10-16 | Samsung Electronics Co., Ltd. | Pattern inspection methods and methods of fabricating reticles using the same via directing charged particle beams through discharge layers |
| US11468555B2 (en) | 2018-03-30 | 2022-10-11 | Tasmit, Inc. | Method and apparatus for generating a correction line indicating relationship between deviation of an edge of a wafer pattern from an edge of a reference pattern and space width of the reference pattern, and a computer-readable recording medium |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4787673B2 (ja) * | 2005-05-19 | 2011-10-05 | 株式会社Ｎｇｒ | パターン検査装置および方法 |
| JP4824987B2 (ja) * | 2005-10-28 | 2011-11-30 | 株式会社日立ハイテクノロジーズ | パターンマッチング装置およびそれを用いた半導体検査システム |
| KR101682838B1 (ko) * | 2005-11-18 | 2016-12-12 | 케이엘에이-텐코 코포레이션 | 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템 |
| JP5196723B2 (ja) * | 2005-12-14 | 2013-05-15 | 株式会社ジャパンディスプレイウェスト | 欠陥修正装置及び欠陥修正方法 |
| JP5058489B2 (ja) | 2006-01-25 | 2012-10-24 | 株式会社荏原製作所 | 試料表面検査装置及び検査方法 |
| JP4851253B2 (ja) * | 2006-07-05 | 2012-01-11 | 株式会社ニューフレアテクノロジー | 描画装置、及び描画装置におけるエラー検出方法 |
| JP5010207B2 (ja) | 2006-08-14 | 2012-08-29 | 株式会社日立ハイテクノロジーズ | パターン検査装置及び半導体検査システム |
| JP4909729B2 (ja) * | 2006-12-13 | 2012-04-04 | 株式会社東芝 | 検査データ作成方法および検査方法 |
| JP5153212B2 (ja) | 2007-06-07 | 2013-02-27 | 株式会社日立ハイテクノロジーズ | 荷電粒子線装置 |
| JP5321775B2 (ja) | 2007-07-30 | 2013-10-23 | 株式会社東芝 | パターン検査方法およびパターン検査装置 |
| JP4659004B2 (ja) | 2007-08-10 | 2011-03-30 | 株式会社日立ハイテクノロジーズ | 回路パターン検査方法、及び回路パターン検査システム |
| JP5075646B2 (ja) | 2008-01-09 | 2012-11-21 | 株式会社日立ハイテクノロジーズ | 半導体欠陥検査装置ならびにその方法 |
| JP5065943B2 (ja) | 2008-02-29 | 2012-11-07 | 株式会社日立ハイテクノロジーズ | 製造プロセスモニタリングシステム |
| JP2009252959A (ja) | 2008-04-04 | 2009-10-29 | Toshiba Corp | パターン検査装置、パターン検査方法および半導体装置の製造方法 |
| JP5114302B2 (ja) | 2008-06-12 | 2013-01-09 | 株式会社日立ハイテクノロジーズ | パターン検査方法，パターン検査装置及びパターン処理装置 |
| US20120092482A1 (en) * | 2009-04-03 | 2012-04-19 | Shinichi Shinoda | Method and device for creating composite image |
| JP5400882B2 (ja) | 2009-06-30 | 2014-01-29 | 株式会社日立ハイテクノロジーズ | 半導体検査装置及びそれを用いた半導体検査方法 |
| JP5010701B2 (ja) * | 2010-03-17 | 2012-08-29 | 株式会社ニューフレアテクノロジー | 検査装置および検査方法 |
| JP5254270B2 (ja) | 2010-04-09 | 2013-08-07 | 株式会社ニューフレアテクノロジー | 検査方法および検査装置 |
| JP5604208B2 (ja) * | 2010-07-28 | 2014-10-08 | 株式会社日立ハイテクノロジーズ | 欠陥検出装置及びコンピュータプログラム |
| JP5603720B2 (ja) * | 2010-09-13 | 2014-10-08 | 新日本工機株式会社 | 検査画像の生成方法、それを用いた画像検査方法、並びに外観検査装置 |
| JP7188870B2 (ja) * | 2017-05-31 | 2022-12-13 | 株式会社キーエンス | 画像検査装置 |
| US10957033B2 (en) * | 2017-07-10 | 2021-03-23 | Kla-Tencor Corporation | Repeater defect detection |
| JP7042118B2 (ja) * | 2018-03-08 | 2022-03-25 | 株式会社東芝 | 検査装置、検査方法、及びプログラム |
| JP7157580B2 (ja) * | 2018-07-19 | 2022-10-20 | 東京エレクトロン株式会社 | 基板検査方法及び基板検査装置 |
| JP7237872B2 (ja) | 2020-02-14 | 2023-03-13 | 株式会社東芝 | 検査装置、検査方法、及びプログラム |
| JP7273748B2 (ja) | 2020-02-28 | 2023-05-15 | 株式会社東芝 | 検査装置、検査方法、及びプログラム |
| JP7627101B2 (ja) * | 2020-10-06 | 2025-02-05 | 東レエンジニアリング株式会社 | 外観検査装置および方法 |
| CN113096119B (zh) * | 2021-04-30 | 2024-06-07 | 上海众壹云计算科技有限公司 | 晶圆缺陷分类的方法、装置、电子设备以及存储介质 |
| KR102844222B1 (ko) * | 2021-12-02 | 2025-08-07 | 세메스 주식회사 | 반도체 소자 검사 장치 및 이를 이용한 반도체 소자 검사 방법 |
| CN118658046B (zh) * | 2024-08-19 | 2024-10-29 | 安徽高哲信息技术有限公司 | 多视角谷物图像处理方法、存储介质和电子设备 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6408219B2 (en) * | 1998-05-11 | 2002-06-18 | Applied Materials, Inc. | FAB yield enhancement system |
| JP3524853B2 (ja) * | 1999-08-26 | 2004-05-10 | 株式会社ナノジオメトリ研究所 | パターン検査装置、パターン検査方法および記録媒体 |
| JP2002310929A (ja) * | 2001-04-13 | 2002-10-23 | Mitsubishi Electric Corp | 欠陥検査装置 |
| JP3870052B2 (ja) * | 2001-09-20 | 2007-01-17 | 株式会社日立製作所 | 半導体装置の製造方法及び欠陥検査データ処理方法 |
-
2005
- 2005-02-16 JP JP2005039871A patent/JP4771714B2/ja not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10103071B2 (en) | 2016-11-04 | 2018-10-16 | Samsung Electronics Co., Ltd. | Pattern inspection methods and methods of fabricating reticles using the same via directing charged particle beams through discharge layers |
| US11468555B2 (en) | 2018-03-30 | 2022-10-11 | Tasmit, Inc. | Method and apparatus for generating a correction line indicating relationship between deviation of an edge of a wafer pattern from an edge of a reference pattern and space width of the reference pattern, and a computer-readable recording medium |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2005277395A (ja) | 2005-10-06 |
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