JP4753516B2 - 放射線イメージャ用構造及び、放射線イメージャを製造する方法 - Google Patents

放射線イメージャ用構造及び、放射線イメージャを製造する方法 Download PDF

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JP4753516B2
JP4753516B2 JP2001535232A JP2001535232A JP4753516B2 JP 4753516 B2 JP4753516 B2 JP 4753516B2 JP 2001535232 A JP2001535232 A JP 2001535232A JP 2001535232 A JP2001535232 A JP 2001535232A JP 4753516 B2 JP4753516 B2 JP 4753516B2
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layer
contact
conductive metal
light
dielectric layer
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JP2001535232A
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Japanese (ja)
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JP2003513472A (ja
JP2003513472A5 (https=
Inventor
ポッシン，ジョージ・エドワード
クワスニック，ロバート・フォレスト
ウェイ，チン−イェウ
アルバグリ，ダグラス
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General Electric Co
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General Electric Co
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • H10F39/189—X-ray, gamma-ray or corpuscular radiation imagers
    • H10F39/1898—Indirect radiation image sensors, e.g. using luminescent members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/803—Pixels having integrated switching, control, storage or amplification elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/805—Coatings
    • H10F39/8057—Optical shielding

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  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Thin Film Transistor (AREA)
JP2001535232A 1999-11-02 2000-10-19 放射線イメージャ用構造及び、放射線イメージャを製造する方法 Expired - Lifetime JP4753516B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US16304399P 1999-11-02 1999-11-02
US60/163,043 1999-11-02
US09/643,228 2000-08-22
US09/643,228 US6396046B1 (en) 1999-11-02 2000-08-22 Imager with reduced FET photoresponse and high integrity contact via
PCT/US2000/028905 WO2001033634A1 (en) 1999-11-02 2000-10-19 Imager with reduced fet photoresponse and high integrity contact via

Publications (3)

Publication Number Publication Date
JP2003513472A JP2003513472A (ja) 2003-04-08
JP2003513472A5 JP2003513472A5 (https=) 2007-12-06
JP4753516B2 true JP4753516B2 (ja) 2011-08-24

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JP2001535232A Expired - Lifetime JP4753516B2 (ja) 1999-11-02 2000-10-19 放射線イメージャ用構造及び、放射線イメージャを製造する方法

Country Status (5)

Country Link
US (1) US6396046B1 (https=)
EP (1) EP1145322B1 (https=)
JP (1) JP4753516B2 (https=)
DE (1) DE60033913T2 (https=)
WO (1) WO2001033634A1 (https=)

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US7148487B2 (en) * 2002-08-27 2006-12-12 Canon Kabushiki Kaisha Image sensing apparatus and method using radiation
KR100956338B1 (ko) * 2002-12-11 2010-05-06 삼성전자주식회사 Ｘ-ｒａｙ 검출기용 박막 트랜지스터 어레이 기판
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US7453129B2 (en) 2002-12-18 2008-11-18 Noble Peak Vision Corp. Image sensor comprising isolated germanium photodetectors integrated with a silicon substrate and silicon circuitry
EP1746638A3 (en) * 2002-12-18 2011-03-23 Noble Peak Vision Corp. Semiconductor devices with reduced active region defectcs and unique contacting schemes
US20040146138A1 (en) * 2003-01-23 2004-07-29 Motorola, Inc. Large flat panel gallium arsenide arrays on silicon substrate for low dose X-ray digital imaging
US7473903B2 (en) 2003-02-12 2009-01-06 General Electric Company Method and apparatus for deposited hermetic cover for digital X-ray panel
FR2854497B1 (fr) * 2003-04-29 2005-09-02 Commissariat Energie Atomique Procede de realisation d'un dispositif semi-conducteur a metallisations auto-alignees
US7081628B2 (en) * 2003-11-10 2006-07-25 Ge Medical Systems Global Technology Company, Llc Spatially patterned light-blocking layers for radiation imaging detectors
US8053777B2 (en) * 2005-03-31 2011-11-08 General Electric Company Thin film transistors for imaging system and method of making the same
WO2007025485A1 (fr) * 2005-09-01 2007-03-08 Dezheng Tang Detecteur de rayons x et procede de fabrication du detecteur
US8139680B2 (en) 2007-01-12 2012-03-20 General Dynamics C4 Systems, Inc. Signal acquisition methods and apparatus in wireless communication systems
US7907679B2 (en) 2007-01-12 2011-03-15 General Dynamics C4 Systems, Inc. Methods and systems for acquiring signals using coherent match filtering
GB0701076D0 (en) * 2007-01-19 2007-02-28 E2V Tech Uk Ltd Imaging apparatus
TWI347680B (en) * 2007-09-28 2011-08-21 Prime View Int Co Ltd A photo sensor and a method for manufacturing thereof
TWI347682B (en) * 2007-09-28 2011-08-21 Prime View Int Co Ltd A photo sensor and a method for manufacturing thereof
TWI415283B (zh) * 2009-02-18 2013-11-11 Au Optronics Corp Ｘ射線感測器及其製作方法
JP2010245080A (ja) * 2009-04-01 2010-10-28 Epson Imaging Devices Corp 光電変換装置、エックス線撮像装置
JP2010245079A (ja) * 2009-04-01 2010-10-28 Epson Imaging Devices Corp 光電変換装置、エックス線撮像装置
JP2012079820A (ja) * 2010-09-30 2012-04-19 Canon Inc 検出装置及び放射線検出システム
JP5730062B2 (ja) * 2011-02-21 2015-06-03 株式会社ジャパンディスプレイ 表示装置
US9018588B2 (en) 2011-12-30 2015-04-28 Saint-Gobain Ceramics & Plastics, Inc. Radiation detection apparatuses including optical coupling material, and processes of forming the same
KR101965259B1 (ko) * 2012-07-27 2019-08-08 삼성디스플레이 주식회사 엑스선 검출기
TWI505476B (zh) 2012-12-27 2015-10-21 E Ink Holdings Inc 薄膜電晶體結構
US20160013243A1 (en) * 2014-03-10 2016-01-14 Dpix, Llc Photosensor arrays for detection of radiation and process for the preparation thereof
US9786856B2 (en) 2015-08-20 2017-10-10 Dpix, Llc Method of manufacturing an image sensor device
US10261310B2 (en) * 2016-06-27 2019-04-16 Amazon Technologies, Inc. Amorphous silicon layer as optical filter for thin film transistor channel
US9929215B2 (en) 2016-07-12 2018-03-27 Dpix, Llc Method of optimizing an interface for processing of an organic semiconductor
CN109863599B (zh) 2016-11-30 2024-06-18 纽约州州立大学研究基金会 混合有源矩阵平板检测器系统和方法
US10162462B2 (en) 2017-05-01 2018-12-25 Synaptics Incorporated Integrating capacitive sensing with an optical sensor
KR102302593B1 (ko) * 2017-07-13 2021-09-15 삼성전자주식회사 발광 소자, 이를 포함하는 패키지, 및 이의 제조 방법
CA3071647A1 (en) 2017-08-03 2019-02-07 The Research Foundation For The State University Of New York Dual-screen digital radiography with asymmetric reflective screens
CN112542486A (zh) * 2019-09-20 2021-03-23 创王光电股份有限公司 显示设备
CN115172397B (zh) * 2022-01-19 2025-05-30 友达光电股份有限公司 感测装置
US20250060492A1 (en) 2023-08-16 2025-02-20 GE Precision Healthcare LLC Shielded X-Ray Detector with Improved Image Quality Stability

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JPH0786632A (ja) * 1993-09-17 1995-03-31 Fuji Xerox Co Ltd 薄膜素子及び薄膜素子の製造方法
JPH1093063A (ja) * 1996-09-11 1998-04-10 Toshiba Corp 光検出器
JPH1093062A (ja) * 1996-09-11 1998-04-10 Toshiba Corp 光検出器
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JPH10214955A (ja) * 1996-12-23 1998-08-11 General Electric Co <Ge> 放射撮像装置用のコンタクト・パッド

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Publication number Priority date Publication date Assignee Title
JPH0786632A (ja) * 1993-09-17 1995-03-31 Fuji Xerox Co Ltd 薄膜素子及び薄膜素子の製造方法
JPH1093063A (ja) * 1996-09-11 1998-04-10 Toshiba Corp 光検出器
JPH1093062A (ja) * 1996-09-11 1998-04-10 Toshiba Corp 光検出器
JPH10214955A (ja) * 1996-12-23 1998-08-11 General Electric Co <Ge> 放射撮像装置用のコンタクト・パッド
WO1998032173A1 (en) * 1997-01-17 1998-07-23 General Electric Company Corrosion resistant imager

Also Published As

Publication number Publication date
JP2003513472A (ja) 2003-04-08
EP1145322B1 (en) 2007-03-14
US6396046B1 (en) 2002-05-28
WO2001033634A1 (en) 2001-05-10
EP1145322A1 (en) 2001-10-17
DE60033913T2 (de) 2007-12-06
DE60033913D1 (de) 2007-04-26

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