JP4746852B2 - 伝送ケーブルの製造方法 - Google Patents

伝送ケーブルの製造方法 Download PDF

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Publication number
JP4746852B2
JP4746852B2 JP2004194981A JP2004194981A JP4746852B2 JP 4746852 B2 JP4746852 B2 JP 4746852B2 JP 2004194981 A JP2004194981 A JP 2004194981A JP 2004194981 A JP2004194981 A JP 2004194981A JP 4746852 B2 JP4746852 B2 JP 4746852B2
Authority
JP
Japan
Prior art keywords
copper foil
transmission cable
bump
etching
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004194981A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006019108A (ja
Inventor
和好 小林
賢一郎 花村
智充 堀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Sony Chemical and Information Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2004194981A priority Critical patent/JP4746852B2/ja
Application filed by Sony Chemical and Information Device Corp filed Critical Sony Chemical and Information Device Corp
Priority to KR1020067027783A priority patent/KR20070036086A/ko
Priority to PCT/JP2005/000145 priority patent/WO2006003732A1/ja
Priority to EP05709233A priority patent/EP1775737A4/en
Priority to CN2005800223051A priority patent/CN1981349B/zh
Priority to TW094101228A priority patent/TW200601958A/zh
Publication of JP2006019108A publication Critical patent/JP2006019108A/ja
Priority to US11/619,039 priority patent/US7429702B2/en
Priority to US12/111,317 priority patent/US7745731B2/en
Application granted granted Critical
Publication of JP4746852B2 publication Critical patent/JP4746852B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B11/00—Communication cables or conductors
    • H01B11/02—Cables with twisted pairs or quads
    • H01B11/06—Cables with twisted pairs or quads with means for reducing effects of electromagnetic or electrostatic disturbances, e.g. screens
    • H01B11/08—Screens specially adapted for reducing cross-talk
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/22—Sheathing; Armouring; Screening; Applying other protective layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4647—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer around previously made via studs

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Insulated Conductors (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP2004194981A 2004-06-30 2004-06-30 伝送ケーブルの製造方法 Expired - Fee Related JP4746852B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2004194981A JP4746852B2 (ja) 2004-06-30 2004-06-30 伝送ケーブルの製造方法
PCT/JP2005/000145 WO2006003732A1 (ja) 2004-06-30 2005-01-07 伝送ケーブル及びその製造方法
EP05709233A EP1775737A4 (en) 2004-06-30 2005-01-07 TRANSFER CABLE AND PROCESS FOR ITS MANUFACTURE
CN2005800223051A CN1981349B (zh) 2004-06-30 2005-01-07 传输电缆的制造方法
KR1020067027783A KR20070036086A (ko) 2004-06-30 2005-01-07 전송 케이블 및 그 제조 방법
TW094101228A TW200601958A (en) 2004-06-30 2005-01-14 Cable and manufacturing method thereof
US11/619,039 US7429702B2 (en) 2004-06-30 2007-01-02 Transmission cable and method for manufacturing the same
US12/111,317 US7745731B2 (en) 2004-06-30 2008-04-29 Transmission cable

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004194981A JP4746852B2 (ja) 2004-06-30 2004-06-30 伝送ケーブルの製造方法

Publications (2)

Publication Number Publication Date
JP2006019108A JP2006019108A (ja) 2006-01-19
JP4746852B2 true JP4746852B2 (ja) 2011-08-10

Family

ID=35782547

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004194981A Expired - Fee Related JP4746852B2 (ja) 2004-06-30 2004-06-30 伝送ケーブルの製造方法

Country Status (7)

Country Link
US (2) US7429702B2 (enExample)
EP (1) EP1775737A4 (enExample)
JP (1) JP4746852B2 (enExample)
KR (1) KR20070036086A (enExample)
CN (1) CN1981349B (enExample)
TW (1) TW200601958A (enExample)
WO (1) WO2006003732A1 (enExample)

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* Cited by examiner, † Cited by third party
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US20110036615A1 (en) * 2004-12-01 2011-02-17 Molex Incorporated Flexible flat circuitry
JP2007193999A (ja) * 2006-01-17 2007-08-02 Sony Chemical & Information Device Corp 伝送ケーブル
JP2011018873A (ja) * 2009-05-22 2011-01-27 Sony Ericsson Mobilecommunications Japan Inc 電磁シールド方法および電磁シールド用フィルム
EP2339894A1 (de) * 2009-12-22 2011-06-29 Saint-Gobain Glass France Scheibe mit elektrischem Anschlusselement
TWM395240U (en) * 2010-05-28 2010-12-21 Tennrich Internat Crop Flexible flat cable
JP5610953B2 (ja) * 2010-09-24 2014-10-22 キヤノン株式会社 プリント配線板及びプリント回路板
CN102098868A (zh) * 2010-12-24 2011-06-15 鸿富锦精密工业（深圳）有限公司 电路板
US10485095B2 (en) 2011-03-10 2019-11-19 Mediatek, Inc. Printed circuit board design for high speed application
US9949360B2 (en) * 2011-03-10 2018-04-17 Mediatek Inc. Printed circuit board design for high speed application
CN103974564B (zh) * 2013-01-24 2018-11-06 北大方正集团有限公司 Pcb同轴电缆的制作方法及pcb同轴电缆
CN104103392A (zh) * 2013-04-10 2014-10-15 珠海扬智电子科技有限公司 排阻器
ES2538426A1 (es) * 2013-11-29 2015-06-19 Texas Controls Sl Sistema de comprobación para uniones atornilladas en el sector eólico
US9992859B2 (en) 2015-09-25 2018-06-05 Intel Corporation Low loss and low cross talk transmission lines using shaped vias
TWI576019B (zh) * 2015-11-27 2017-03-21 中原大學 印刷電路板
KR102552614B1 (ko) * 2016-02-26 2023-07-06 주식회사 기가레인 연성회로기판
EP3626034B1 (en) * 2017-05-16 2026-02-11 Rigetti & Co, LLC Connecting electrical circuitry in a quantum computing system
TWM555550U (zh) * 2017-09-29 2018-02-11 Bellwether Electronic Corp 長直高頻傳輸電纜
KR102039225B1 (ko) 2017-11-16 2019-10-31 서울과학기술대학교 산학협력단 노트북 컴퓨터 냉각 받침대
KR102147336B1 (ko) * 2018-01-23 2020-08-24 동우 화인켐 주식회사 필름 안테나-회로 연결 구조체 및 이를 포함하는 디스플레이 장치
CN110859022A (zh) * 2018-08-24 2020-03-03 三赢科技（深圳）有限公司 电路板及应用该电路板的电子装置
WO2020092334A2 (en) * 2018-10-29 2020-05-07 Cellink Corporation Flexible hybrid interconnect circuits
US10779402B1 (en) * 2019-05-03 2020-09-15 Intel Corporation Noise sensitive trace 3D ground-shielding crosstalk mitigation
JP2021163866A (ja) * 2020-03-31 2021-10-11 太陽誘電株式会社 高周波通信モジュール
CN111653384B (zh) * 2020-06-22 2025-10-28 东莞市晟合科技有限公司 一种高速传输ffc
CN114822962A (zh) * 2021-04-21 2022-07-29 凡甲科技股份有限公司 数据传输线缆
JP7715010B2 (ja) * 2021-11-02 2025-07-30 新光電気工業株式会社 配線基板及びその製造方法、半導体装置
CN119521521A (zh) * 2023-08-22 2025-02-25 宏启胜精密电子(秦皇岛)有限公司 电路板及其制造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4845311A (en) * 1988-07-21 1989-07-04 Hughes Aircraft Company Flexible coaxial cable apparatus and method
JPH0799397A (ja) * 1993-09-29 1995-04-11 Toshiba Corp プリント板構造
JP3687041B2 (ja) * 1997-04-16 2005-08-24 大日本印刷株式会社 配線基板、配線基板の製造方法、および半導体パッケージ
JP3522513B2 (ja) * 1997-11-26 2004-04-26 山一電機株式会社 フラット型ケーブルおよびその製造方法
KR100700235B1 (ko) * 1998-09-10 2007-03-26 지멘스 악티엔게젤샤프트 다극성 플러그-인 커넥터를 가진 인쇄회로기판
JP3760731B2 (ja) * 2000-07-11 2006-03-29 ソニーケミカル株式会社 バンプ付き配線回路基板及びその製造方法
JP3564053B2 (ja) * 2000-10-06 2004-09-08 キヤノン株式会社 フレキシブルケーブル
US6459041B1 (en) * 2000-11-01 2002-10-01 Visteon Global Technologies, Inc. Etched tri-layer metal bonding layer
US6943447B2 (en) * 2002-01-10 2005-09-13 Fujitsu Limited Thin film multi-layer wiring substrate having a coaxial wiring structure in at least one layer

Also Published As

Publication number Publication date
TWI340013B (enExample) 2011-04-01
US20080230254A1 (en) 2008-09-25
US7745731B2 (en) 2010-06-29
US20070120231A1 (en) 2007-05-31
WO2006003732A1 (ja) 2006-01-12
CN1981349A (zh) 2007-06-13
KR20070036086A (ko) 2007-04-02
JP2006019108A (ja) 2006-01-19
EP1775737A4 (en) 2008-08-13
US7429702B2 (en) 2008-09-30
TW200601958A (en) 2006-01-01
CN1981349B (zh) 2011-03-16
EP1775737A1 (en) 2007-04-18

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