JP4736901B2 - 導電性ペースト組成物およびプリント配線板 - Google Patents

導電性ペースト組成物およびプリント配線板 Download PDF

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Publication number
JP4736901B2
JP4736901B2 JP2006097825A JP2006097825A JP4736901B2 JP 4736901 B2 JP4736901 B2 JP 4736901B2 JP 2006097825 A JP2006097825 A JP 2006097825A JP 2006097825 A JP2006097825 A JP 2006097825A JP 4736901 B2 JP4736901 B2 JP 4736901B2
Authority
JP
Japan
Prior art keywords
conductive paste
paste composition
bump
conductive
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006097825A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007273271A (ja
Inventor
海 勉 内
島 正 幸 長
林 勝 小
金 弘 之 白
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP2006097825A priority Critical patent/JP4736901B2/ja
Priority to TW096108761A priority patent/TW200809877A/zh
Priority to KR1020070029642A priority patent/KR100894663B1/ko
Priority to CN2007100913166A priority patent/CN101047049B/zh
Priority to US11/693,779 priority patent/US7416687B2/en
Publication of JP2007273271A publication Critical patent/JP2007273271A/ja
Application granted granted Critical
Publication of JP4736901B2 publication Critical patent/JP4736901B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2006097825A 2006-03-31 2006-03-31 導電性ペースト組成物およびプリント配線板 Expired - Fee Related JP4736901B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2006097825A JP4736901B2 (ja) 2006-03-31 2006-03-31 導電性ペースト組成物およびプリント配線板
TW096108761A TW200809877A (en) 2006-03-31 2007-03-14 Conductive paste composition and printed wiring board
KR1020070029642A KR100894663B1 (ko) 2006-03-31 2007-03-27 도전성 페이스트 조성물 및 프린트 배선판
CN2007100913166A CN101047049B (zh) 2006-03-31 2007-03-29 导电性膏组合物和印刷电路板
US11/693,779 US7416687B2 (en) 2006-03-31 2007-03-30 Electroconductive paste composition and printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006097825A JP4736901B2 (ja) 2006-03-31 2006-03-31 導電性ペースト組成物およびプリント配線板

Publications (2)

Publication Number Publication Date
JP2007273271A JP2007273271A (ja) 2007-10-18
JP4736901B2 true JP4736901B2 (ja) 2011-07-27

Family

ID=38557465

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006097825A Expired - Fee Related JP4736901B2 (ja) 2006-03-31 2006-03-31 導電性ペースト組成物およびプリント配線板

Country Status (5)

Country Link
US (1) US7416687B2 (enExample)
JP (1) JP4736901B2 (enExample)
KR (1) KR100894663B1 (enExample)
CN (1) CN101047049B (enExample)
TW (1) TW200809877A (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100956074B1 (ko) * 2007-12-06 2010-05-07 제일모직주식회사 범프 형성용 페이스트 조성물
KR100954537B1 (ko) * 2007-12-11 2010-04-23 엘지전자 주식회사 이방성 도전필름 및 이를 포함하는 디스플레이 장치
JP5446131B2 (ja) * 2008-05-28 2014-03-19 株式会社リコー スクリーン版及び複数の個別電極の形成方法
JP5492191B2 (ja) 2009-03-30 2014-05-14 株式会社トクヤマ メタライズド基板を製造する方法、メタライズド基板
KR20130002980A (ko) * 2010-03-02 2013-01-08 가부시끼가이샤 도꾸야마 메탈라이즈드 기판의 제조 방법
CN102248823A (zh) * 2011-05-13 2011-11-23 昆山鼎鑫电子有限公司 一种铝板大尺寸印刷工艺
CN106604794A (zh) * 2014-09-12 2017-04-26 住友金属矿山株式会社 银包覆铜粉及使用银包覆铜粉的导电膏、导电涂料、导电片
CN107848314B (zh) * 2015-07-22 2020-06-16 信越化学工业株式会社 丝网印刷机、丝网印刷方法及太阳能电池的电极形成方法
JP6705046B1 (ja) * 2019-12-12 2020-06-03 株式会社ノリタケカンパニーリミテド 低温成形用導電性組成物および導電膜付き基板

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4765929A (en) * 1986-08-29 1988-08-23 Gte Products Corporation Silk-screenable circuit paste
JP3167840B2 (ja) 1993-04-16 2001-05-21 株式会社東芝 印刷配線板および印刷配線板の製造方法
JP3588400B2 (ja) 1996-04-18 2004-11-10 ナミックス株式会社 導電性樹脂組成物および導電体の形成方法
JPH09286924A (ja) 1996-04-18 1997-11-04 Namitsukusu Kk 導電体の形成方法
JPH10312712A (ja) * 1997-05-14 1998-11-24 Asahi Chem Ind Co Ltd はんだ付け可能な導電性ペースト
JPH11306860A (ja) * 1998-04-15 1999-11-05 Sumitomo Metal Mining Co Ltd 積層セラミックコンデンサ内部電極用ペースト組成物
US6083426A (en) * 1998-06-12 2000-07-04 Matsushita Electric Industrial Co., Ltd. Conductive paste
JP2000067646A (ja) * 1998-06-12 2000-03-03 Matsushita Electric Ind Co Ltd 導電性ペ―スト
JP4491534B2 (ja) 1999-06-29 2010-06-30 ナミックス株式会社 電極ペースト組成物およびそれを用いる積層コンデンサの製造方法
JP4572023B2 (ja) 2000-07-11 2010-10-27 株式会社槌屋 着色導電ペーストおよびそれを用いる導電積層体とその製造方法
JP2002270033A (ja) 2001-03-07 2002-09-20 Mitsui Chemicals Inc 導電性ペースト組成物及びプリント配線板
JP4365053B2 (ja) 2001-09-04 2009-11-18 大日本印刷株式会社 導電性ペースト組成物及びプリント配線板
JP5066779B2 (ja) * 2001-09-28 2012-11-07 日立化成工業株式会社 導電性ペースト及び回路接続方法
JP2003331648A (ja) 2002-05-10 2003-11-21 Tsuchiya Co Ltd 導電ペースト及び電気回路の製造方法
JP4532840B2 (ja) 2003-03-04 2010-08-25 新潟県 金属ペースト
JP4396134B2 (ja) 2003-05-09 2010-01-13 藤倉化成株式会社 導電性銅ペースト組成物

Also Published As

Publication number Publication date
JP2007273271A (ja) 2007-10-18
KR100894663B1 (ko) 2009-04-24
US20070228336A1 (en) 2007-10-04
TW200809877A (en) 2008-02-16
KR20070098574A (ko) 2007-10-05
US7416687B2 (en) 2008-08-26
CN101047049B (zh) 2011-09-21
TWI374453B (enExample) 2012-10-11
CN101047049A (zh) 2007-10-03

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