JP4731849B2 - 半導体集積回路の製造方法 - Google Patents
半導体集積回路の製造方法 Download PDFInfo
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- JP4731849B2 JP4731849B2 JP2004210699A JP2004210699A JP4731849B2 JP 4731849 B2 JP4731849 B2 JP 4731849B2 JP 2004210699 A JP2004210699 A JP 2004210699A JP 2004210699 A JP2004210699 A JP 2004210699A JP 4731849 B2 JP4731849 B2 JP 4731849B2
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- JP
- Japan
- Prior art keywords
- semiconductor layer
- forming
- mosfet
- mosfets
- transistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8221—Three dimensional integrated circuits stacked in different levels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0688—Integrated circuits having a three-dimensional layout
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
- Y10S257/903—FET configuration adapted for use as static memory cell
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Thin Film Transistor (AREA)
Description
複数の半導体集積回路A、B、C、及びD、並びにプログラマブルスイッチマトリックス(以下、「PSM」という。)を備える。複数の半導体集積回路A、B、C、及びDは、それぞれ特定の機能を実現し、PSMは、プログラマブル回路を所望の構成に切り換えるべく、複数の半導体集積回路A、B、C、及びDにそれぞれ接続された信号線の間をスイッチングする。
202 入力信号線
204 出力信号線
206 多層MOSFET
300 半導体集積回路
302 入出力信号線
306 多層MOSFET
400 第1半導体層
404 MOSFET
406 MOSFET
408 第2半導体層
410 MOSFET
412 MOSFET
414 配線層
416 配線
500 第1半導体層
504 MOSFET
506 MOSFET
508 第2半導体層
510 MOSFET
512 MOSFET
514 配線層
516 金属配線
518 配線層
520 金属配線
522 第3半導体層
524 MOSFET
526 MOSFET
528 配線層
530 配線
601〜608 信号線
701〜728 MOSFET
801〜807 スルーホール
Claims (8)
- 多層構造で構成される半導体集積回路の製造方法であって、
第1半導体層に第1半導体層トランジスタを形成する段階と、
前記第1半導体層上に配線層を形成する段階と、
前記配線層上に第2半導体層を堆積する段階と、
前記第2半導体層に第2半導体層トランジスタを形成する段階と
を備え、
前記第1半導体層トランジスタを形成する段階は、
前記第1半導体層トランジスタに第1ソース電極及び第1ドレイン電極を形成する段階と、
前記第1半導体層トランジスタに熱酸化によりゲート絶縁膜を形成する段階とを有し、
前記第2半導体層トランジスタを形成する段階は、
前記第2半導体層トランジスタに第2ソース電極及び第2ドレイン電極を形成する段階と、
前記第2半導体層トランジスタにラジカル酸化又はラジカル窒化によりゲート絶縁膜を形成する段階と、
を有する半導体集積回路の製造方法。 - 前記第1半導体層に第1半導体層トランジスタを形成する段階は、前記第2半導体層トランジスタよりも小さい前記第1半導体層トランジスタを形成する段階である
請求項1に記載の半導体集積回路の製造方法。 - 前記第2半導体層上に第3半導体層を堆積する段階と、
前記第3半導体層に第3半導体層トランジスタを形成する段階とをさらに備え、
前記第3半導体層トランジスタを形成する段階は、
前記第3半導体層にソース電極及びドレイン電極を形成する段階と、
前記第3半導体層にラジカル酸化又はラジカル窒化によりゲート絶縁膜を形成する段階とを有し、
前記第3半導体層トランジスタを、前記第2半導体層トランジスタと同一のフォトマスクを繰り返し用いて形成する
請求項1から2のいずれか1項に記載の半導体集積回路の製造方法。 - 前記第1半導体層トランジスタを形成する段階は、
前記第2半導体層トランジスタより動作速度が速い前記第1半導体層トランジスタを形成する段階である
請求項1から3のいずれか1項に記載の半導体集積回路の製造方法。 - 前記第2半導体層に第2半導体層トランジスタを形成する段階は、
前記第1半導体層トランジスタと前記第2半導体層トランジスタとが、前記第1半導体層から前記第2半導体層への方向において少なくとも一部分が重なるように、第2半導体層トランジスタを形成する段階である
請求項1から4のいずれか1項記載の半導体集積回路の製造方法。 - 複数の信号線の間をそれぞれスイッチングするスイッチマトリックスである半導体集積回路を製造する方法であって、
前記第1半導体層トランジスタを形成する段階は、前記複数の信号線の間のいずれかをスイッチングする前記第1半導体層トランジスタを形成する段階であり、
前記第2半導体層トランジスタを形成する段階は、前記複数の信号線の間のいずれかをスイッチングする前記第2半導体層トランジスタを形成する段階である
請求項1から5のいずれか1項に記載の半導体集積回路の製造方法。 - 前記第1半導体層トランジスタは、アナログ信号を伝送し、
前記第2半導体層トランジスタは、デジタル信号を伝送する
請求項1から6のいずれか1項に記載の半導体集積回路の製造方法。 - 前記第2半導体層に第2半導体層トランジスタを形成する段階は、
前記第1半導体層トランジスタの数よりも少ない数の前記第2半導体層トランジスタを形成する段階である
請求項1から7のいずれか1項に記載の半導体集積回路の製造方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004210699A JP4731849B2 (ja) | 2004-07-16 | 2004-07-16 | 半導体集積回路の製造方法 |
US11/182,026 US7667276B2 (en) | 2004-07-16 | 2005-07-15 | Semiconductor integrated circuit switch matrix |
US12/110,800 US8551830B2 (en) | 2004-07-16 | 2008-04-28 | Semiconductor integrated circuit switch matrix |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004210699A JP4731849B2 (ja) | 2004-07-16 | 2004-07-16 | 半導体集積回路の製造方法 |
Publications (2)
Publication Number | Publication Date |
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JP2006032732A JP2006032732A (ja) | 2006-02-02 |
JP4731849B2 true JP4731849B2 (ja) | 2011-07-27 |
Family
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Family Applications (1)
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JP2004210699A Expired - Fee Related JP4731849B2 (ja) | 2004-07-16 | 2004-07-16 | 半導体集積回路の製造方法 |
Country Status (2)
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US (2) | US7667276B2 (ja) |
JP (1) | JP4731849B2 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20130007555A (ko) * | 2010-02-04 | 2013-01-18 | 고쿠리츠 다이가쿠 호진 도호쿠 다이가쿠 | 실리콘 웨이퍼 및 반도체 장치 |
US9157681B2 (en) | 2010-02-04 | 2015-10-13 | National University Corporation Tohoku University | Surface treatment method for atomically flattening a silicon wafer and heat treatment apparatus |
TWI688047B (zh) * | 2010-08-06 | 2020-03-11 | 半導體能源研究所股份有限公司 | 半導體裝置 |
KR102108572B1 (ko) * | 2011-09-26 | 2020-05-07 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치의 제작 방법 |
US20150104562A1 (en) * | 2013-10-10 | 2015-04-16 | Omega Optics, Inc. | Method Of Manufacturing Multilayer Interconnects For Printed Electronic Systems |
US10453872B1 (en) * | 2018-05-03 | 2019-10-22 | Wuhan China Star Optoelectronics Semiconductor Display Technologiy Co., Ltd. | Array substrate and manufacturing method thereof |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62131573A (ja) * | 1985-12-04 | 1987-06-13 | Hitachi Ltd | 半導体装置 |
JPS6354763A (ja) * | 1986-08-25 | 1988-03-09 | Mitsubishi Electric Corp | 半導体装置 |
JPS63169755A (ja) * | 1987-01-07 | 1988-07-13 | Agency Of Ind Science & Technol | 積層型半導体装置の製造方法 |
JPH02301162A (ja) * | 1989-05-16 | 1990-12-13 | Mitsubishi Electric Corp | 積層型半導体集積回路 |
JPH0799286A (ja) * | 1993-09-29 | 1995-04-11 | Toshiba Corp | 半導体装置 |
JPH07193188A (ja) * | 1993-11-22 | 1995-07-28 | Semiconductor Energy Lab Co Ltd | 半導体集積回路 |
JP2001160612A (ja) * | 1999-12-01 | 2001-06-12 | Takehide Shirato | 半導体装置及びその製造方法 |
JP2001230326A (ja) * | 2000-02-17 | 2001-08-24 | Nec Corp | 半導体集積回路装置およびその駆動方法 |
JP2001339057A (ja) * | 2000-05-30 | 2001-12-07 | Mitsumasa Koyanagi | 3次元画像処理装置の製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH631832A5 (de) | 1978-06-15 | 1982-08-31 | Bbc Brown Boveri & Cie | Leistungsthyristor und verfahren zu seiner herstellung. |
US4489478A (en) * | 1981-09-29 | 1984-12-25 | Fujitsu Limited | Process for producing a three-dimensional semiconductor device |
JPH0553689A (ja) | 1991-08-23 | 1993-03-05 | Kawasaki Steel Corp | プログラマブル論理回路装置 |
JPH1140772A (ja) * | 1997-07-22 | 1999-02-12 | Mitsubishi Electric Corp | 半導体装置及びその製造方法 |
SG148819A1 (en) * | 2000-09-14 | 2009-01-29 | Semiconductor Energy Lab | Semiconductor device and manufacturing method thereof |
US7067909B2 (en) * | 2002-12-31 | 2006-06-27 | Massachusetts Institute Of Technology | Multi-layer integrated semiconductor structure having an electrical shielding portion |
-
2004
- 2004-07-16 JP JP2004210699A patent/JP4731849B2/ja not_active Expired - Fee Related
-
2005
- 2005-07-15 US US11/182,026 patent/US7667276B2/en not_active Expired - Fee Related
-
2008
- 2008-04-28 US US12/110,800 patent/US8551830B2/en not_active Expired - Fee Related
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62131573A (ja) * | 1985-12-04 | 1987-06-13 | Hitachi Ltd | 半導体装置 |
JPS6354763A (ja) * | 1986-08-25 | 1988-03-09 | Mitsubishi Electric Corp | 半導体装置 |
JPS63169755A (ja) * | 1987-01-07 | 1988-07-13 | Agency Of Ind Science & Technol | 積層型半導体装置の製造方法 |
JPH02301162A (ja) * | 1989-05-16 | 1990-12-13 | Mitsubishi Electric Corp | 積層型半導体集積回路 |
JPH0799286A (ja) * | 1993-09-29 | 1995-04-11 | Toshiba Corp | 半導体装置 |
JPH07193188A (ja) * | 1993-11-22 | 1995-07-28 | Semiconductor Energy Lab Co Ltd | 半導体集積回路 |
JP2001160612A (ja) * | 1999-12-01 | 2001-06-12 | Takehide Shirato | 半導体装置及びその製造方法 |
JP2001230326A (ja) * | 2000-02-17 | 2001-08-24 | Nec Corp | 半導体集積回路装置およびその駆動方法 |
JP2001339057A (ja) * | 2000-05-30 | 2001-12-07 | Mitsumasa Koyanagi | 3次元画像処理装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US8551830B2 (en) | 2013-10-08 |
JP2006032732A (ja) | 2006-02-02 |
US20060017101A1 (en) | 2006-01-26 |
US20080318370A1 (en) | 2008-12-25 |
US7667276B2 (en) | 2010-02-23 |
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