JP4731690B2 - ポリシリコンレジスタおよびそれを生産する方法 - Google Patents

ポリシリコンレジスタおよびそれを生産する方法 Download PDF

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Publication number
JP4731690B2
JP4731690B2 JP2000583087A JP2000583087A JP4731690B2 JP 4731690 B2 JP4731690 B2 JP 4731690B2 JP 2000583087 A JP2000583087 A JP 2000583087A JP 2000583087 A JP2000583087 A JP 2000583087A JP 4731690 B2 JP4731690 B2 JP 4731690B2
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Japan
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layer
resistor
oxide
stabilization
register
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Expired - Fee Related
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JP2000583087A
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Japanese (ja)
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JP2002530868A (ja
Inventor
スミス、ウルフ
リイドベルク、マットス
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インフィネオン テクノロジーズ アクチェンゲゼルシャフト
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/20—Resistors

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Electronic Switches (AREA)
JP2000583087A 1998-11-13 1999-11-15 ポリシリコンレジスタおよびそれを生産する方法 Expired - Fee Related JP4731690B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SE9803883-9 1998-11-13
SE9803883A SE513116C2 (sv) 1998-11-13 1998-11-13 Polykiselresistor och sätt att framställa sådan
PCT/SE1999/002092 WO2000030176A1 (en) 1998-11-13 1999-11-15 A polysilicon resistor and a method of producing it

Publications (2)

Publication Number Publication Date
JP2002530868A JP2002530868A (ja) 2002-09-17
JP4731690B2 true JP4731690B2 (ja) 2011-07-27

Family

ID=20413276

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000583087A Expired - Fee Related JP4731690B2 (ja) 1998-11-13 1999-11-15 ポリシリコンレジスタおよびそれを生産する方法

Country Status (10)

Country Link
US (1) US6400252B1 (sv)
EP (1) EP1142016A1 (sv)
JP (1) JP4731690B2 (sv)
KR (1) KR100722310B1 (sv)
CN (1) CN1156004C (sv)
AU (1) AU1901600A (sv)
CA (1) CA2350656A1 (sv)
HK (1) HK1042590A1 (sv)
SE (1) SE513116C2 (sv)
WO (1) WO2000030176A1 (sv)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7439146B1 (en) * 2000-08-30 2008-10-21 Agere Systems Inc. Field plated resistor with enhanced routing area thereover
KR100767540B1 (ko) * 2001-04-13 2007-10-17 후지 덴키 홀딩스 가부시끼가이샤 반도체 장치
JP2004071927A (ja) * 2002-08-08 2004-03-04 Renesas Technology Corp 半導体装置
US20040070048A1 (en) * 2002-10-15 2004-04-15 Kwok Siang Ping Providing high precision resistance in an integrated circuit using a thin film resistor of controlled dimension
US6885280B2 (en) * 2003-01-31 2005-04-26 Fairchild Semiconductor Corporation High value split poly p-resistor with low standard deviation
DE10317466A1 (de) * 2003-04-16 2004-12-09 Robert Bosch Gmbh Elektromotor
US7112535B2 (en) * 2003-09-30 2006-09-26 International Business Machines Corporation Precision polysilicon resistor process
KR100587669B1 (ko) * 2003-10-29 2006-06-08 삼성전자주식회사 반도체 장치에서의 저항 소자 형성방법.
US20070096260A1 (en) * 2005-10-28 2007-05-03 International Business Machines Corporation Reduced parasitic and high value resistor and method of manufacture
CN100409415C (zh) * 2005-12-06 2008-08-06 上海华虹Nec电子有限公司 一种在集成电路中使用α多晶硅的方法
US7642892B1 (en) 2006-03-10 2010-01-05 Integrated Device Technology, Inc. Negative voltage coefficient resistor and method of manufacture
US7855422B2 (en) * 2006-05-31 2010-12-21 Alpha & Omega Semiconductor, Ltd. Formation of high sheet resistance resistors and high capacitance capacitors by a single polysilicon process
US7691717B2 (en) 2006-07-19 2010-04-06 International Business Machines Corporation Polysilicon containing resistor with enhanced sheet resistance precision and method for fabrication thereof
DE102008035808B4 (de) * 2008-07-31 2015-06-03 Globalfoundries Dresden Module One Limited Liability Company & Co. Kg Halbleiterbauelement mit einem Silizium/Germanium-Widerstand
US8054156B2 (en) * 2008-08-26 2011-11-08 Atmel Corporation Low variation resistor
US8395435B2 (en) * 2009-07-30 2013-03-12 Qualcomm, Incorporated Switches with bias resistors for even voltage distribution
JP6556556B2 (ja) 2015-08-20 2019-08-07 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
CN106684046B (zh) * 2015-11-11 2019-03-08 无锡华润上华科技有限公司 一种降低多晶高阻的氢化作用的结构、方法及半导体器件
JP6939497B2 (ja) * 2017-12-13 2021-09-22 富士電機株式会社 抵抗素子
US10211830B2 (en) 2017-04-28 2019-02-19 Qualcomm Incorporated Shunt termination path
US10910714B2 (en) 2017-09-11 2021-02-02 Qualcomm Incorporated Configurable power combiner and splitter
JP7275884B2 (ja) 2019-06-13 2023-05-18 富士電機株式会社 抵抗素子及びその製造方法
JPWO2022239719A1 (sv) * 2021-05-10 2022-11-17

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1136773A (en) * 1978-08-14 1982-11-30 Norikazu Ohuchi Semiconductor device
US4758814A (en) * 1985-12-02 1988-07-19 Motorola, Inc. Structure and method for wire lead attachment to a high temperature ceramic sensor
US5241206A (en) * 1991-07-03 1993-08-31 Micron Technology, Inc. Self-aligned vertical intrinsic resistance
JPH0677402A (ja) * 1992-07-02 1994-03-18 Natl Semiconductor Corp <Ns> 半導体デバイス用誘電体構造及びその製造方法
SE504969C2 (sv) * 1995-09-14 1997-06-02 Ericsson Telefon Ab L M Polykiselresistor och förfarande för framställning av en sådan
SE511816C3 (sv) * 1996-06-17 2000-01-24 Ericsson Telefon Ab L M Resistor innefattande en resistorkropp av polykristallint kisel samt foerfarande foer framstaellning av en saadan

Also Published As

Publication number Publication date
KR20010075671A (ko) 2001-08-09
SE513116C2 (sv) 2000-07-10
AU1901600A (en) 2000-06-05
CN1326591A (zh) 2001-12-12
HK1042590A1 (zh) 2002-08-16
CA2350656A1 (en) 2000-05-25
WO2000030176A1 (en) 2000-05-25
US6400252B1 (en) 2002-06-04
JP2002530868A (ja) 2002-09-17
EP1142016A1 (en) 2001-10-10
SE9803883L (sv) 2000-05-14
CN1156004C (zh) 2004-06-30
KR100722310B1 (ko) 2007-05-28
SE9803883D0 (sv) 1998-11-13

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