JP4730115B2 - メモリカード及びその製造方法 - Google Patents
メモリカード及びその製造方法 Download PDFInfo
- Publication number
- JP4730115B2 JP4730115B2 JP2006020292A JP2006020292A JP4730115B2 JP 4730115 B2 JP4730115 B2 JP 4730115B2 JP 2006020292 A JP2006020292 A JP 2006020292A JP 2006020292 A JP2006020292 A JP 2006020292A JP 4730115 B2 JP4730115 B2 JP 4730115B2
- Authority
- JP
- Japan
- Prior art keywords
- memory card
- housing
- circuit board
- casing
- card according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07732—Physical layout of the record carrier the record carrier having a housing or construction similar to well-known portable memory devices, such as SD cards, USB or memory sticks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0275—Security details, e.g. tampering prevention or detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10159—Memory
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Security & Cryptography (AREA)
- Credit Cards Or The Like (AREA)
Description
2 上部筐体
3 下部筐体
4 回路基板
5 電極端子
6 ロゴ表示領域
7 筐体
8 転写ヘッド
9 転写部
10 ステージ
11 苦味剤
12 ヒータ
13 梨地凹形状
14 細線凹形状
15 発泡状凹凸形状
16 スペース
21 メモリカード
Claims (12)
- メモリカードであって、
回路基板と、
前記回路基板の主面に実装された半導体メモリと、
少なくとも前記回路基板の前記主面及び前記半導体メモリを覆う筐体部と、
前記筐体部または前記回路基板のロゴ表示領域に設けられた平均粗度Raが、0.1μm以上100μm以下の粗面領域に保持される苦味剤のみと、
を備えることを特徴とするメモリカード。 - 請求項1に記載のメモリカードであって、
前記粗面領域が、前記筐体部の梨地状の表面であることを特徴とするメモリカード。 - 前記梨地状の表面をカップリング処理後、前記苦味剤のみを設けた請求項2記載のメモリカード。
- 請求項1に記載のメモリカードであって、
前記粗面領域が、前記筐体部または前記回路基板の前記露出部に形成された溝部であることを特徴とするメモリカード。 - 請求項4に記載のメモリカードであって、
前記溝部が、前記筐体部または前記回路基板の前記露出部に形成された細線状の溝であることを特徴とするメモリカード。 - 請求項4に記載のメモリカードであって、
前記溝部が、前記筐体部にレーザーマーキングにより描かれたパターンであることを特徴とするメモリカード。 - 請求項1に記載のメモリカードであって、前記粗面領域が、前記筐体部または前記回路基板の前記露出部に形成された、発泡状の凹凸であることを特徴とするメモリカード。
- 請求項7に記載のメモリカードであって、
前記発泡状の凹凸部が、前記筐体部にレーザーマーキングにより描かれたパターンであることを特徴とするメモリカード。 - 請求項1ないし6のいずれかに記載のメモリカードであって、
前記粗面領域が、略矩形状の前記筐体部または前記回路基板のコーナー部に設けられることを特徴とするメモリカード。 - メモリカードであって、
回路基板と、
前記回路基板の主面に実装された半導体メモリと、
少なくとも前記回路基板の前記主面及び前記半導体メモリを覆う成型カバーによる筐体部と、
前記少なくとも2つ以上の成型カバーの接合部、または前記回路基板と成型カバー接合部にスペースを設けて、前記スペースに保持された苦味剤のみと、
を備えることを特徴とするメモリカード。 - 請求項10に記載のメモリカードであって、
前記接合部の筐体表面側に凹状のスペースを設け、前記凹状のスペースに、苦味剤が保持されていることを特徴とするメモリカード。 - 請求項1ないし10に記載のメモリカードであって、
前記苦味剤は、略矩形状の筐体のコーナーに保持されることを特徴とするメモリカード。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006020292A JP4730115B2 (ja) | 2006-01-30 | 2006-01-30 | メモリカード及びその製造方法 |
JP2006117588A JP4784376B2 (ja) | 2006-01-30 | 2006-04-21 | メモリカード |
US12/160,301 US8125786B2 (en) | 2006-01-30 | 2007-01-26 | Memory card |
CN2007800022013A CN101371266B (zh) | 2006-01-30 | 2007-01-26 | 存储卡 |
PCT/JP2007/051242 WO2007086494A1 (ja) | 2006-01-30 | 2007-01-26 | メモリカード |
TW96102982A TWI470556B (zh) | 2006-01-30 | 2007-01-26 | Memory card |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006020292A JP4730115B2 (ja) | 2006-01-30 | 2006-01-30 | メモリカード及びその製造方法 |
JP2006117588A JP4784376B2 (ja) | 2006-01-30 | 2006-04-21 | メモリカード |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007200178A JP2007200178A (ja) | 2007-08-09 |
JP4730115B2 true JP4730115B2 (ja) | 2011-07-20 |
Family
ID=38309280
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006020292A Expired - Fee Related JP4730115B2 (ja) | 2006-01-30 | 2006-01-30 | メモリカード及びその製造方法 |
JP2006117588A Expired - Fee Related JP4784376B2 (ja) | 2006-01-30 | 2006-04-21 | メモリカード |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006117588A Expired - Fee Related JP4784376B2 (ja) | 2006-01-30 | 2006-04-21 | メモリカード |
Country Status (5)
Country | Link |
---|---|
US (1) | US8125786B2 (ja) |
JP (2) | JP4730115B2 (ja) |
CN (1) | CN101371266B (ja) |
TW (1) | TWI470556B (ja) |
WO (1) | WO2007086494A1 (ja) |
Families Citing this family (32)
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SG106050A1 (en) * | 2000-03-13 | 2004-09-30 | Megic Corp | Method of manufacture and identification of semiconductor chip marked for identification with internal marking indicia and protection thereof by non-black layer and device produced thereby |
US9295816B2 (en) * | 2009-12-09 | 2016-03-29 | Osprey Medical, Inc. | Catheter with distal and proximal ports |
JP4880764B2 (ja) | 2010-02-04 | 2012-02-22 | シャープ株式会社 | 画像形成装置、画像形成システム、プログラム、記録媒体、および画像形成装置の制御方法 |
US20120081860A1 (en) * | 2010-10-04 | 2012-04-05 | Itzhak Pomerantz | Pre-treatment of memory cards for ink jet printing |
JP5736730B2 (ja) * | 2010-10-29 | 2015-06-17 | 王子ホールディングス株式会社 | 粘着シート |
TW201316349A (zh) * | 2011-10-14 | 2013-04-16 | Hon Hai Prec Ind Co Ltd | 固態硬碟 |
KR101205212B1 (ko) * | 2011-10-31 | 2012-11-27 | 진명기 | 착미 문구용품 및 이의 제조방법 |
US20130258576A1 (en) * | 2012-03-29 | 2013-10-03 | Gadi Ben-Gad | Memory Card |
RU2016133181A (ru) * | 2014-03-07 | 2018-02-16 | Дзе Проктер Энд Гэмбл Компани | Композиции, содержащие агент с едким вкусом |
USD730908S1 (en) * | 2014-05-02 | 2015-06-02 | Samsung Electronics Co., Ltd. | Memory card |
USD730907S1 (en) * | 2014-05-02 | 2015-06-02 | Samsung Electronics Co., Ltd. | Memory card |
USD730910S1 (en) * | 2014-05-02 | 2015-06-02 | Samsung Electronics Co., Ltd. | Memory card |
USD729251S1 (en) * | 2014-06-27 | 2015-05-12 | Samsung Electronics Co., Ltd. | Memory card |
USD730909S1 (en) * | 2014-06-27 | 2015-06-02 | Samsung Electronics Co., Ltd. | Memory card |
USD727913S1 (en) * | 2014-06-27 | 2015-04-28 | Samsung Electronics Co., Ltd. | Memory card |
USD727912S1 (en) * | 2014-06-27 | 2015-04-28 | Samsung Electronics Co., Ltd. | Memory card |
USD727911S1 (en) * | 2014-06-27 | 2015-04-28 | Samsung Electronics Co., Ltd. | Memory card |
USD736215S1 (en) * | 2014-07-01 | 2015-08-11 | Samsung Electronics Co., Ltd. | Memory card |
USD736214S1 (en) * | 2014-07-01 | 2015-08-11 | Samsung Electronics Co., Ltd. | Memory card |
USD736212S1 (en) * | 2014-07-01 | 2015-08-11 | Samsung Electronics Co., Ltd. | Memory card |
USD727910S1 (en) * | 2014-07-02 | 2015-04-28 | Samsung Electronics Co., Ltd. | Memory card |
US20150134893A1 (en) * | 2014-08-19 | 2015-05-14 | Leef Technology LTD | Flash drive shaped to utilize space behind a mobile device |
USD773466S1 (en) * | 2015-08-20 | 2016-12-06 | Isaac S. Daniel | Combined secure digital memory and subscriber identity module |
USD798868S1 (en) * | 2015-08-20 | 2017-10-03 | Isaac S. Daniel | Combined subscriber identification module and storage card |
USD783621S1 (en) * | 2015-08-25 | 2017-04-11 | Samsung Electronics Co., Ltd. | Memory card |
USD783622S1 (en) * | 2015-08-25 | 2017-04-11 | Samsung Electronics Co., Ltd. | Memory card |
USD773467S1 (en) * | 2015-11-12 | 2016-12-06 | Samsung Electronics Co., Ltd. | Memory card |
USD772232S1 (en) * | 2015-11-12 | 2016-11-22 | Samsung Electronics Co., Ltd. | Memory card |
JP2019006985A (ja) * | 2017-06-21 | 2019-01-17 | 株式会社リーダー | 苦味催吐性塗膜 |
JP7093176B2 (ja) * | 2017-12-06 | 2022-06-29 | 藤森工業株式会社 | 蓋材及び包装体 |
JP7205167B2 (ja) * | 2018-11-01 | 2023-01-17 | 凸版印刷株式会社 | トークンおよびその製造方法 |
US11355822B2 (en) * | 2020-01-23 | 2022-06-07 | Duracell U.S. Operations, Inc. | Battery peel off assembly for exposing a safety feature comprising an aversive agent |
Citations (4)
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JPH0321625U (ja) * | 1989-07-11 | 1991-03-05 | ||
JPH11233606A (ja) * | 1998-02-10 | 1999-08-27 | Kakizaki Mamufacuturing Co Ltd | 樹脂製薄板収納容器 |
JP2003303326A (ja) * | 2002-04-10 | 2003-10-24 | Murata Mfg Co Ltd | カード型モジュールおよびその製造方法 |
JP2006003955A (ja) * | 2004-06-15 | 2006-01-05 | Sony Corp | メモリカードおよびその製造方法 |
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-
2006
- 2006-01-30 JP JP2006020292A patent/JP4730115B2/ja not_active Expired - Fee Related
- 2006-04-21 JP JP2006117588A patent/JP4784376B2/ja not_active Expired - Fee Related
-
2007
- 2007-01-26 US US12/160,301 patent/US8125786B2/en not_active Expired - Fee Related
- 2007-01-26 TW TW96102982A patent/TWI470556B/zh not_active IP Right Cessation
- 2007-01-26 WO PCT/JP2007/051242 patent/WO2007086494A1/ja active Application Filing
- 2007-01-26 CN CN2007800022013A patent/CN101371266B/zh not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0321625U (ja) * | 1989-07-11 | 1991-03-05 | ||
JPH11233606A (ja) * | 1998-02-10 | 1999-08-27 | Kakizaki Mamufacuturing Co Ltd | 樹脂製薄板収納容器 |
JP2003303326A (ja) * | 2002-04-10 | 2003-10-24 | Murata Mfg Co Ltd | カード型モジュールおよびその製造方法 |
JP2006003955A (ja) * | 2004-06-15 | 2006-01-05 | Sony Corp | メモリカードおよびその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN101371266B (zh) | 2011-12-14 |
JP2007293402A (ja) | 2007-11-08 |
JP4784376B2 (ja) | 2011-10-05 |
CN101371266A (zh) | 2009-02-18 |
TW200745959A (en) | 2007-12-16 |
US8125786B2 (en) | 2012-02-28 |
TWI470556B (zh) | 2015-01-21 |
US20090009976A1 (en) | 2009-01-08 |
JP2007200178A (ja) | 2007-08-09 |
WO2007086494A1 (ja) | 2007-08-02 |
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