JP4722486B2 - 高蒸着速度スパッタリング - Google Patents
高蒸着速度スパッタリング Download PDFInfo
- Publication number
- JP4722486B2 JP4722486B2 JP2004551595A JP2004551595A JP4722486B2 JP 4722486 B2 JP4722486 B2 JP 4722486B2 JP 2004551595 A JP2004551595 A JP 2004551595A JP 2004551595 A JP2004551595 A JP 2004551595A JP 4722486 B2 JP4722486 B2 JP 4722486B2
- Authority
- JP
- Japan
- Prior art keywords
- sputtering
- plasma
- target
- ionized plasma
- source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/228—Gas flow assisted PVD deposition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/354—Introduction of auxiliary energy into the plasma
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3485—Sputtering using pulsed power to the target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3492—Variation of parameters during sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3266—Magnetic control means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32697—Electrostatic control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
- H01J37/3408—Planar magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3426—Material
- H01J37/3429—Plural materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
- H01J37/3455—Movable magnets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3464—Operating strategies
- H01J37/3467—Pulsed operation, e.g. HIPIMS
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3476—Testing and control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02266—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by physical ablation of a target, e.g. sputtering, reactive sputtering, physical vapour deposition or pulsed laser deposition
Description
スパッタリングは、基板上に膜を成長させる公知の技法である。スパッタリングは、ターゲット表面からの原子の物理的放出であり、時には物理蒸着(PVD)と呼ばれる。アルゴンイオンなどのイオンが発生させられ、次にターゲット表面に誘導され、そこでイオンはターゲット物質原子を物理的にスパッタリングする。ターゲット物質原子は弾道運動によって基板に移動し、そこでターゲット物質の膜として成長する。
スパッタリングプロセスは、スパッタ率によって定量化することができる。本明細書中では、用語「スパッタ率」は、入射粒子あたりターゲットから放出されるターゲット原子の数を意味するとして定義される。スパッタ率は、ターゲット化学種、衝撃化学種、衝撃イオンのエネルギー、および衝撃イオンの入射角などいくつかの因子に依存する。一般的な既知のスパッタリングプロセスでは、一般にスパッタ率はターゲット温度に影響されない。
Ar+e−→Ar++2e−
ここで、Arは原料気体中の中性アルゴン原子を表し、e−はカソードアセンブリ114とアノード130との間に加えられた電圧パルスに応答して発生する電離性電子を表す。中性アルゴン原子と電離性電子との間の衝突の結果、アルゴンイオン(Ar+)と二個の電子とが生じる。
Ar+e−→Ar*+e−
Ar*+e−→Ar++2e−
ここで、Arは原料気体256中の中性アルゴン原子270を表し、e−はカソードアセンブリ216とアノード238との間に十分な電圧が加えられているとき、予備電離プラズマ262に応答して発生する電離性の電子を表す。さらに、Ar*は弱電離プラズマ262中の励起アルゴン原子274を表す。励起アルゴン原子274と電離性の電子との間の衝突は、結果としてアルゴンイオン(Ar+)と二個の電子とを生じさせる。
RD=K×Y×I
ここで、Kは幾何構造因子、Yはスパッタ率、Iは放電電流である。従って、成長速度はスパッタ率Yに比例する。スパッタ率Yは入射イオンあたりスパッタリングされる原子数として定義され、ターゲット表面に衝突するイオンの種類、イオンのエネルギー、衝撃イオンの入射角、ターゲット物質の結合エネルギー、およびターゲット温度に依存する。いわゆる「冷陰極」を含む一般的なスパッタリングプロセスでは、ターゲットの温度は次第に加熱され、その熱は、図2を参照して説明した液体冷却を用いて放散される。この一般的なスパッタリングプロセスは、衝撃イオンの運動量およびエネルギー交換を用いて標的原子を叩き出す。
特定の実施態様を参照して、本発明を詳細に示し説明したが、当業者は、本明細書中で定義する本発明の範囲および技術思想から逸脱することなく、本発明において形状および細部のさまざまな変化が施され得ることを理解するべきである。
Claims (17)
- IPVDスパッタリング源であって、
該スパッタリング源は、
a)アノードに隣接して配置されたスパッタリングターゲットを備えるカソードアセンブリと、
b)該アノードと該カソードアセンブリとの間に電圧パルスを生成する電源であって、該電圧パルスの少なくとも一部の電圧パルスは、原料気体から弱電離プラズマを生成し、次いで、アーク放電の発生なしに該弱電離プラズマから強電離プラズマを生成し、該電圧パルスの少なくとも一部の電圧パルスの振幅、持続時間および立ち上がり時間は、該強電離プラズマのスパッタリングされた原子からイオンを生成するように選択される、電源と
を備える、スパッタリング源。 - 前記原料気体は、希ガスおよび反応性気体のうちの少なくとも1つを含む、請求項1に記載のスパッタリング源。
- 前記スパッタリングターゲットの近傍に磁場を生成するように配置される磁石アセンブリをさらに備える、請求項1に記載のスパッタリング源。
- 前記電源は、一定の電力を有する電圧パルスを生成する、請求項1に記載のスパッタリング源。
- 前記電源は、一定の電圧を有する電圧パルスを生成する、請求項1に記載のスパッタリング源。
- a)前記スパッタリングターゲットに隣接して配置された基板支持体と、
b)該基板支持体と電気的に接続された出力を有するバイアス電圧供給源と
をさらに備える、請求項1に記載のスパッタリング源。 - 前記バイアス電圧供給源は、RFバイアス電圧を生成する、請求項6に記載のスパッタリング源。
- 磁場が50G〜2000Gの範囲内にある、請求項1に記載のスパッタリング源。
- 前記強電離プラズマを生成する前記電圧パルスの少なくとも一部の電圧パルスの振幅は、1kV〜10MVの範囲内にある、請求項1に記載のスパッタリング源。
- 前記電圧パルスの少なくとも一部の電圧パルスのパルス反復速度は、1Hz〜1kHzの範囲内にある、請求項1に記載のスパッタリング源。
- 前記電圧パルスのパルス幅は、約0.1マイクロ秒〜100秒の範囲内にある、請求項1に記載のスパッタリング源。
- IPVDスパッタリングの方法であって、
該方法は、
a)アノードとスパッタリングターゲットを備えるカソードアセンブリとの間に電圧パルスを生成することであって、該電圧パルスの少なくとも一部の電圧パルスは、原料気体から弱電離プラズマを生成し、次いで、アーク放電の発生なしに該弱電離プラズマから強電離プラズマを生成する、ことと、
b)該強電離プラズマのスパッタリングされた原子からイオンを生成するように該電圧パルスの少なくとも一部の電圧パルスの振幅および立ち上がり時間を調節することと
を含む、方法。 - 前記スパッタリングターゲットに隣接して配置された基板支持体にバイアス電圧を印加することをさらに含む、請求項12に記載の方法。
- 前記スパッタリングターゲットの近傍に磁場を生成することをさらに包含し、
該磁場は、該スパッタリングターゲットの近傍に電子を閉じ込める、請求項12に記載の方法。 - 前記原料気体は、希ガスおよび反応性気体のうちの少なくとも1つを含む、請求項12に記載の方法。
- 前記電圧パルスは、準静電場を生成する、請求項12に記載の方法。
- 前記電圧パルスは、パルス電場を生成する、請求項12に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/065,739 US6896773B2 (en) | 2002-11-14 | 2002-11-14 | High deposition rate sputtering |
US10/065,739 | 2002-11-14 | ||
PCT/US2003/034226 WO2004044261A2 (en) | 2002-11-14 | 2003-10-29 | High deposition rate sputtering |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006506521A JP2006506521A (ja) | 2006-02-23 |
JP4722486B2 true JP4722486B2 (ja) | 2011-07-13 |
Family
ID=32296386
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004551595A Expired - Fee Related JP4722486B2 (ja) | 2002-11-14 | 2003-10-29 | 高蒸着速度スパッタリング |
Country Status (7)
Country | Link |
---|---|
US (5) | US6896773B2 (ja) |
EP (1) | EP1560943B1 (ja) |
JP (1) | JP4722486B2 (ja) |
AT (1) | ATE484606T1 (ja) |
AU (1) | AU2003285072A1 (ja) |
DE (1) | DE60334561D1 (ja) |
WO (1) | WO2004044261A2 (ja) |
Families Citing this family (66)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6808607B2 (en) * | 2002-09-25 | 2004-10-26 | Advanced Energy Industries, Inc. | High peak power plasma pulsed supply with arc handling |
US7147759B2 (en) * | 2002-09-30 | 2006-12-12 | Zond, Inc. | High-power pulsed magnetron sputtering |
US6896773B2 (en) * | 2002-11-14 | 2005-05-24 | Zond, Inc. | High deposition rate sputtering |
US6806651B1 (en) * | 2003-04-22 | 2004-10-19 | Zond, Inc. | High-density plasma source |
US9771648B2 (en) * | 2004-08-13 | 2017-09-26 | Zond, Inc. | Method of ionized physical vapor deposition sputter coating high aspect-ratio structures |
US7095179B2 (en) * | 2004-02-22 | 2006-08-22 | Zond, Inc. | Methods and apparatus for generating strongly-ionized plasmas with ionizational instabilities |
US7663319B2 (en) * | 2004-02-22 | 2010-02-16 | Zond, Inc. | Methods and apparatus for generating strongly-ionized plasmas with ionizational instabilities |
US9123508B2 (en) * | 2004-02-22 | 2015-09-01 | Zond, Llc | Apparatus and method for sputtering hard coatings |
EP1580298A1 (fr) * | 2004-03-22 | 2005-09-28 | Materia Nova A.S.B.L | Dépôt par pulverisation cathodique magnétron en régime impulsionnel avec préionisation |
US7750575B2 (en) * | 2004-04-07 | 2010-07-06 | Zond, Inc. | High density plasma source |
US20100090101A1 (en) * | 2004-06-04 | 2010-04-15 | Ionwerks, Inc. | Gold implantation/deposition of biological samples for laser desorption two and three dimensional depth profiling of biological tissues |
EP2477207A3 (en) | 2004-09-24 | 2014-09-03 | Zond, Inc. | Apparatus for generating high-current electrical discharges |
US8034459B2 (en) * | 2005-10-18 | 2011-10-11 | Southwest Research Institute | Erosion resistant coatings |
US20090214787A1 (en) * | 2005-10-18 | 2009-08-27 | Southwest Research Institute | Erosion Resistant Coatings |
US20070158181A1 (en) * | 2006-01-12 | 2007-07-12 | Seagate Technology Llc | Method & apparatus for cathode sputtering with uniform process gas distribution |
GB0608582D0 (en) * | 2006-05-02 | 2006-06-07 | Univ Sheffield Hallam | High power impulse magnetron sputtering vapour deposition |
TWI410511B (zh) * | 2007-03-16 | 2013-10-01 | Univ Tohoku Nat Univ Corp | 磁控管濺鍍裝置 |
JP5283084B2 (ja) * | 2007-04-06 | 2013-09-04 | 国立大学法人東北大学 | マグネトロンスパッタ装置 |
US7966909B2 (en) * | 2007-07-25 | 2011-06-28 | The Gillette Company | Process of forming a razor blade |
WO2009071667A1 (en) * | 2007-12-07 | 2009-06-11 | Oc Oerlikon Balzers Ag | Reactive sputtering with hipims |
US20110076420A1 (en) * | 2008-01-30 | 2011-03-31 | Applied Materials, Inc. | High efficiency low energy microwave ion/electron source |
US7993733B2 (en) * | 2008-02-20 | 2011-08-09 | Applied Materials, Inc. | Index modified coating on polymer substrate |
US20090238998A1 (en) * | 2008-03-18 | 2009-09-24 | Applied Materials, Inc. | Coaxial microwave assisted deposition and etch systems |
US20090238993A1 (en) * | 2008-03-19 | 2009-09-24 | Applied Materials, Inc. | Surface preheating treatment of plastics substrate |
US8057649B2 (en) * | 2008-05-06 | 2011-11-15 | Applied Materials, Inc. | Microwave rotatable sputtering deposition |
US8349156B2 (en) * | 2008-05-14 | 2013-01-08 | Applied Materials, Inc. | Microwave-assisted rotatable PVD |
US20100078320A1 (en) * | 2008-09-26 | 2010-04-01 | Applied Materials, Inc. | Microwave plasma containment shield shaping |
US20100078315A1 (en) * | 2008-09-26 | 2010-04-01 | Applied Materials, Inc. | Microstrip antenna assisted ipvd |
DE102008050499B4 (de) | 2008-10-07 | 2014-02-06 | Systec System- Und Anlagentechnik Gmbh & Co. Kg | PVD-Beschichtungsverfahren, Vorrichtung zur Durchführung des Verfahrens und nach dem Verfahren beschichtete Substrate |
US20120138452A1 (en) * | 2009-04-17 | 2012-06-07 | The Regents Of The University Of California | Method and Apparatus for Super-High Rate Deposition |
TW201129713A (en) * | 2009-07-09 | 2011-09-01 | Applied Materials Inc | Curved microwave plasma line source for coating of three-dimensional substrates |
US8790791B2 (en) | 2010-04-15 | 2014-07-29 | Southwest Research Institute | Oxidation resistant nanocrystalline MCrAl(Y) coatings and methods of forming such coatings |
CN102534521A (zh) * | 2010-12-13 | 2012-07-04 | 中国科学院沈阳科学仪器研制中心有限公司 | 一种磁控靶布气结构 |
RU2463382C2 (ru) * | 2010-12-16 | 2012-10-10 | Валерий Михайлович Башков | Способ и устройство для получения многослойно-композиционных наноструктурированных покрытий и материалов |
DE102010061487A1 (de) | 2010-12-22 | 2012-06-28 | EB Immobilien und Maschinen GmbH & Co. KG | Verfahren zum Behandeln und/oder Beschichten von Oberflächen |
US20130327635A1 (en) * | 2011-02-25 | 2013-12-12 | Mamoru Kawashita | Magnetron electrode for plasma processing |
US9511572B2 (en) | 2011-05-25 | 2016-12-06 | Southwest Research Institute | Nanocrystalline interlayer coating for increasing service life of thermal barrier coating on high temperature components |
EP2541584B1 (en) | 2011-06-27 | 2018-08-08 | TRUMPF Huettinger Sp. Z o. o. | Generating a highly ionized plasma in a plasma chamber |
US9175382B2 (en) | 2011-10-25 | 2015-11-03 | Intermolecular, Inc. | High metal ionization sputter gun |
WO2014017682A1 (ko) * | 2012-07-26 | 2014-01-30 | 주식회사 아비즈알 | 마그네트론 냉각부를 구비한 마그네트론 스퍼터링 장치 |
CN206127394U (zh) * | 2012-12-27 | 2017-04-26 | 菲力尔系统公司 | 沉积系统 |
US9018108B2 (en) | 2013-01-25 | 2015-04-28 | Applied Materials, Inc. | Low shrinkage dielectric films |
DE102013103762A1 (de) * | 2013-04-15 | 2014-10-16 | Von Ardenne Anlagentechnik Gmbh | Beschichtungsanordnung |
US9960026B1 (en) | 2013-11-11 | 2018-05-01 | Coldquanta Inc. | Ion pump with direct molecule flow channel through anode |
US9960025B1 (en) | 2013-11-11 | 2018-05-01 | Coldquanta Inc. | Cold-matter system having ion pump integrated with channel cell |
US9117563B2 (en) | 2014-01-13 | 2015-08-25 | Cold Quanta, Inc. | Ultra-cold-matter system with thermally-isolated nested source cell |
JP6403269B2 (ja) * | 2014-07-30 | 2018-10-10 | 株式会社神戸製鋼所 | アーク蒸発源 |
CN104694900A (zh) * | 2015-03-27 | 2015-06-10 | 中国工程物理研究院激光聚变研究中心 | 可加偏压式薄膜样品架 |
US9523146B1 (en) | 2015-06-17 | 2016-12-20 | Southwest Research Institute | Ti—Si—C—N piston ring coatings |
US10043670B2 (en) * | 2015-10-22 | 2018-08-07 | Applied Materials, Inc. | Systems and methods for low resistivity physical vapor deposition of a tungsten film |
CN105441889A (zh) * | 2015-12-22 | 2016-03-30 | 大连维钛克科技股份有限公司 | 一种离子源磁场分布结构 |
US10927449B2 (en) * | 2017-01-25 | 2021-02-23 | Applied Materials, Inc. | Extension of PVD chamber with multiple reaction gases, high bias power, and high power impulse source for deposition, implantation, and treatment |
CN107475677A (zh) * | 2017-08-18 | 2017-12-15 | 嘉兴申宁精密科技有限公司 | 一种采用物理气相沉积工艺溅镀涂层的装置 |
JP6836976B2 (ja) * | 2017-09-26 | 2021-03-03 | 東京エレクトロン株式会社 | プラズマ処理装置 |
CN110112094B (zh) * | 2018-02-01 | 2021-06-04 | 长鑫存储技术有限公司 | 铝膜低温溅镀方法、铝导线层制造方法及具有其的结构 |
JP6920245B2 (ja) * | 2018-04-23 | 2021-08-18 | 東京エレクトロン株式会社 | 温度制御方法 |
JP6851706B2 (ja) * | 2018-05-30 | 2021-03-31 | 東芝三菱電機産業システム株式会社 | 活性ガス生成装置 |
WO2019246296A1 (en) | 2018-06-20 | 2019-12-26 | Board Of Trustees Of Michigan State University | Single beam plasma source |
JP7257807B2 (ja) * | 2019-02-12 | 2023-04-14 | 東京エレクトロン株式会社 | スパッタ装置 |
FR3097237B1 (fr) * | 2019-06-11 | 2021-05-28 | Safran | Procédé de revêtement d'un substrat par du nitrure de tantale |
KR102545951B1 (ko) | 2019-11-12 | 2023-06-22 | 도시바 미쓰비시덴키 산교시스템 가부시키가이샤 | 활성 가스 생성 장치 |
WO2021106100A1 (ja) | 2019-11-27 | 2021-06-03 | 東芝三菱電機産業システム株式会社 | 活性ガス生成装置 |
EP3886139B1 (en) * | 2020-03-16 | 2024-02-07 | Vapor Technologies, Inc. | Convertible magnetics for rotary cathode |
CN111560588B (zh) * | 2020-05-09 | 2022-05-03 | 南方科技大学 | 用于超高真空环境的磁控溅射靶、磁控溅射装置 |
CN114032518A (zh) * | 2021-10-29 | 2022-02-11 | 北京航空航天大学 | 双极脉冲磁控溅射系统及提高沉积离子流量和能量方法 |
CN114032519A (zh) * | 2021-10-29 | 2022-02-11 | 北京航空航天大学 | 电磁场耦合双极脉冲磁控溅射系统及提高流量和能量方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001274115A (ja) * | 1999-12-03 | 2001-10-05 | Applied Materials Inc | パルスモードrfバイアスによる側壁被覆向上方法 |
JP2006505128A (ja) * | 2002-10-29 | 2006-02-09 | ゾンド, インコーポレイテッド | 高電力パルスによって磁気的に強化されたプラズマ処理 |
JP2006505906A (ja) * | 2002-11-04 | 2006-02-16 | ゾンド, インコーポレイテッド | 高密度プラズマを生成する方法および装置 |
Family Cites Families (95)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1488482A (ja) * | 1965-07-16 | 1967-11-02 | ||
US3461054A (en) * | 1966-03-24 | 1969-08-12 | Bell Telephone Labor Inc | Cathodic sputtering from a cathodically biased target electrode having an rf potential superimposed on the cathodic bias |
CA941781A (en) | 1970-05-13 | 1974-02-12 | United Aircraft Corporation | Metal deposition by liquid phase sputtering |
US3761836A (en) * | 1972-01-07 | 1973-09-25 | United Aircraft Corp | Magnetically compensated cross field flowing gas laser |
JPS6010107B2 (ja) | 1981-05-25 | 1985-03-15 | 日本真空技術株式会社 | Rfスパツタリングにおける絶縁物タ−ゲツト用カソ−ド |
US4407708A (en) * | 1981-08-06 | 1983-10-04 | Eaton Corporation | Method for operating a magnetron sputtering apparatus |
DE3210351A1 (de) | 1982-03-20 | 1983-09-22 | Leybold-Heraeus GmbH, 5000 Köln | Verfahren und vorrichtung zum herstellen von magnetischen aufzeichnungsschichten |
US4588490A (en) | 1985-05-22 | 1986-05-13 | International Business Machines Corporation | Hollow cathode enhanced magnetron sputter device |
JPS62216637A (ja) * | 1986-03-19 | 1987-09-24 | Anelva Corp | プラズマ処理装置 |
DE3700633C2 (de) | 1987-01-12 | 1997-02-20 | Reinar Dr Gruen | Verfahren und Vorrichtung zum schonenden Beschichten elektrisch leitender Gegenstände mittels Plasma |
US5429070A (en) * | 1989-06-13 | 1995-07-04 | Plasma & Materials Technologies, Inc. | High density plasma deposition and etching apparatus |
WO1991000374A1 (de) * | 1989-06-27 | 1991-01-10 | Hauzer Holding Bv | Verfahren und vorrichtung zur beschichtung von substraten |
JP2819420B2 (ja) | 1989-11-20 | 1998-10-30 | 東京エレクトロン株式会社 | イオン源 |
US5045166A (en) * | 1990-05-21 | 1991-09-03 | Mcnc | Magnetron method and apparatus for producing high density ionic gas discharge |
JP3076367B2 (ja) | 1990-11-29 | 2000-08-14 | キヤノン株式会社 | プラズマ処理装置 |
DE4108474A1 (de) * | 1991-03-15 | 1992-09-17 | Lambda Physik Forschung | Vorrichtung zur vorionisierung eines gepulsten gaslasers |
WO1992018663A1 (en) * | 1991-04-19 | 1992-10-29 | Surface Solutions, Incorporated | Method and apparatus for linear magnetron sputtering |
DE4202425C2 (de) | 1992-01-29 | 1997-07-17 | Leybold Ag | Verfahren und Vorrichtung zum Beschichten eines Substrats, insbesondere mit elektrisch nichtleitenden Schichten |
RU2029411C1 (ru) | 1992-04-29 | 1995-02-20 | Научно-производственная фирма "Плазматек" | Способ плазменного травления тонких пленок |
US5330800A (en) * | 1992-11-04 | 1994-07-19 | Hughes Aircraft Company | High impedance plasma ion implantation method and apparatus |
US6217717B1 (en) * | 1992-12-30 | 2001-04-17 | Advanced Energy Industries, Inc. | Periodically clearing thin film plasma processing system |
US5718813A (en) * | 1992-12-30 | 1998-02-17 | Advanced Energy Industries, Inc. | Enhanced reactive DC sputtering system |
US5427669A (en) * | 1992-12-30 | 1995-06-27 | Advanced Energy Industries, Inc. | Thin film DC plasma processing system |
RU2058429C1 (ru) | 1993-06-17 | 1996-04-20 | Георгий Владимирович Ходаченко | Способ напыления пленок |
US6190512B1 (en) * | 1993-09-07 | 2001-02-20 | Tokyo Electron Arizona Inc. | Soft plasma ignition in plasma processing chambers |
SE501888C2 (sv) * | 1993-10-18 | 1995-06-12 | Ladislav Bardos | En metod och en apparat för generering av en urladdning i egna ångor från en radiofrekvenselektrod för kontinuerlig självförstoftning av elektroden |
JP3250699B2 (ja) * | 1994-02-03 | 2002-01-28 | 東京エレクトロン株式会社 | プラズマ処理装置 |
DE4412906C1 (de) * | 1994-04-14 | 1995-07-13 | Fraunhofer Ges Forschung | Verfahren und Einrichtung für die ionengestützte Vakuumbeschichtung |
US5651865A (en) * | 1994-06-17 | 1997-07-29 | Eni | Preferential sputtering of insulators from conductive targets |
JP3562595B2 (ja) * | 1994-08-26 | 2004-09-08 | アネルバ株式会社 | スパッタ装置 |
JPH08279495A (ja) * | 1995-02-07 | 1996-10-22 | Seiko Epson Corp | プラズマ処理装置及びその方法 |
WO1996031899A1 (en) * | 1995-04-07 | 1996-10-10 | Advanced Energy Industries, Inc. | Adjustable energy quantum thin film plasma processing system |
JPH08293470A (ja) * | 1995-04-21 | 1996-11-05 | Sony Corp | 成膜装置および成膜方法 |
US5576939A (en) * | 1995-05-05 | 1996-11-19 | Drummond; Geoffrey N. | Enhanced thin film DC plasma power supply |
JP3808917B2 (ja) * | 1995-07-20 | 2006-08-16 | オリンパス株式会社 | 薄膜の製造方法及び薄膜 |
US5702573A (en) * | 1996-01-29 | 1997-12-30 | Varian Associates, Inc. | Method and apparatus for improved low pressure collimated magnetron sputter deposition of metal films |
FR2744462B1 (fr) | 1996-02-02 | 1998-02-27 | Commissariat Energie Atomique | Procede et dispositif pour realiser un depot par pulverisation cathodique a partir d'une cible portee a haute temperature |
US5733418A (en) | 1996-05-07 | 1998-03-31 | Pld Advanced Automation Systems, Inc. | Sputtering method and apparatus |
US5917286A (en) * | 1996-05-08 | 1999-06-29 | Advanced Energy Industries, Inc. | Pulsed direct current power supply configurations for generating plasmas |
DE19702187C2 (de) * | 1997-01-23 | 2002-06-27 | Fraunhofer Ges Forschung | Verfahren und Einrichtung zum Betreiben von Magnetronentladungen |
SE9704607D0 (sv) | 1997-12-09 | 1997-12-09 | Chemfilt R & D Ab | A method and apparatus for magnetically enhanced sputtering |
JP4355036B2 (ja) | 1997-03-18 | 2009-10-28 | キヤノンアネルバ株式会社 | イオン化スパッタリング装置 |
JP3846970B2 (ja) * | 1997-04-14 | 2006-11-15 | キヤノンアネルバ株式会社 | イオン化スパッタリング装置 |
DE19720251A1 (de) * | 1997-05-15 | 1998-11-19 | Fraunhofer Ges Forschung | Verfahren zum Beschichten von Dünnfilmmagnetplatten |
JPH10330932A (ja) | 1997-05-28 | 1998-12-15 | Anelva Corp | スパッタリング装置 |
US6238527B1 (en) * | 1997-10-08 | 2001-05-29 | Canon Kabushiki Kaisha | Thin film forming apparatus and method of forming thin film of compound by using the same |
US5976327A (en) * | 1997-12-12 | 1999-11-02 | Applied Materials, Inc. | Step coverage and overhang improvement by pedestal bias voltage modulation |
US6124675A (en) * | 1998-06-01 | 2000-09-26 | University Of Montreal | Metastable atom bombardment source |
US6057244A (en) | 1998-07-31 | 2000-05-02 | Applied Materials, Inc. | Method for improved sputter etch processing |
US6238537B1 (en) | 1998-08-06 | 2001-05-29 | Kaufman & Robinson, Inc. | Ion assisted deposition source |
DE19851062C1 (de) * | 1998-11-05 | 2000-06-15 | Ibm | Verfahren zum Beschichten von Magnetspeicherplatten und danach hergestellte Magnetspeicherplatte |
US6497802B2 (en) * | 1999-02-12 | 2002-12-24 | Applied Materials, Inc. | Self ionized plasma sputtering |
US6306265B1 (en) * | 1999-02-12 | 2001-10-23 | Applied Materials, Inc. | High-density plasma for ionized metal deposition capable of exciting a plasma wave |
US6183614B1 (en) * | 1999-02-12 | 2001-02-06 | Applied Materials, Inc. | Rotating sputter magnetron assembly |
JP4351755B2 (ja) * | 1999-03-12 | 2009-10-28 | キヤノンアネルバ株式会社 | 薄膜作成方法および薄膜作成装置 |
US6086730A (en) * | 1999-04-22 | 2000-07-11 | Komag, Incorporated | Method of sputtering a carbon protective film on a magnetic disk with high sp3 content |
US6327163B1 (en) * | 1999-04-27 | 2001-12-04 | Science Research Laboratory, Inc. | Solid state pulsed power supply |
US6319355B1 (en) * | 1999-06-30 | 2001-11-20 | Lam Research Corporation | Plasma processor with coil responsive to variable amplitude rf envelope |
US6290821B1 (en) * | 1999-07-15 | 2001-09-18 | Seagate Technology Llc | Sputter deposition utilizing pulsed cathode and substrate bias power |
US8696875B2 (en) * | 1999-10-08 | 2014-04-15 | Applied Materials, Inc. | Self-ionized and inductively-coupled plasma for sputtering and resputtering |
US6398929B1 (en) * | 1999-10-08 | 2002-06-04 | Applied Materials, Inc. | Plasma reactor and shields generating self-ionized plasma for sputtering |
US20010050220A1 (en) * | 1999-11-16 | 2001-12-13 | Applied Materials, Inc. | Method and apparatus for physical vapor deposition using modulated power |
US6350353B2 (en) * | 1999-11-24 | 2002-02-26 | Applied Materials, Inc. | Alternate steps of IMP and sputtering process to improve sidewall coverage |
US6451177B1 (en) | 2000-01-21 | 2002-09-17 | Applied Materials, Inc. | Vault shaped target and magnetron operable in two sputtering modes |
US6251242B1 (en) * | 2000-01-21 | 2001-06-26 | Applied Materials, Inc. | Magnetron and target producing an extended plasma region in a sputter reactor |
US6277249B1 (en) * | 2000-01-21 | 2001-08-21 | Applied Materials Inc. | Integrated process for copper via filling using a magnetron and target producing highly energetic ions |
DE10015244C2 (de) * | 2000-03-28 | 2002-09-19 | Fraunhofer Ges Forschung | Verfahren und Schaltungsanordnung zur pulsförmigen Energieeinspeisung in Magnetronentladungen |
US6679981B1 (en) * | 2000-05-11 | 2004-01-20 | Applied Materials, Inc. | Inductive plasma loop enhancing magnetron sputtering |
US6447655B2 (en) * | 2000-05-30 | 2002-09-10 | Alexander D. Lantsman | DC plasma power supply for a sputter deposition |
SE519931C2 (sv) | 2000-06-19 | 2003-04-29 | Chemfilt R & D Ab | Anordning och förfarande för pulsad, starkt joniserad magnetronsputtering |
US6352629B1 (en) * | 2000-07-10 | 2002-03-05 | Applied Materials, Inc. | Coaxial electromagnet in a magnetron sputtering reactor |
DE10051509B4 (de) * | 2000-10-18 | 2007-08-30 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Herstellung eines Dünnschichtsystems und Anwendung des Verfahrens |
US6413382B1 (en) | 2000-11-03 | 2002-07-02 | Applied Materials, Inc. | Pulsed sputtering with a small rotating magnetron |
US6777037B2 (en) | 2001-02-21 | 2004-08-17 | Hitachi, Ltd. | Plasma processing method and apparatus |
US6663754B2 (en) * | 2001-04-13 | 2003-12-16 | Applied Materials, Inc. | Tubular magnet as center pole in unbalanced sputtering magnetron |
WO2002091461A2 (en) * | 2001-05-04 | 2002-11-14 | Tokyo Electron Limited | Ionized pvd with sequential deposition and etching |
SE525231C2 (sv) * | 2001-06-14 | 2005-01-11 | Chemfilt R & D Ab | Förfarande och anordning för att alstra plasma |
US20030029715A1 (en) * | 2001-07-25 | 2003-02-13 | Applied Materials, Inc. | An Apparatus For Annealing Substrates In Physical Vapor Deposition Systems |
JP3936892B2 (ja) | 2002-06-07 | 2007-06-27 | 株式会社エスディーシー | プラズマ浸炭処理方法および同処理装置 |
US6730196B2 (en) * | 2002-08-01 | 2004-05-04 | Applied Materials, Inc. | Auxiliary electromagnets in a magnetron sputter reactor |
US6808607B2 (en) * | 2002-09-25 | 2004-10-26 | Advanced Energy Industries, Inc. | High peak power plasma pulsed supply with arc handling |
US7147759B2 (en) * | 2002-09-30 | 2006-12-12 | Zond, Inc. | High-power pulsed magnetron sputtering |
US6896773B2 (en) * | 2002-11-14 | 2005-05-24 | Zond, Inc. | High deposition rate sputtering |
US20040112735A1 (en) * | 2002-12-17 | 2004-06-17 | Applied Materials, Inc. | Pulsed magnetron for sputter deposition |
US6899796B2 (en) * | 2003-01-10 | 2005-05-31 | Applied Materials, Inc. | Partially filling copper seed layer |
US6805779B2 (en) * | 2003-03-21 | 2004-10-19 | Zond, Inc. | Plasma generation using multi-step ionization |
US6806651B1 (en) * | 2003-04-22 | 2004-10-19 | Zond, Inc. | High-density plasma source |
GB2401116A (en) | 2003-04-28 | 2004-11-03 | Hauzer Techno Coating Bv | Plasma Assisted Chemical Vapour Deposition |
US6903511B2 (en) * | 2003-05-06 | 2005-06-07 | Zond, Inc. | Generation of uniformly-distributed plasma |
US20050103620A1 (en) * | 2003-11-19 | 2005-05-19 | Zond, Inc. | Plasma source with segmented magnetron cathode |
US9771648B2 (en) * | 2004-08-13 | 2017-09-26 | Zond, Inc. | Method of ionized physical vapor deposition sputter coating high aspect-ratio structures |
US7081186B2 (en) * | 2003-11-20 | 2006-07-25 | Sheffield Hallam University | Combined coating process comprising magnetic field-assisted, high power, pulsed cathode sputtering and an unbalanced magnetron |
US7095179B2 (en) * | 2004-02-22 | 2006-08-22 | Zond, Inc. | Methods and apparatus for generating strongly-ionized plasmas with ionizational instabilities |
EP2477207A3 (en) * | 2004-09-24 | 2014-09-03 | Zond, Inc. | Apparatus for generating high-current electrical discharges |
WO2009122378A1 (en) * | 2008-04-03 | 2009-10-08 | Oc Oerlikon Balzers Ag | Apparatus for sputtering and a method of fabricating a metallization structure |
-
2002
- 2002-11-14 US US10/065,739 patent/US6896773B2/en not_active Expired - Lifetime
-
2003
- 2003-10-29 AT AT03779387T patent/ATE484606T1/de not_active IP Right Cessation
- 2003-10-29 WO PCT/US2003/034226 patent/WO2004044261A2/en active Application Filing
- 2003-10-29 DE DE60334561T patent/DE60334561D1/de not_active Expired - Lifetime
- 2003-10-29 AU AU2003285072A patent/AU2003285072A1/en not_active Abandoned
- 2003-10-29 JP JP2004551595A patent/JP4722486B2/ja not_active Expired - Fee Related
- 2003-10-29 EP EP03779387A patent/EP1560943B1/en not_active Revoked
-
2005
- 2005-03-28 US US11/091,814 patent/US20050178654A1/en not_active Abandoned
- 2005-07-18 US US11/183,463 patent/US7811421B2/en not_active Expired - Fee Related
-
2010
- 2010-09-10 US US12/879,036 patent/US20100326815A1/en not_active Abandoned
-
2016
- 2016-07-26 US US15/219,975 patent/US20170029936A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001274115A (ja) * | 1999-12-03 | 2001-10-05 | Applied Materials Inc | パルスモードrfバイアスによる側壁被覆向上方法 |
JP2006505128A (ja) * | 2002-10-29 | 2006-02-09 | ゾンド, インコーポレイテッド | 高電力パルスによって磁気的に強化されたプラズマ処理 |
JP2006505906A (ja) * | 2002-11-04 | 2006-02-16 | ゾンド, インコーポレイテッド | 高密度プラズマを生成する方法および装置 |
Also Published As
Publication number | Publication date |
---|---|
US20170029936A1 (en) | 2017-02-02 |
US20050252763A1 (en) | 2005-11-17 |
US7811421B2 (en) | 2010-10-12 |
US6896773B2 (en) | 2005-05-24 |
AU2003285072A8 (en) | 2004-06-03 |
EP1560943B1 (en) | 2010-10-13 |
DE60334561D1 (de) | 2010-11-25 |
EP1560943A2 (en) | 2005-08-10 |
ATE484606T1 (de) | 2010-10-15 |
US20100326815A1 (en) | 2010-12-30 |
US20050178654A1 (en) | 2005-08-18 |
JP2006506521A (ja) | 2006-02-23 |
WO2004044261A3 (en) | 2004-08-26 |
US20040094411A1 (en) | 2004-05-20 |
WO2004044261A2 (en) | 2004-05-27 |
AU2003285072A1 (en) | 2004-06-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4722486B2 (ja) | 高蒸着速度スパッタリング | |
US7147759B2 (en) | High-power pulsed magnetron sputtering | |
EP1556882B1 (en) | High-power pulsed magnetically enhanced plasma processing | |
US6296742B1 (en) | Method and apparatus for magnetically enhanced sputtering | |
US6853142B2 (en) | Methods and apparatus for generating high-density plasma | |
US6806651B1 (en) | High-density plasma source | |
US6903511B2 (en) | Generation of uniformly-distributed plasma | |
US20090200158A1 (en) | High power impulse magnetron sputtering vapour deposition | |
US7750575B2 (en) | High density plasma source | |
CA2284181A1 (en) | A method and apparatus for magnetically enhanced sputtering |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20061025 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090827 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20091126 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20091203 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100218 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20101111 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20110210 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20110218 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110311 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110404 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110406 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140415 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4722486 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |