JP4722468B2 - 薄膜トランジスタ表示板 - Google Patents
薄膜トランジスタ表示板 Download PDFInfo
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- JP4722468B2 JP4722468B2 JP2004357576A JP2004357576A JP4722468B2 JP 4722468 B2 JP4722468 B2 JP 4722468B2 JP 2004357576 A JP2004357576 A JP 2004357576A JP 2004357576 A JP2004357576 A JP 2004357576A JP 4722468 B2 JP4722468 B2 JP 4722468B2
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- 239000010409 thin film Substances 0.000 title claims description 84
- 239000010408 film Substances 0.000 claims description 130
- 239000004020 conductor Substances 0.000 claims description 53
- 239000004065 semiconductor Substances 0.000 claims description 37
- 230000001681 protective effect Effects 0.000 claims description 28
- 239000000758 substrate Substances 0.000 claims description 17
- 239000011159 matrix material Substances 0.000 claims description 7
- 239000011810 insulating material Substances 0.000 claims description 6
- 239000004973 liquid crystal related substance Substances 0.000 description 33
- 229910021417 amorphous silicon Inorganic materials 0.000 description 31
- 238000003860 storage Methods 0.000 description 28
- 239000003990 capacitor Substances 0.000 description 26
- 229910052751 metal Inorganic materials 0.000 description 23
- 239000002184 metal Substances 0.000 description 23
- 239000012535 impurity Substances 0.000 description 22
- 238000000034 method Methods 0.000 description 19
- 230000008569 process Effects 0.000 description 18
- 230000000903 blocking effect Effects 0.000 description 15
- 238000004519 manufacturing process Methods 0.000 description 13
- 239000011651 chromium Substances 0.000 description 8
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 238000005530 etching Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 238000001259 photo etching Methods 0.000 description 7
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 6
- 229910052804 chromium Inorganic materials 0.000 description 6
- 229910001182 Mo alloy Inorganic materials 0.000 description 5
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 5
- 229910052581 Si3N4 Inorganic materials 0.000 description 5
- 229910052750 molybdenum Inorganic materials 0.000 description 5
- 239000011733 molybdenum Substances 0.000 description 5
- 230000003071 parasitic effect Effects 0.000 description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- 238000001039 wet etching Methods 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 239000011368 organic material Substances 0.000 description 4
- 238000001312 dry etching Methods 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 150000002751 molybdenum Chemical class 0.000 description 2
- MGRWKWACZDFZJT-UHFFFAOYSA-N molybdenum tungsten Chemical compound [Mo].[W] MGRWKWACZDFZJT-UHFFFAOYSA-N 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 229910000667 (NH4)2Ce(NO3)6 Inorganic materials 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- 229910004205 SiNX Inorganic materials 0.000 description 1
- UBSJOWMHLJZVDJ-UHFFFAOYSA-N aluminum neodymium Chemical compound [Al].[Nd] UBSJOWMHLJZVDJ-UHFFFAOYSA-N 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- CXOWYMLTGOFURZ-UHFFFAOYSA-N azanylidynechromium Chemical compound [Cr]#N CXOWYMLTGOFURZ-UHFFFAOYSA-N 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 125000000896 monocarboxylic acid group Chemical group 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
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- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
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- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
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- G02F1/136227—Through-hole connection of the pixel electrode to the active element through an insulation layer
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1288—Multistep manufacturing methods employing particular masking sequences or specially adapted masks, e.g. half-tone mask
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- G—PHYSICS
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- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
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- G02F1/136209—Light shielding layers, e.g. black matrix, incorporated in the active matrix substrate, e.g. structurally associated with the switching element
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- G—PHYSICS
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- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
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- G02F1/136213—Storage capacitors associated with the pixel electrode
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- G—PHYSICS
- G02—OPTICS
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- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
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- G02F1/136218—Shield electrodes
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136222—Colour filters incorporated in the active matrix substrate
Description
まず、図1乃至図3を参照して、本発明の一実施例による液晶表示装置用薄膜トランジスタ表示板の構造について詳細に説明する。
上部膜121qは、ゲート信号の遅延や電圧降下を減らせるように低い比抵抗の金属、例えば、アルミニウム(Al)やアルミニウム合金などアルミニウム系列の金属からなる。これとは異なって、下部膜121pはその他の物質、特にIZO(indium zinc oxide)またはITO(indium tin oxide)との物理的、化学的、電気的接触特性が優れた物質、例えばモリブデン(Mo)、モリブデン合金(例:モリブデン−タングステン(MoW)合金)、クロム(Cr)などからなる。下部膜121pと上部膜121qとの組み合わせの例としては、クロム/アルミニウム−ネオジム(Nd)合金が挙げられる。図1に示すゲート電極124の下部膜及び上部膜は、図2において、それぞれ、図面符号124p、124qで示され、拡張部127の下部膜及び上部膜は、それぞれ、図面符号127p、127qで示されている。
ゲート線121上には、窒化ケイ素(SiNx)などからなるゲート絶縁膜140が形成されている。
オーミック接触部材161、165及びゲート絶縁膜140上には、それぞれ、複数のデータ線171、複数のドレイン電極175及び複数のストレージキャパシタ用導電体(維持蓄電器用導電体)(storage capacitor conductor)177が形成されている。
また、データ線171及びドレイン電極175と同一層にはデータ線171と平行に配置されて、フローティングされている光遮断用導電体178が、形成されている。光遮断用導電体178は、互いに隣接する画素領域の間から漏れる光を遮断する機能を有する。
データ線171、ドレイン電極175及びストレージキャパシタ用導電体177もまた、モリブデン(Mo)、モリブデン合金、クロム(Cr)などの下部膜とその上に位置するアルミニウム系列金属である上部膜からなることができ、これらの単一膜からなることができる。
オーミック接触部材161、165は、その下部の半導体151とその上部のデータ線171及びドレイン電極175の間にのみ存在し接触抵抗を低くする役割をする。線状半導体151は、ソース電極173とドレイン電極175の間をはじめとして、データ線171及びドレイン電極175によって覆われず露出された部分を有し、大部分の所で線状半導体151の幅がデータ線171の幅よりも小さいが、既に説明したように、ゲート線121と会う部分で幅が大きくなり、ゲート線121とデータ線171の間の絶縁を強化する。
画素電極190は、コンタクトホール185、187を通じてドレイン電極175及びストレージキャパシタ用導電体177とそれぞれ物理的・電気的に接続され、ドレイン電極175からデータ電圧の印加を受けて、導電体177にデータ電圧を伝達する。
本実施例では、少なくとも互いに隣接する画素電極190のうちの一つは、データ線171を完全に覆って重畳し、もう一つの画素電極190は光遮断用導電体178と重畳している。このような構造では、データ線171が、画素電極190と完全に重なっているので、製造工程時に画素電極190とデータ線171との間に誤整列が発生しても、画素電極190とデータ線171との間に形成される寄生容量は、変化しない。また、画素電極190と一部重なっている光遮断用導電体178は、データ線171から分離されてフローティング(floating)状態であるので、これら190、178の間には、寄生容量が形成されない。したがって、本発明の実施例による画素構造で、画素電極190に伝達される画素電圧は、変化せず、これにより、ステッチ不良の発生を防ぐことができる。この時、画素電極190の境界線は、光遮断用導電体178の上部に位置するのが望ましいが、そうでないこともある。
図4及び図5のように、本実施例による液晶表示装置用薄膜トランジスタ表示板の層状構造は、大部分図1乃至図3に示される液晶表示装置用薄膜トランジスタ表示板の層状構造と同様である。即ち、基板110上に、複数のゲート電極124を含む複数のゲート線121が形成され、その上に、ゲート絶縁膜140、複数の突出部154を含む複数の線状半導体151、複数の突出部163をそれぞれ含む複数の線状オーミック接触部材161及び複数の島状オーミック接触部材165が順次に形成されている。オーミック接触部材161、165及びゲート絶縁膜140上には、複数のソース電極173を含む複数のデータ線171、複数のドレイン電極175、複数のストレージキャパシタ用導電体177及び複数の光遮断用導電体178が形成され、その上に保護膜180が形成されている。保護膜180及び/又はゲート絶縁膜140には、複数のコンタクトホール182、185、187が形成され、保護膜180上には、複数の画素電極190及び複数の接触補助部材82が形成されている。
まず、図14、図15a及び図15bを参考にして、本発明の他の実施例による液晶表示装置用薄膜トランジスタ表示板の単位画素構造について詳細に説明する。
(1)その他の領域Bに位置する導電体層170、不純物非晶質シリコン層160及び非晶質シリコン層150の第3部分を除去、
(2)チャンネル領域Cに位置する感光膜の第2部分64を除去、
(3)チャンネル領域Cに位置する導電体層170及び不純物非晶質シリコン層160の第2部分を除去、そして
(4)配線領域Aに位置する感光膜の第1部分62を除去。
(1)その他の領域Bに位置する導電体層170の第3部分を除去、
(2)チャンネル領域Cに位置する感光膜の第2部分64を除去、
(3)その他領域Bに位置する不純物非晶質シリコン層160及び非晶質シリコン層150の第3部分を除去、
(4)チャンネル領域Cに位置する導電体層170の第2部分を除去、
(5)配線領域Aに位置する感光膜の第1部分62を除去、そして
(6)チャンネル領域Cに位置する不純物非晶質シリコン層160の第2部分を除去。
まず、図19a及び19bに示すように、その他の領域Bに露出されている導電体層170を湿式若しくは乾式でエッチングして除去して、下部の不純物非晶質シリコン層160の第3部分を露出させる。アルミニウム系列の導電膜は、主に湿式エッチングで実施し、モリブデン系列の導電膜は、湿式及び乾式エッチングを選択的に実施することができる。
図面符号174は、データ線171とドレイン電極175とがまだ接続されている状態の導電体である。乾式エッチングを施す時、感光膜52、54の上部は、ある程度の厚さにエッチングされる。
図24は、本発明の他の実施例による液晶表示装置用薄膜トランジスタ基板の構造を示す配置図であり、図25は、図24に示す薄膜トランジスタ表示板のXXV-XXV´線による断面図である。構造に関しては、図1及び図2とほぼ同様である。
このような薄膜トランジスタ表示板の構造において、第1及び第2保護膜801、802の全てを或いは選択的に省略できる。
以上、本発明の好ましい実施例について詳細に説明したが、本発明の権利範囲は、これに限定されず、特許請求の範囲で定義している本発明の基本概念を利用した当業者の種々の変形及び改良形態もまた、本発明の権利範囲に属するものである。
121 ゲート線
124 ゲート電極
140 ゲート絶縁膜
151、154 半導体
161、163、165 オーミック接触部材(抵抗性接触部材)
171 データ線
173 ソース電極
175 ドレイン電極
180 保護膜
181、182、185、187 コンタクトホール(接触孔)
190 画素電極
81、82 接触補助部材
Claims (11)
- 絶縁基板上に形成されているゲート線、
前記ゲート線を覆うゲート絶縁膜、
前記ゲート絶縁膜上部に形成されている半導体、
前記ゲート絶縁膜上部に形成され、前記ゲート線と交差するデータ線及び前記データ線と分離されているドレイン電極、
前記画素電極の周縁と重なり、前記データ線と平行に配置されている導電体、
前記データ線及び前記ドレイン電極を覆い、前記ドレイン電極の一部を露出する第1接触孔を有する絶縁膜、
前記第1接触孔を通じて前記ドレイン電極と連結され、前記ゲート線と前記データ線によって囲まれた画素領域に配置されている画素電極、
を含む薄膜トランジスタ表示板において、
前記データ線は、互いに隣接する前記画素領域の前記画素電極のうちの一つと完全に重なって前記データ線の幅全体が前記画素電極により覆われている、薄膜トランジスタ表示板。 - 前記導電体は、フローティングされている、請求項1に記載の薄膜トランジスタ表示板。
- 前記画素電極の境界線は、前記導電体の上部に位置する、請求項1に記載の薄膜トランジスタ表示板。
- 前記絶縁膜は、有機絶縁物質からなる、請求項1に記載の薄膜トランジスタ表示板。
- 前記絶縁膜は、カラーフィルターを含む、請求項1に記載の薄膜トランジスタ表示板。
- 前記絶縁膜は、前記カラーフィルターの上部若しくは下部に形成されている保護膜を含む、請求項5に記載の薄膜トランジスタ表示板。
- 前記データ線と前記導電体との間を覆うブラックマトリックスをさらに含む、請求項1に記載の薄膜トランジスタ表示板。
- 前記画素領域を通る前記データ線の境界線は前記画素電極の境界線と平行である、請求項1に記載の薄膜トランジスタ表示板。
- 前記絶縁膜は、前記データ線の端部若しくは前記ゲート絶縁膜と共に前記ゲート線の端部を露出する第2接触孔を有し、
前記画素電極と同一層に形成され、前記第2接触孔を通じて前記データ線の端部または前記ゲート線の端部と各々連結されている接触補助部材をさらに含む請求項1に記載の薄膜トランジスタ表示板。 - 前記第2接触孔から前記ゲート線の端部または前記データ線の端部の境界線が露出されている、請求項9に記載の薄膜トランジスタ表示板。
- チャンネル部を除く前記半導体は、前記データ線及び前記ドレイン電極と同一形状に形成されている、請求項1に記載の薄膜トランジスタ表示板。
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