JP4721099B2 - 電気信号接続装置及びこれを用いたプローブ組立体並びにプローバ装置 - Google Patents

電気信号接続装置及びこれを用いたプローブ組立体並びにプローバ装置 Download PDF

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JP4721099B2
JP4721099B2 JP2005113874A JP2005113874A JP4721099B2 JP 4721099 B2 JP4721099 B2 JP 4721099B2 JP 2005113874 A JP2005113874 A JP 2005113874A JP 2005113874 A JP2005113874 A JP 2005113874A JP 4721099 B2 JP4721099 B2 JP 4721099B2
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film
probe
ribbon
contact
wiring
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Expired - Fee Related
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JP2005113874A
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JP2005300545A5 (enExample
JP2005300545A (ja
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軍生 木本
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  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2005113874A 2004-03-16 2005-03-14 電気信号接続装置及びこれを用いたプローブ組立体並びにプローバ装置 Expired - Fee Related JP4721099B2 (ja)

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JP2005113874A JP4721099B2 (ja) 2004-03-16 2005-03-14 電気信号接続装置及びこれを用いたプローブ組立体並びにプローバ装置

Applications Claiming Priority (3)

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JP2004117371 2004-03-16
JP2004117371 2004-03-16
JP2005113874A JP4721099B2 (ja) 2004-03-16 2005-03-14 電気信号接続装置及びこれを用いたプローブ組立体並びにプローバ装置

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JP2005300545A JP2005300545A (ja) 2005-10-27
JP2005300545A5 JP2005300545A5 (enExample) 2008-05-22
JP4721099B2 true JP4721099B2 (ja) 2011-07-13

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JP2005113874A Expired - Fee Related JP4721099B2 (ja) 2004-03-16 2005-03-14 電気信号接続装置及びこれを用いたプローブ組立体並びにプローバ装置

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Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5077736B2 (ja) * 2005-09-19 2012-11-21 軍生 木本 接触子組立体及びこれを用いたｌｓｉチップ検査装置
TWI398640B (zh) * 2005-09-19 2013-06-11 Gunsei Kimoto Contact assembly and its LSI wafer inspection device
JP4974022B2 (ja) * 2006-02-22 2012-07-11 軍生 木本 格子状配列プローブ組立体
TWI397696B (zh) * 2006-02-19 2013-06-01 Gunsei Kimoto Probe assembly
JP4974021B2 (ja) * 2006-02-19 2012-07-11 軍生 木本 プローブ組立体
JP4936275B2 (ja) * 2006-04-06 2012-05-23 軍生 木本 接触子組立体
JP2008003049A (ja) * 2006-06-26 2008-01-10 Micronics Japan Co Ltd プローブ組立体
JP5077735B2 (ja) * 2006-08-07 2012-11-21 軍生 木本 複数梁合成型接触子組立
JP2008122356A (ja) 2006-10-18 2008-05-29 Isao Kimoto プローブ
JP4924881B2 (ja) 2006-11-14 2012-04-25 軍生 木本 電気信号接続用座標変換装置
JP5030060B2 (ja) * 2007-08-01 2012-09-19 軍生 木本 電気信号接続装置
JP5077794B2 (ja) * 2007-08-02 2012-11-21 軍生 木本 プローブ組立体
JP2010054487A (ja) * 2008-08-26 2010-03-11 Isao Kimoto プローバ装置
TWI397691B (zh) * 2010-02-09 2013-06-01 Gunsei Kimoto Probe station device
KR101757617B1 (ko) 2016-01-21 2017-07-27 주식회사 이노글로벌 반도체 테스트용 양방향 도전성 패턴 모듈 및 이를 이용한 반도체 테스트 소켓, 반도체 테스트용 양방향 도전성 패턴 모듈의 제조 방법
KR102388030B1 (ko) * 2020-07-15 2022-04-20 (주)엠투엔 프로브 핀, 이를 제조하는 방법 및 이를 구비하는 프로브 카드
KR102377600B1 (ko) * 2020-08-06 2022-03-24 (주)티에스이 프로브 카드

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3446636B2 (ja) * 1998-11-20 2003-09-16 三菱マテリアル株式会社 コンタクトプローブ及びプローブ装置
JP2002082129A (ja) * 2000-09-08 2002-03-22 Mitsubishi Materials Corp コンタクトプローブ及びプローブ装置
JP4391717B2 (ja) * 2002-01-09 2009-12-24 富士通マイクロエレクトロニクス株式会社 コンタクタ及びその製造方法並びにコンタクト方法
JP2004069485A (ja) * 2002-08-06 2004-03-04 Yamaha Corp プローブユニットおよびその製造方法、プローブカードおよびその製造方法

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JP2005300545A (ja) 2005-10-27

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