JP4709862B2 - 大面積基板処理システムのサセプタ・ヒータアセンブリ - Google Patents
大面積基板処理システムのサセプタ・ヒータアセンブリ Download PDFInfo
- Publication number
- JP4709862B2 JP4709862B2 JP2008026586A JP2008026586A JP4709862B2 JP 4709862 B2 JP4709862 B2 JP 4709862B2 JP 2008026586 A JP2008026586 A JP 2008026586A JP 2008026586 A JP2008026586 A JP 2008026586A JP 4709862 B2 JP4709862 B2 JP 4709862B2
- Authority
- JP
- Japan
- Prior art keywords
- susceptor
- heater
- heater assembly
- guide
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/062—Easels, stands or shelves, e.g. castor-shelves, supporting means on vehicles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
200 ガイドサセプタ
300 リードサセプタ
Claims (5)
- 大面積基板処理システム内に配置されるサセプタ・ヒータアセンブリであって、
基板を加熱するための熱源を提供するヒータと、
前記ヒータの上面を覆い、かつ前記基板が載置されるリードサセプタと、
前記ヒータの側面を囲むガイドサセプタとを含み、
前記リードサセプタが、それぞれに分離可能な3つのパーツから構成され、
前記3つのパーツが、1つのセンターパート、及び前記センターパートの両側に配置される互いに対称な構造の2つのサイドパートであることを特徴とするサセプタ・ヒータアセンブリ。 - 前記センターパートの下部に、前記ガイドサセプタと結合するための突起が形成されていることを特徴とする請求項1に記載のサセプタ・ヒータアセンブリ。
- 前記ガイドサセプタが、互いに対称な構造で互いに対向するように配置され、それぞれの端部が結合している、それぞれに分離可能な一対の本体と、
前記本体の両端の間に取り付けられ、前記本体を支持する支持棒とを含むことを特徴とする請求項1又は2に記載のサセプタ・ヒータアセンブリ。 - 前記本体の両端上部に、前記リードサセプタと結合するための溝が形成されていることを特徴とする請求項3に記載のサセプタ・ヒータアセンブリ。
- 前記リードサセプタ及び前記ガイドサセプタが、石英、セラミック又はグラファイトから作られることを特徴とする請求項1〜4のいずれか一項に記載のサセプタ・ヒータアセンブリ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2007-0019994 | 2007-02-28 | ||
KR1020070019994A KR100830237B1 (ko) | 2007-02-28 | 2007-02-28 | 대면적 기판 처리 시스템의 서셉터 구조물 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008218995A JP2008218995A (ja) | 2008-09-18 |
JP4709862B2 true JP4709862B2 (ja) | 2011-06-29 |
Family
ID=39664518
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008026586A Expired - Fee Related JP4709862B2 (ja) | 2007-02-28 | 2008-02-06 | 大面積基板処理システムのサセプタ・ヒータアセンブリ |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4709862B2 (ja) |
KR (1) | KR100830237B1 (ja) |
CN (1) | CN101255547A (ja) |
TW (1) | TWI373817B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101224520B1 (ko) * | 2012-06-27 | 2013-01-22 | (주)이노시티 | 프로세스 챔버 |
KR102408403B1 (ko) * | 2015-11-04 | 2022-06-14 | (주)포인트엔지니어링 | 서셉터 및 이를 포함하는 진공챔버 |
WO2020023409A1 (en) * | 2018-07-24 | 2020-01-30 | Applied Materials, Inc. | Optically transparent pedestal for fluidly supporting a substrate |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007042845A (ja) * | 2005-08-03 | 2007-02-15 | Furukawa Co Ltd | サセプタ及び気相成長装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2546414B2 (ja) * | 1990-07-06 | 1996-10-23 | 日新電機株式会社 | 気相成長装置 |
KR980005304U (ko) * | 1996-06-29 | 1998-03-30 | 고주파를 이용하는 반도체 제조장비의 잡음원 차폐및 챔버 가열장치 | |
JPH10204645A (ja) | 1997-01-17 | 1998-08-04 | Hitachi Electron Eng Co Ltd | 下部電極 |
JP4024497B2 (ja) * | 2001-07-25 | 2007-12-19 | シャープ株式会社 | 異物除去機構,液流処理装置および異物除去方法 |
KR100588774B1 (ko) * | 2001-11-26 | 2006-06-14 | 주성엔지니어링(주) | 웨이퍼 서셉터 |
TWI412621B (zh) * | 2004-07-16 | 2013-10-21 | Applied Materials Inc | 具有遮蔽板的陰影框 |
-
2007
- 2007-02-28 KR KR1020070019994A patent/KR100830237B1/ko not_active IP Right Cessation
-
2008
- 2008-02-06 JP JP2008026586A patent/JP4709862B2/ja not_active Expired - Fee Related
- 2008-02-27 TW TW097106814A patent/TWI373817B/zh not_active IP Right Cessation
- 2008-02-28 CN CNA2008100815223A patent/CN101255547A/zh active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007042845A (ja) * | 2005-08-03 | 2007-02-15 | Furukawa Co Ltd | サセプタ及び気相成長装置 |
Also Published As
Publication number | Publication date |
---|---|
KR100830237B1 (ko) | 2008-05-16 |
CN101255547A (zh) | 2008-09-03 |
TW200839926A (en) | 2008-10-01 |
JP2008218995A (ja) | 2008-09-18 |
TWI373817B (en) | 2012-10-01 |
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