JP5393166B2 - 基板焼成装置 - Google Patents
基板焼成装置 Download PDFInfo
- Publication number
- JP5393166B2 JP5393166B2 JP2009004032A JP2009004032A JP5393166B2 JP 5393166 B2 JP5393166 B2 JP 5393166B2 JP 2009004032 A JP2009004032 A JP 2009004032A JP 2009004032 A JP2009004032 A JP 2009004032A JP 5393166 B2 JP5393166 B2 JP 5393166B2
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- JP
- Japan
- Prior art keywords
- substrate
- support
- baking apparatus
- present
- baking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B17/00—Furnaces of a kind not covered by any preceding group
- F27B17/0016—Chamber type furnaces
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B5/00—Muffle furnaces; Retort furnaces; Other furnaces in which the charge is held completely isolated
- F27B5/04—Muffle furnaces; Retort furnaces; Other furnaces in which the charge is held completely isolated adapted for treating the charge in vacuum or special atmosphere
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B5/00—Muffle furnaces; Retort furnaces; Other furnaces in which the charge is held completely isolated
- F27B5/06—Details, accessories, or equipment peculiar to furnaces of these types
- F27B5/14—Arrangements of heating devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D5/00—Supports, screens, or the like for the charge within the furnace
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Furnace Details (AREA)
- Furnace Housings, Linings, Walls, And Ceilings (AREA)
- Furnace Charging Or Discharging (AREA)
- Muffle Furnaces And Rotary Kilns (AREA)
Description
10 基板焼成装置
20 放熱板
21、421 加熱部
30、430、530、630、730 第1支持部
30a、430a、530a、630a、730a 支持フレーム
30b、430b、530b、630b、730b 支持ピン
40、440、540、640、740 第2支持部
50 ゲート部
50a 第1位置制御手段
50b 第2位置制御手段
50c 第3位置制御手段
51 全体位置制御手段
60a 搬送アーム
60b ベースアーム
Claims (6)
- 焼成炉の内部に熱を供給して基板を焼成温度で加熱する加熱部と、
前記基板が積載されるように内側面に水平に設置される支持フレーム及び前記支持フレームの一領域から中央部側へ突出する少なくとも1つの支持ピンとを備え、上下方向に一定間隔で設置される石英材質の第1支持部と、
前記第1支持部の前記支持ピン上に配置されて前記基板下部面の枠と線接触又は面接触するように設置される棒状又はフラット状である石英材質の第2支持部と、を有することを特徴とする基板焼成装置。 - 前記支持フレームは、前記基板が出し入れされる方向と垂直となる両側の内面に対向するように設置されることを特徴とする請求項1に記載の基板焼成装置。
- 前記支持フレームは、前記基板が出し入れされる面の一領域を除いた焼成炉の内側面に設置されることを特徴とする請求項1に記載の基板焼成装置。
- 前記加熱部は、前記焼成炉の外面に設置されることを特徴とする請求項1に記載の基板焼成装置。
- 前記加熱部は、電熱ヒータと、前記電熱ヒータが設置され熱を拡散させる放熱板とを有することを特徴とする請求項1に記載の基板焼成装置。
- 前記焼成炉の前面に前記基板の出し入れが可能なように形成されたゲート部を更に有することを特徴とする請求項1に記載の基板焼成装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2008-0063872 | 2008-07-02 | ||
KR20080063872A KR101479302B1 (ko) | 2008-07-02 | 2008-07-02 | 기판 소성 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010014397A JP2010014397A (ja) | 2010-01-21 |
JP5393166B2 true JP5393166B2 (ja) | 2014-01-22 |
Family
ID=41464656
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009004032A Active JP5393166B2 (ja) | 2008-07-02 | 2009-01-09 | 基板焼成装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9052145B2 (ja) |
JP (1) | JP5393166B2 (ja) |
KR (1) | KR101479302B1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5583516B2 (ja) * | 2010-08-17 | 2014-09-03 | 光洋サーモシステム株式会社 | ワーク積載装置 |
JP5731808B2 (ja) | 2010-12-06 | 2015-06-10 | 光洋サーモシステム株式会社 | ワーク積載装置 |
JP5637635B2 (ja) * | 2012-10-09 | 2014-12-10 | 東亜工業株式会社 | 多段式加熱炉システム |
JP5877878B2 (ja) * | 2014-06-23 | 2016-03-08 | 光洋サーモシステム株式会社 | ワーク積載装置 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB9021873D0 (en) * | 1990-10-09 | 1990-11-21 | Groom Bryan Ltd | Ware support apparatus |
US5607009A (en) * | 1993-01-28 | 1997-03-04 | Applied Materials, Inc. | Method of heating and cooling large area substrates and apparatus therefor |
TW323633U (en) * | 1995-09-07 | 1997-12-21 | Samsung Electronics Co Ltd | Cassette for loading glasses for liquid crystal display device |
JP2001151524A (ja) * | 1999-11-22 | 2001-06-05 | Canon Inc | 焼成炉におけるガラス基板支持機構 |
JP2001328870A (ja) * | 2000-05-19 | 2001-11-27 | Taiyo Yuden Co Ltd | セラミックの焼成方法、トンネル式焼成炉、セラミック電子部品の製造方法及び装置、セラミック電子部品の焼成用収納体 |
KR100507274B1 (ko) | 2000-12-30 | 2005-08-10 | 비오이 하이디스 테크놀로지 주식회사 | 글라스 적재용 카세트 |
TW522448B (en) * | 2001-10-22 | 2003-03-01 | Advanced Semiconductor Eng | Semiconductor wafer carrying apparatus |
KR100870661B1 (ko) * | 2002-03-15 | 2008-11-26 | 엘지디스플레이 주식회사 | 기판 수납용 카세트 |
TW553195U (en) * | 2002-10-09 | 2003-09-11 | Foxsemicon Integrated Tech Inc | Substrate supporting slot plate and substrate cassette using the same |
KR100675627B1 (ko) * | 2002-10-10 | 2007-02-01 | 엘지.필립스 엘시디 주식회사 | 기판 수납용 카세트 |
KR100551683B1 (ko) | 2003-11-21 | 2006-02-13 | (주)상아프론테크 | 글래스 수납 카세트 |
KR101010481B1 (ko) * | 2003-12-13 | 2011-01-21 | 엘지디스플레이 주식회사 | 기판 거치대 |
KR100586094B1 (ko) * | 2004-03-10 | 2006-06-01 | (주)와이에스썸텍 | 디스플레이 평판의 다단식 건조/소성로 |
JP2005340480A (ja) * | 2004-05-26 | 2005-12-08 | Nippon Oil Corp | 基板カセット用サポートバー |
TWI282771B (en) * | 2004-07-26 | 2007-06-21 | Au Optronics Corp | A support device of a cassette |
KR100582373B1 (ko) | 2004-09-03 | 2006-05-22 | 요도가와 휴텍 가부시키가이샤 | 대형 기판용 카세트 |
KR100928926B1 (ko) * | 2004-12-29 | 2009-11-30 | 엘지디스플레이 주식회사 | 액정표시장치의 실 경화공정 중 얼룩무늬 발생을감소시키는 랙 바구조를 가지는 실 경화로 |
JP4542998B2 (ja) * | 2005-07-15 | 2010-09-15 | 日本電産サンキョー株式会社 | 基板搬出搬入補助装置 |
JP4745002B2 (ja) * | 2005-09-22 | 2011-08-10 | オリンパス株式会社 | スライドガラスカセット |
JP4544179B2 (ja) * | 2006-02-28 | 2010-09-15 | 株式会社デンソー | セラミック基板の製造方法 |
JP2008085206A (ja) * | 2006-09-28 | 2008-04-10 | Covalent Materials Corp | 半導体ウェーハ熱処理用ボートおよび半導体ウェーハの熱処理方法 |
US20080145533A1 (en) * | 2006-11-29 | 2008-06-19 | Hitachi Kokusai Electric Inc. | Substrate processing apparatus and substrate processing method |
-
2008
- 2008-07-02 KR KR20080063872A patent/KR101479302B1/ko active IP Right Grant
-
2009
- 2009-01-09 JP JP2009004032A patent/JP5393166B2/ja active Active
- 2009-07-02 US US12/458,184 patent/US9052145B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2010014397A (ja) | 2010-01-21 |
US9052145B2 (en) | 2015-06-09 |
US20100003629A1 (en) | 2010-01-07 |
KR101479302B1 (ko) | 2015-01-05 |
KR20100003845A (ko) | 2010-01-12 |
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