JP5731808B2 - ワーク積載装置 - Google Patents
ワーク積載装置 Download PDFInfo
- Publication number
- JP5731808B2 JP5731808B2 JP2010270999A JP2010270999A JP5731808B2 JP 5731808 B2 JP5731808 B2 JP 5731808B2 JP 2010270999 A JP2010270999 A JP 2010270999A JP 2010270999 A JP2010270999 A JP 2010270999A JP 5731808 B2 JP5731808 B2 JP 5731808B2
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- support
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- workpiece
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- Prior art date
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- 239000010453 quartz Substances 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 description 8
- 238000010304 firing Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B5/00—Muffle furnaces; Retort furnaces; Other furnaces in which the charge is held completely isolated
- F27B5/06—Details, accessories, or equipment peculiar to furnaces of these types
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D5/00—Supports, screens, or the like for the charge within the furnace
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
Description
21A,21B−第1の支柱
22A,22B−第2の支柱
31A,31B−第1の支持部材
32A,32B−第2の支持部材
33−第3の支持部材
W−ワーク
Claims (6)
- 矩形の板状体であるワークの底面に当接する複数の支持部材を、上下方向に沿って等間隔に配置された複数の支持位置の各々で保持する複数の支柱を備えたワーク積載装置において、
前記複数の支柱は、各々が水平面内で前記ワークより大きい矩形状の領域の対向する1対の辺の各々の一端および他端にそれぞれ配置される2本の第1の支柱および2本の第2の支柱からなり、
前記複数の支持部材は、前記2本の第1の支柱のそれぞれから、平面視で前記2本の第1の支柱を結ぶ前記矩形状の領域の辺に平行に突設される棒状の第1の支持部材であって互いの間に間隙を設けて配置される第1の支持部材と、隣接する前記第1および第2の支柱に、前記矩形状の領域の内側、かつ、平面視で隣接する第1および第2の支柱を結ぶ前記矩形状の領域の辺に平行に保持される単一の棒体である第2の支持部材と、を含み、
前記第1及び第2の支柱の前記複数の支持位置には前記矩形状の領域内に水平方向に延出する複数の受け具が設けられ、
前記第1の支柱の前記複数の受け具の各々は、上面が前記第1の支持部材の上面と同一の水平面内に位置し、前記第2の支持部材の第1の端部が上方から嵌入する凹部であって前記第2の支持部材の外径に等しい深さの凹部を有し、
前記第2の支柱の前記複数の受け具の各々は、前記第2の支持部材の第2の端部が上方から嵌入する凹部を有するワーク積載装置。 - 前記複数の支持部材は、前記2本の第2の支柱に、前記2本の第2の支柱を結ぶ前記矩形状の領域の辺に平行に保持される単一の棒体からなる第3の支持部材をさらに備える請求項1に記載のワーク積載装置。
- 前記第2の支柱の前記複数の受け具は、前記第3の支持部材の端部が嵌入する凹部をさらに有する請求項2に記載のワーク積載装置。
- 前記第2の支柱の前記複数の支持位置のそれぞれに、前記第2の支持部材の第2の端部が上方から嵌入する凹部と、前記第3の支持部材の端部が上方から嵌入する凹部と、が形成された単一の受け具を設けた請求項3に記載のワーク積載装置。
- 前記第2の支柱の前記複数の受け具の各々の前記第2の支持部材の第2の端部が上方から嵌入する凹部は、前記第2の支持部材の外径より浅い請求項1乃至4の何れかに記載のワーク積載装置。
- 前記第2の支持部材及び/又は前記第3の支持部材は、石英を素材とする請求項2乃至5の何れかに記載のワーク積載装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010270999A JP5731808B2 (ja) | 2010-12-06 | 2010-12-06 | ワーク積載装置 |
KR1020110072058A KR101699903B1 (ko) | 2010-12-06 | 2011-07-20 | 워크 적재 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010270999A JP5731808B2 (ja) | 2010-12-06 | 2010-12-06 | ワーク積載装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012122619A JP2012122619A (ja) | 2012-06-28 |
JP5731808B2 true JP5731808B2 (ja) | 2015-06-10 |
Family
ID=46504245
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010270999A Active JP5731808B2 (ja) | 2010-12-06 | 2010-12-06 | ワーク積載装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5731808B2 (ja) |
KR (1) | KR101699903B1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108981395B (zh) * | 2018-06-12 | 2020-02-07 | 京东方科技集团股份有限公司 | 一种炉体组装结构及热处理设备 |
JP7318090B1 (ja) | 2022-10-26 | 2023-07-31 | 株式会社ノリタケカンパニーリミテド | 縦型加熱炉 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001127147A (ja) * | 1999-10-27 | 2001-05-11 | Kanegafuchi Chem Ind Co Ltd | 熱処理用キャリア |
KR100488519B1 (ko) * | 2002-11-21 | 2005-05-11 | 삼성전자주식회사 | Lcd용 글라스 적재 카세트 |
KR100575160B1 (ko) * | 2004-08-30 | 2006-04-28 | 삼성전자주식회사 | 기판 적재용 카세트 |
KR101479302B1 (ko) | 2008-07-02 | 2015-01-05 | 삼성디스플레이 주식회사 | 기판 소성 장치 |
JP3160629U (ja) * | 2010-04-19 | 2010-07-01 | 富源磁器股▲分▼有限公司 | 一体型多層式焼成載置装置 |
JP2011226690A (ja) * | 2010-04-19 | 2011-11-10 | Bell New Ceramics Co Ltd | 一体型多層式焼成載置装置 |
JP5583516B2 (ja) * | 2010-08-17 | 2014-09-03 | 光洋サーモシステム株式会社 | ワーク積載装置 |
-
2010
- 2010-12-06 JP JP2010270999A patent/JP5731808B2/ja active Active
-
2011
- 2011-07-20 KR KR1020110072058A patent/KR101699903B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR101699903B1 (ko) | 2017-01-25 |
KR20120062604A (ko) | 2012-06-14 |
JP2012122619A (ja) | 2012-06-28 |
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