JP4697231B2 - セラミック電子部品 - Google Patents
セラミック電子部品 Download PDFInfo
- Publication number
- JP4697231B2 JP4697231B2 JP2007546367A JP2007546367A JP4697231B2 JP 4697231 B2 JP4697231 B2 JP 4697231B2 JP 2007546367 A JP2007546367 A JP 2007546367A JP 2007546367 A JP2007546367 A JP 2007546367A JP 4697231 B2 JP4697231 B2 JP 4697231B2
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- sintered body
- black
- ceramic sintered
- ceramic layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000919 ceramic Substances 0.000 title claims description 246
- 239000004020 conductor Substances 0.000 claims description 48
- 101100513612 Microdochium nivale MnCO gene Proteins 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims 1
- 239000003990 capacitor Substances 0.000 description 23
- 229910052751 metal Inorganic materials 0.000 description 17
- 239000002184 metal Substances 0.000 description 17
- 239000000843 powder Substances 0.000 description 16
- 239000003550 marker Substances 0.000 description 13
- 238000010304 firing Methods 0.000 description 9
- 229910010413 TiO 2 Inorganic materials 0.000 description 8
- 229910021193 La 2 O 3 Inorganic materials 0.000 description 7
- 229910017493 Nd 2 O 3 Inorganic materials 0.000 description 7
- 239000011230 binding agent Substances 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 5
- 230000035699 permeability Effects 0.000 description 5
- 239000006103 coloring component Substances 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000007847 structural defect Effects 0.000 description 3
- WUOACPNHFRMFPN-SECBINFHSA-N (S)-(-)-alpha-terpineol Chemical compound CC1=CC[C@@H](C(C)(C)O)CC1 WUOACPNHFRMFPN-SECBINFHSA-N 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 2
- 239000001856 Ethyl cellulose Substances 0.000 description 2
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910001252 Pd alloy Inorganic materials 0.000 description 2
- OVKDFILSBMEKLT-UHFFFAOYSA-N alpha-Terpineol Natural products CC(=C)C1(O)CCC(C)=CC1 OVKDFILSBMEKLT-UHFFFAOYSA-N 0.000 description 2
- 229940088601 alpha-terpineol Drugs 0.000 description 2
- 235000019325 ethyl cellulose Nutrition 0.000 description 2
- 229920001249 ethyl cellulose Polymers 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G7/00—Capacitors in which the capacitance is varied by non-mechanical means; Processes of their manufacture
- H01G7/06—Capacitors in which the capacitance is varied by non-mechanical means; Processes of their manufacture having a dielectric selected for the variation of its permittivity with applied voltage, i.e. ferroelectric capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Ceramic Capacitors (AREA)
- Coils Or Transformers For Communication (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007546367A JP4697231B2 (ja) | 2005-11-28 | 2006-08-23 | セラミック電子部品 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005342645 | 2005-11-28 | ||
JP2005342645 | 2005-11-28 | ||
JP2007546367A JP4697231B2 (ja) | 2005-11-28 | 2006-08-23 | セラミック電子部品 |
PCT/JP2006/316466 WO2007060774A1 (ja) | 2005-11-28 | 2006-08-23 | セラミック電子部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2007060774A1 JPWO2007060774A1 (ja) | 2009-05-07 |
JP4697231B2 true JP4697231B2 (ja) | 2011-06-08 |
Family
ID=38067011
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007546367A Expired - Fee Related JP4697231B2 (ja) | 2005-11-28 | 2006-08-23 | セラミック電子部品 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4697231B2 (zh) |
CN (1) | CN101273421B (zh) |
TW (1) | TW200721210A (zh) |
WO (1) | WO2007060774A1 (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6024353B2 (ja) * | 2012-10-02 | 2016-11-16 | 株式会社村田製作所 | 積層型電子部品 |
KR20140071724A (ko) * | 2012-12-04 | 2014-06-12 | 삼성전기주식회사 | 적층 세라믹 전자부품 |
JP5888277B2 (ja) * | 2013-04-04 | 2016-03-16 | Tdk株式会社 | 黒色マーク組成物およびこれを用いた電子部品 |
KR102267242B1 (ko) * | 2017-05-15 | 2021-06-21 | 가부시키가이샤 무라타 세이사쿠쇼 | 적층형 전자부품 및 적층형 전자부품의 제조 방법 |
CN109686695A (zh) * | 2018-12-25 | 2019-04-26 | 上海致领半导体科技发展有限公司 | 一种晶圆承载盘的标记识别装置及方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05299294A (ja) * | 1992-04-16 | 1993-11-12 | Murata Mfg Co Ltd | 電子部品の製造方法 |
JPH1116701A (ja) * | 1997-06-23 | 1999-01-22 | Matsushita Electric Ind Co Ltd | 多連チップ抵抗器 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52131146A (en) * | 1976-04-27 | 1977-11-02 | Seiko Instr & Electronics | Trimmer capacitor |
JPH0747862Y2 (ja) * | 1990-09-29 | 1995-11-01 | 太陽誘電株式会社 | 表示入り積層セラミック電子部品 |
JP3206496B2 (ja) * | 1997-06-02 | 2001-09-10 | 昭栄化学工業株式会社 | 金属粉末及びその製造方法 |
JP3799933B2 (ja) * | 2000-02-09 | 2006-07-19 | 株式会社村田製作所 | 導電性ペーストおよびセラミック電子部品 |
JP3736802B2 (ja) * | 2002-11-25 | 2006-01-18 | Tdk株式会社 | 導電性組成物とセラミック電子部品 |
-
2006
- 2006-08-16 TW TW095130016A patent/TW200721210A/zh not_active IP Right Cessation
- 2006-08-23 CN CN2006800354071A patent/CN101273421B/zh not_active Expired - Fee Related
- 2006-08-23 JP JP2007546367A patent/JP4697231B2/ja not_active Expired - Fee Related
- 2006-08-23 WO PCT/JP2006/316466 patent/WO2007060774A1/ja active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05299294A (ja) * | 1992-04-16 | 1993-11-12 | Murata Mfg Co Ltd | 電子部品の製造方法 |
JPH1116701A (ja) * | 1997-06-23 | 1999-01-22 | Matsushita Electric Ind Co Ltd | 多連チップ抵抗器 |
Also Published As
Publication number | Publication date |
---|---|
TWI313015B (zh) | 2009-08-01 |
JPWO2007060774A1 (ja) | 2009-05-07 |
CN101273421B (zh) | 2011-02-16 |
CN101273421A (zh) | 2008-09-24 |
TW200721210A (en) | 2007-06-01 |
WO2007060774A1 (ja) | 2007-05-31 |
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