WO2007060774A1 - セラミック電子部品 - Google Patents
セラミック電子部品 Download PDFInfo
- Publication number
- WO2007060774A1 WO2007060774A1 PCT/JP2006/316466 JP2006316466W WO2007060774A1 WO 2007060774 A1 WO2007060774 A1 WO 2007060774A1 JP 2006316466 W JP2006316466 W JP 2006316466W WO 2007060774 A1 WO2007060774 A1 WO 2007060774A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- ceramic
- sintered body
- black
- ceramic sintered
- ceramic layer
- Prior art date
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 260
- 239000004020 conductor Substances 0.000 claims abstract description 55
- 101100513612 Microdochium nivale MnCO gene Proteins 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims 1
- 239000003550 marker Substances 0.000 abstract description 15
- 239000006103 coloring component Substances 0.000 abstract description 5
- 238000009792 diffusion process Methods 0.000 abstract description 3
- 238000003475 lamination Methods 0.000 abstract description 2
- 230000005764 inhibitory process Effects 0.000 abstract 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 abstract 1
- 239000011656 manganese carbonate Substances 0.000 abstract 1
- 235000006748 manganese carbonate Nutrition 0.000 abstract 1
- 229910000016 manganese(II) carbonate Inorganic materials 0.000 abstract 1
- 239000003990 capacitor Substances 0.000 description 23
- 229910052751 metal Inorganic materials 0.000 description 17
- 239000002184 metal Substances 0.000 description 17
- 239000000843 powder Substances 0.000 description 16
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 13
- 239000002904 solvent Substances 0.000 description 7
- 239000011230 binding agent Substances 0.000 description 6
- 238000010304 firing Methods 0.000 description 6
- 230000035699 permeability Effects 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000007847 structural defect Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910001252 Pd alloy Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- -1 noradium Chemical compound 0.000 description 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 1
- 229910052705 radium Inorganic materials 0.000 description 1
- HCWPIIXVSYCSAN-UHFFFAOYSA-N radium atom Chemical compound [Ra] HCWPIIXVSYCSAN-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G7/00—Capacitors in which the capacitance is varied by non-mechanical means; Processes of their manufacture
- H01G7/06—Capacitors in which the capacitance is varied by non-mechanical means; Processes of their manufacture having a dielectric selected for the variation of its permittivity with applied voltage, i.e. ferroelectric capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
Definitions
- the present invention relates to a ceramic electronic component that needs to identify the orientation of the component in terms of assembly and mounting, and more particularly to a ceramic electronic component such as a trimmer capacitor in which an internal conductor is unevenly distributed.
- FIG. 7 is a schematic cross-sectional view showing a conventional trimmer capacitor.
- the trimmer capacitor 500 includes a ceramic sintered body 503 in which a plurality of ceramic layers 502 are laminated, and an internal structure that is disposed between the ceramic layers 502 and drawn to the side surface of the ceramic sintered body 503.
- a stator 501 is provided which includes a conductor 504, outer conductors 505a and 505b formed on a side surface of the ceramic sintered body 503, and the like.
- a metal rotor 507 is disposed on the upper portion of the stator 501, and terminal electrodes 508 and protrusions 509 formed on the lower portion of the rotor 507 are in contact with the upper surface of the ceramic sintered body 503.
- the rotor 507 is covered with a metal cover 511 via a spring washer 510.
- a terminal 512 formed by extending a part of the metal cover 511 is electrically connected to the external conductor 505b on the side surface of the ceramic sintered body 503.
- the metal cover 511 is provided with a through hole 513, and a screwdriver is inserted into the driver groove 514 formed in the rotor 507 through the through hole 513.
- Patent Document 1 TiO and Mn are interposed between ceramic layers.
- a ceramic paste containing O is printed and baked to form a marker.
- Patent Document 1 Japanese Utility Model Publication 7-47862
- the marker formed between the ceramic layers and the internal electrode formed between the ceramic layers are arranged so as to overlap in the stacking direction of the ceramic layers. For this reason, the portion where the marker and the internal electrode overlap with each other becomes thicker than other portions, which may cause structural defects in the ceramic sintered body.
- the marker strength coloring component may diffuse into the ceramic layer and reach the internal electrode during baking, which may reduce the reliability of the ceramic electronic component.
- a marker may be formed on the surface of the ceramic sintered body after the ceramic sintered body is produced. As described, problems such as mounting defects may occur.
- the present invention solves the above-described problem, and can identify the directionality of the ceramic electronic component by the marker formed inside, and can diffuse the coloring component from the marker. It is an object to provide a ceramic electronic component which is suppressed and reliability is not lowered.
- a ceramic electronic component comprises a ceramic sintered body comprising a plurality of ceramic layers containing La oxide and Ti oxide, and having one main surface, the other main surface, and side surfaces; An inner conductor disposed between the ceramic layers and drawn out to a side surface of the ceramic sintered body; an outer conductor formed on a side surface of the ceramic sintered body and electrically connected to the inner conductor; Mn oxide and Fe oxide are converted into MnCO equivalents between the layers of the ceramic layer and on one main surface side of the ceramic sintered body from the middle point of the thickness of the ceramic sintered body.
- a black ceramic layer is disposed, and the inner conductor and the black ceramic layer are disposed so as not to substantially overlap in the stacking direction of the ceramic layers.
- the inner conductor is disposed on the other main surface side of the ceramic sintered body from a middle point of the thickness of the ceramic sintered body.
- the other main body of the ceramic sintered body In the ceramic electronic component according to the present invention, the other main body of the ceramic sintered body.
- a terminal electrode may be provided outside the ceramic sintered body so as to be in contact with the surface and to face the internal conductor.
- the terminal electrode may be provided so as to be slidably in contact with the other main surface of the ceramic sintered body.
- the ceramic layer may have a dielectric force, and a capacitor may be formed between the inner conductor and the terminal electrode.
- Mn oxide and Fe oxide are converted into MnCO equivalent and Fe O equivalent, respectively.
- the black ceramic layer contained in 3 2 3 so as to have a weight ratio of 3: 2 to 1: 3 serves as a marker.
- the Mn oxide and Fe oxide contained in this black ceramic layer react with La oxide and Ti oxide contained in the adjacent ceramic layer, and as a result, LaFe is present at the interface between the black ceramic layer and the ceramic layer.
- Ti 2 O phase is formed.
- This LaFe Ti O phase itself is black
- Mn oxide and Fe oxide are respectively MnCO converted and Fe O converted 3: 2-1
- FIG. 1 is a schematic cross-sectional view and a schematic bottom view showing a stator that constitutes a part of a trimmer capacitor in Embodiment 1.
- FIG. 1 is a schematic cross-sectional view and a schematic bottom view showing a stator that constitutes a part of a trimmer capacitor in Embodiment 1.
- FIG. 2 is a schematic cross-sectional view showing a trimmer capacitor using the stator 101 shown in FIG.
- FIG. 3 is a schematic cross-sectional view and a schematic bottom view showing a stator that constitutes a part of the trimmer capacitor in Embodiment 2.
- FIG. 4 is a schematic cross-sectional view showing a trimmer capacitor using the stator 201 shown in FIG.
- FIG. 5 is a schematic sectional view showing a ceramic sintered body used in Experimental Example 1.
- FIG. 6 is a schematic cross-sectional view showing an unfired ceramic laminate used in Experimental Example 2.
- FIG. 7 is a schematic cross-sectional view showing a conventional trimmer capacitor.
- FIG. 1 is a schematic sectional view and a schematic bottom view showing a stator constituting a part of the trimmer capacitor in the present embodiment.
- the stator 101 is disposed between the ceramic sintered body 103 in which a plurality of ceramic layers 102 are laminated and the ceramic layer 102, and is drawn out to the side surface of the ceramic sintered body 103.
- the inner conductor 104 is formed on the side surface of the ceramic sintered body 103, and the outer conductor 105a electrically connected to the inner conductor 104 is opposed to the side surface of the ceramic sintered body 103 where the outer conductor 105a is formed.
- An outer conductor 105b formed on the side surface, and a black ceramic layer 106 disposed between the ceramic layers 102.
- the ceramic layer 102 contains La oxide and Ti oxide.
- Such as ceramic For example, CaO-La O—TiO—Nd O-based ceramics, BaO—TiO—La O—N
- the internal conductor 104 is disposed so as not to overlap the black ceramic layer 106 in the stacking direction of the ceramic layers 102. For this reason, a portion where the internal conductor 104 and the black ceramic layer 106 overlap is suppressed from being locally thick, and structural defects of the ceramic sintered body 103 can be prevented.
- the internal conductor 104 is disposed on the bottom surface side of the ceramic sintered body 103 from the midpoint of the thickness of the ceramic sintered body 103 (distance from the top surface to the bottom surface). I like it. This makes it easier to form a capacitance in a trimmer capacitor described later.
- the internal electrode 104 for example, gold, silver, copper, iron ⁇ radium, silver Z palladium alloy, nickel, etc. can be used.
- outer conductors 105a and 105b for example, gold, silver, noradium, silver Z palladium alloy, or the like can be used.
- the black ceramic layer 106 functions as a marker that indicates the upper and lower sides of the ceramic sintered body 103. Since it is black, even if the ceramic sintered body 103 is made of a dark ceramic such as green or brown, it can be identified as a marker. As shown in FIG. 1, the color indication of the black ceramic layer 106 can be clearly identified from the bottom surface of the ceramic sintered body 103. Although not shown, the black ceramic layer 106 appears lighter than the color at which the bottom force can be seen from the upper surface of the ceramic sintered body 103 or not at all. This difference in appearance makes it possible to determine that the black ceramic layer 106 is located on the bottom surface side (one main surface side) of the ceramic sintered body 103.
- the black ceramic layer 106 contains Mn oxide and Fe oxide in terms of MnCO, F
- the stator 101 is manufactured as follows, for example. First, a ceramic slurry in which ceramic powder, an organic binder, and a solvent are mixed is formed into a sheet shape, and a ceramic green sheet constituting the ceramic layer 102 after firing is produced.
- a metal powder, an organic binder, and a solvent are mixed to produce a conductive paste that constitutes the internal conductor 104 after firing, and is printed on the ceramic green sheet.
- ceramic paste containing La oxide and Ti oxide, organic noda, and solvent are mixed to produce a ceramic paste constituting the black ceramic layer 106 after firing, and printed on the ceramic dust sheet.
- the ratio of the ceramic powder in the ceramic paste is preferably 30 to 70% by weight. If it is less than 30% by weight, the color may not be sufficiently developed. If it exceeds 70% by weight, it may be difficult to produce a paste.
- ceramic green sheets are laminated to produce an unfired ceramic laminate.
- the unfired ceramic laminate is fired to obtain a fired ceramic laminate.
- a metal powder, an organic binder, and a solvent are mixed to produce a conductive paste constituting the external conductors 105a and 105b after firing, and a conductive paste is baked on the side surface of the fired ceramic laminate.
- Outer conductors 105a and 105b are formed.
- FIG. 2 is a schematic cross-sectional view showing a trimmer capacitor using the stator 101 shown in FIG.
- a metal rotor 107 is disposed on the upper portion of the stator 101, and the terminal electrode 108 and the protrusion 109 formed on the lower portion of the rotor 107 are connected to one main surface of the ceramic sintered body 103. It touches.
- the rotor 107 is covered with a metal cover 111 via a spring washer 110.
- a terminal 112 formed by extending a part of the metal cover 111 is electrically connected to the external conductor 105b on the side surface of the ceramic sintered body 103.
- a through hole 113 is provided in the metal cover 111, and a driver is inserted into the driver groove 114 formed in the rotor 107 through the through hole 113.
- a capacitance is formed between the inner conductor 104 and the terminal electrode 108, and the capacitance is changed by rotating the rotor 107 with a driver.
- the lower force is also placed in the order of the metal cover 111, the spring washer 110, the rotor 107, and the stator 101, and the external electrode 105a and the terminal 112 are soldered.
- the stator 101 is upside down, a desired capacity cannot be formed. Therefore, the stator 101 is placed with the other main surface that can identify the black ceramic layer 106 facing upward.
- the ceramic layer 102 may be composed of a force resistor that exemplifies a dielectric ceramic as a material constituting the ceramic layer 102 or a semiconductor ceramic.
- the structure shown in FIG. 1 alone can function as a chip resistor or chip thermistor.
- the black ceramic layer 106 functions as a marker for identifying the upper and lower sides when the board is mounted.
- the ceramic layer 102 is formed of a resistor, it can function as a variable resistor if the structure shown in FIG. 2 is adopted.
- FIG. 3 is a schematic cross-sectional view and a schematic bottom view showing a stator constituting a part of the trimmer capacitor in the present embodiment.
- the stator 201 is disposed between the ceramic sintered body 203 in which a plurality of ceramic layers 202 are laminated and the ceramic layer 202, and is drawn out to a side surface of the ceramic sintered body 203.
- the stator in the present embodiment differs from that in the first embodiment in the arrangement of the internal electrodes and the black ceramic layer. Other configurations are the same as those of the first embodiment, and the description thereof is omitted.
- FIG. 4 is a schematic cross-sectional view showing a trimmer capacitor using the stator 201 shown in FIG.
- a metal rotor 207 is disposed on the upper portion of the stator 201, and the terminal electrode 208 and the protrusion 209 formed on the lower portion of the rotor 207 are connected to one main surface of the ceramic sintered body 203. It touches.
- the rotor 207 is covered with a metal cover 211 via a spring washer 210.
- a through hole 213 is provided in the metal cover 211, and a driver is inserted into the driver groove 214 formed in the rotor 207 through the through hole 213.
- trimmer capacitor 200 a capacitance is formed between inner conductors 204a and 204b and terminal electrode 208, and the capacitance is changed by rotating rotor 207 with a screwdriver.
- the trimmer capacitor in the present embodiment differs from that in the first embodiment in the arrangement of internal electrodes, the arrangement of the black ceramic layer, the structure of the rotor, the structure of the metal cover, and the location where the capacitance is formed. Other configurations are the same as those of the first embodiment, and the description thereof is omitted.
- the ceramic layer 202 may be made of a force resistor that exemplifies a dielectric ceramic as a material constituting the ceramic layer 202, or a semiconductor ceramic.
- the structure shown in FIG. 3 alone can function as a chip resistor or chip thermistor.
- the black ceramic layer 206 functions as a marker for identifying the upper and lower sides when the board is mounted.
- the ceramic layer 202 is formed of a resistor, it can function as a variable resistor if the structure shown in FIG. 3 is adopted.
- the ceramic powder is mixed with a solvent (ethyl acetate) and an organic binder (acrylic resin) to produce a ceramic slurry, which is then formed into a sheet shape by a doctor blade, and a ceramic green sheet having a thickness of 20 m. Was made.
- a solvent ethyl acetate
- an organic binder acrylic resin
- Pd powder as a metal powder, a tervineol as a solvent, and ethylcellulose as an organic binder were prepared, and these were mixed to prepare an internal conductor paste.
- the ceramic paste for the black ceramic layer was prepared.
- ⁇ -Tabineol was used as the solvent contained in the organic vehicle, and ethicellulose was used as the organic binder.
- an internal conductor paste or a black ceramic layer paste was printed on a predetermined ceramic green sheet, and a plurality of ceramic green sheets were laminated to produce an unfired ceramic laminate.
- the unfired ceramic laminate was fired in an air atmosphere and a firing temperature of 1240 ° C. (kept for 2 hours) to prepare ceramic sintered body samples 1 to 11 shown in Table 1 below.
- FIG. 5 is a schematic cross-sectional view showing a ceramic sintered body in this experimental example.
- the ceramic sintered body 303 includes an inner conductor 304 and a black ceramic layer 306 inside.
- the ceramic layers are not shown one by one for convenience.
- each sample of the ceramic sintered body was 4.9 mm X 4.8 mm X 1.2 mm.
- the black ceramic layer was arranged at a position of 0.02 mm from the upper surface of the ceramic sintered body.
- the difference in height between the side surface and the center of the ceramic sintered body was evaluated as ⁇ , and when the difference in height was 0.5 mm or more was evaluated as X.
- FIG. 6 is a schematic sectional view showing the unfired ceramic laminate used in this experimental example.
- the unfired ceramic laminate 403 includes a ceramic paste 406 for the black ceramic layer inside, but the internal conductor is not formed because it has nothing to do with this experiment.
- the ceramic green sheets are not shown one by one for convenience.
- the upper surface 403a force is also the distance to the black ceramic layer ceramic paste 406, X (m), and the black ceramic layer ceramic paste 406
- the distance from the bottom to 403b is Y (m).
- the thickness of the unsintered ceramic laminate 403 was 1.2 mm.
- the distance to the middle point in the thickness direction of the ceramic paste 406 for the black ceramic layer is illustrated, but in practice, up to the portion where the black ceramic layer ceramic paste 406 is formed.
- the distance X was determined by counting the number of ceramic green sheets and multiplying the thickness (50 m) of the ceramic green sheets.
- Y is the distance obtained by subtracting X from the total thickness of 1200 m.
- the ceramic sintered body A is a CaO-LaO-TiO-NdO-based ceramic powder.
- the ceramic sintered body B is, B AO- Ti_ ⁇ 2 - Nd 0 3 based ceramic sintered body brown produced using the ceramic powder - La 2 ⁇ 3.
- sample No. 30 has a black ceramic layer formed at the midpoint of the thickness of the ceramic sintered body. Therefore, which is the darker force, that is, which is the front I could't discern what it was.
- sample No. 42 a black ceramic layer is formed at the midpoint of the thickness of the ceramic sintered body, and the distance from the main surface to the black ceramic layer is longer than that in sample No. 30. The power was unidentifiable.
- Sample numbers 21, 29, 31, and sample numbers 33, 41, and 43 are all subject data of the present invention, and the black dot mark can be identified as well as the front and back sides. The position of the formation was more clearly identified as the midpoint force was further away.
- the inner conductor is disposed so as not to overlap the black ceramic layer in the stacking direction of the ceramic layers.
- the black ceramic layer unintentionally extends and expands in the direction perpendicular to the stacking direction, for example, depending on the pressure applied after the green sheets are laminated, or depending on the viscosity of the green sheets.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Ceramic Capacitors (AREA)
- Coils Or Transformers For Communication (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2006800354071A CN101273421B (zh) | 2005-11-28 | 2006-08-23 | 陶瓷电子元件 |
JP2007546367A JP4697231B2 (ja) | 2005-11-28 | 2006-08-23 | セラミック電子部品 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005-342645 | 2005-11-28 | ||
JP2005342645 | 2005-11-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2007060774A1 true WO2007060774A1 (ja) | 2007-05-31 |
Family
ID=38067011
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2006/316466 WO2007060774A1 (ja) | 2005-11-28 | 2006-08-23 | セラミック電子部品 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4697231B2 (zh) |
CN (1) | CN101273421B (zh) |
TW (1) | TW200721210A (zh) |
WO (1) | WO2007060774A1 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014072507A (ja) * | 2012-10-02 | 2014-04-21 | Murata Mfg Co Ltd | 積層型電子部品 |
JP2014201484A (ja) * | 2013-04-04 | 2014-10-27 | Tdk株式会社 | 黒色マーク組成物およびこれを用いた電子部品 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20140071724A (ko) * | 2012-12-04 | 2014-06-12 | 삼성전기주식회사 | 적층 세라믹 전자부품 |
WO2018212119A1 (ja) * | 2017-05-15 | 2018-11-22 | 株式会社村田製作所 | 積層型電子部品および積層型電子部品の製造方法 |
CN109686695A (zh) * | 2018-12-25 | 2019-04-26 | 上海致领半导体科技发展有限公司 | 一种晶圆承载盘的标记识别装置及方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52131146A (en) * | 1976-04-27 | 1977-11-02 | Seiko Instr & Electronics | Trimmer capacitor |
JPH0747862Y2 (ja) * | 1990-09-29 | 1995-11-01 | 太陽誘電株式会社 | 表示入り積層セラミック電子部品 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2819934B2 (ja) * | 1992-04-16 | 1998-11-05 | 株式会社村田製作所 | 電子部品の製造方法 |
JP3206496B2 (ja) * | 1997-06-02 | 2001-09-10 | 昭栄化学工業株式会社 | 金属粉末及びその製造方法 |
JPH1116701A (ja) * | 1997-06-23 | 1999-01-22 | Matsushita Electric Ind Co Ltd | 多連チップ抵抗器 |
JP3799933B2 (ja) * | 2000-02-09 | 2006-07-19 | 株式会社村田製作所 | 導電性ペーストおよびセラミック電子部品 |
JP3736802B2 (ja) * | 2002-11-25 | 2006-01-18 | Tdk株式会社 | 導電性組成物とセラミック電子部品 |
-
2006
- 2006-08-16 TW TW095130016A patent/TW200721210A/zh not_active IP Right Cessation
- 2006-08-23 JP JP2007546367A patent/JP4697231B2/ja not_active Expired - Fee Related
- 2006-08-23 WO PCT/JP2006/316466 patent/WO2007060774A1/ja active Application Filing
- 2006-08-23 CN CN2006800354071A patent/CN101273421B/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52131146A (en) * | 1976-04-27 | 1977-11-02 | Seiko Instr & Electronics | Trimmer capacitor |
JPH0747862Y2 (ja) * | 1990-09-29 | 1995-11-01 | 太陽誘電株式会社 | 表示入り積層セラミック電子部品 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014072507A (ja) * | 2012-10-02 | 2014-04-21 | Murata Mfg Co Ltd | 積層型電子部品 |
JP2014201484A (ja) * | 2013-04-04 | 2014-10-27 | Tdk株式会社 | 黒色マーク組成物およびこれを用いた電子部品 |
US9966342B2 (en) | 2013-04-04 | 2018-05-08 | Tdk Corporation | Black marker composition and an electronic component using these |
Also Published As
Publication number | Publication date |
---|---|
CN101273421B (zh) | 2011-02-16 |
TWI313015B (zh) | 2009-08-01 |
TW200721210A (en) | 2007-06-01 |
JP4697231B2 (ja) | 2011-06-08 |
CN101273421A (zh) | 2008-09-24 |
JPWO2007060774A1 (ja) | 2009-05-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101035882B1 (ko) | 적층 세라믹 전자 부품 | |
US6400553B2 (en) | Multi-layer ceramic electronic device and method for producing same | |
CN103325567B (zh) | 多层陶瓷电子元件及其制备方法 | |
US8730645B2 (en) | Multilayer electrical component | |
JP5676536B2 (ja) | 積層セラミック電子部品及びその製造方法 | |
CN101350241B (zh) | 可变电阻 | |
CN112447406B (zh) | 多层陶瓷电子组件 | |
CN109920644A (zh) | 陶瓷电子器件及陶瓷电子器件的制造方法 | |
JP2020057753A (ja) | 積層セラミック電子部品 | |
JP4697231B2 (ja) | セラミック電子部品 | |
KR100922079B1 (ko) | 다층 세라믹 기판 | |
JP5773726B2 (ja) | 積層セラミックコンデンサ | |
JP6672786B2 (ja) | 積層セラミック電子部品 | |
JP2022091960A (ja) | 積層型キャパシタ及びその実装基板 | |
JP3897472B2 (ja) | 受動部品内蔵多層配線基板およびその製造方法 | |
CN103247438B (zh) | 陶瓷电子部件及其制造方法 | |
KR20190033433A (ko) | 세라믹 전자 부품 및 그 제조 방법 | |
US6370014B1 (en) | Monolithic ceramic electronic component and method for manufacturing the same | |
JP4496639B2 (ja) | 電子部品およびその製造方法 | |
JPH07220906A (ja) | 複合機能素子 | |
JP4811465B2 (ja) | 積層コイル部品 | |
CN110024498A (zh) | 多层陶瓷基板以及电子装置 | |
JP2620640B2 (ja) | コンデンサー内蔵複合回路基板及びその製造方法 | |
CN113053619A (zh) | 层叠线圈部件 | |
JP2000012375A (ja) | 積層セラミック電子部品 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200680035407.1 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 2007546367 Country of ref document: JP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 06782919 Country of ref document: EP Kind code of ref document: A1 |