CN109686695A - 一种晶圆承载盘的标记识别装置及方法 - Google Patents

一种晶圆承载盘的标记识别装置及方法 Download PDF

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CN109686695A
CN109686695A CN201811595322.XA CN201811595322A CN109686695A CN 109686695 A CN109686695 A CN 109686695A CN 201811595322 A CN201811595322 A CN 201811595322A CN 109686695 A CN109686695 A CN 109686695A
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silicon wafer
bearing disk
wafer bearing
groove
recognition device
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王永成
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SHANGHAI LEADING SEMICONDUCTOR TECHNOLOGY DEVELOPMENT Co Ltd
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SHANGHAI LEADING SEMICONDUCTOR TECHNOLOGY DEVELOPMENT Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

本发明提供一种晶圆承载盘的标记识别装置及方法，包括用于承载晶圆的晶圆承载盘，在所述晶圆承载盘的预设位置处设有预设深度的凹槽，所述凹槽内通过黏胶层粘贴黑色陶瓷片。本发明采用黑色的陶瓷片使陶瓷片本身与晶圆承载盘具有相同的硬度，耐磨损性能高，同时由于黑色陶瓷片的颜色足够深，可以确保检测设备传感器有效感应；此外，采用耐高温、耐酸碱的树脂胶水可以保证黑色陶瓷片长时间不会脱落。

Description

一种晶圆承载盘的标记识别装置及方法
技术领域
本发明涉及半导体技术领域，具体地讲，本发明涉及一种晶圆承载盘的标记识别装置及方法。
背景技术
在半导体晶片以及部分光电材料的抛光制程中，晶圆需要使用蜡粘贴至陶瓷载盘的表面，通常一个陶瓷盘上粘贴有多枚晶圆，为了实现对晶元的追踪和识别，陶瓷载盘上需要有便于检测设备传感器识别的黑色标记，通过该黑色标记可以对陶瓷盘进行定位；现有技术中，往往是在陶瓷盘上特定位置加工出一定的凹坑，再使用深色涂料进行填充，填充的深色涂料易被抛光液腐蚀并脱落，导致传感器无法识别。
为解决上述问题，本发明提供了一种晶圆承载盘的标记识别装置及方法，确保检测设备传感器的有效感应，防止脱落。
发明内容
为了解决现有技术的问题，本发明提供了一种晶圆承载盘的标记识别装置及方法，确保检测设备传感器的有效感应，防止脱落。
本发明专利提供了一种晶圆承载盘的标记识别装置，包括用于承载晶圆的晶圆承载盘，在所述晶圆承载盘的预设位置处设有预设深度的凹槽，所述凹槽内通过黏胶层粘贴黑色陶瓷片。
优选的，所述陶瓷片的厚度与所述凹槽的深度一致。
优选的，所述陶瓷片的形状与所述凹槽的形状一致。
优选的，所述凹槽与所述陶瓷片的形状均为矩形结构。
本发明提供一种晶圆承载盘的标记识别方法，包括以下步骤：
步骤S1、在所述晶圆承载盘的预设位置处设有预设深度的凹槽；
步骤S2、在所述凹槽内涂覆黏胶层；
步骤S3、将黑色陶瓷片粘贴在所述凹槽内，当检测传感器识别到所述陶瓷片时，可对晶圆承载盘进行定位。
优选的，所述步骤S2中，所述黏胶层为耐高温、耐酸碱的树脂胶水。
本发明提供的技术方案带来的有益效果是：采用黑色的陶瓷片使陶瓷片本身与晶圆承载盘具有相同的硬度，耐磨损性能高，同时由于黑色陶瓷片的颜色足够深，可以确保检测设备传感器有效感应；此外，采用耐高温、耐酸碱的树脂胶水可以保证黑色陶瓷片长时间不会脱落。
附图说明
为了更清楚地说明本发明专利中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本发明中晶圆承载盘表面加工凹槽的结构示意图；
图2是本发明中在凹槽内粘贴黑色陶瓷片的结构示意图。
具体实施方式
为使本发明的内容更加清楚易懂，以下结合说明书附图，对本发明的内容作进一步说明。当然本发明并不局限于该具体实施例，本领域内的技术人员所熟知的一般替换也涵盖在本发明的保护范围内。其次，本发明利用示意图进行了详细的表述，在详述本发明实例时，为了便于说明，示意图不依照一般比例局部放大，不应以此作为对本发明的限定。
上述及其它技术特征和有益效果，将结合实施例及附图对本发明的晶圆承载盘的标记识别装置及方法进行详细说明。如图所示，图1是本发明中晶圆承载盘表面加工凹槽的结构示意图；图2是本发明中在凹槽内粘贴黑色陶瓷片的结构示意图。
如图1-2所示，本发明提供一种晶圆承载盘的标记识别装置，包括用于承载晶圆的晶圆承载盘10，在晶圆承载盘10的预设位置处设有预设深度的凹槽20，凹槽20内通过黏胶层粘贴黑色陶瓷片30。
具体的，本实施例中，凹槽20一般设于晶圆承载盘的表面或侧面位置，陶瓷片30的厚度与凹槽20的深度一致，深度优选为1-5mm，陶瓷片30的上表面与晶圆承载盘10的上表面平齐，本实施例中的陶瓷片30的形状与凹槽20的形状一致，其形状优选为矩形结构。
本发明提供一种晶圆承载盘的标记识别方法，包括以下步骤：
步骤S1、在晶圆承载盘10的预设位置处设有预设深度的凹槽20；
步骤S2、在凹槽20内涂覆黏胶层，其中，黏胶层为耐高温、耐酸碱的树脂胶水。
步骤S3、将黑色陶瓷片30粘贴在凹槽20内，当检测传感器识别到陶瓷片30时，可对晶圆承载盘10进行定位。
综上所述，采用黑色的陶瓷片30使陶瓷片本身与晶圆承载盘10具有相同的硬度，耐磨损性能高，同时由于黑色陶瓷片30的颜色足够深，可以确保检测设备传感器有效感应；此外，采用耐高温、耐酸碱的树脂胶水可以保证黑色陶瓷片30长时间不会脱落。
虽然本发明主要描述了以上实施例，但是只是作为实例来加以描述，而本发明并不限于此。本领域普通技术人员能做出多种变型和应用而不脱离实施例的实质特性。例如，对实施例详示的每个部件都可以修改和运行，与所述变型和应用相关的差异可认为包括在所附权利要求所限定的本发明的保护范围内。
本说明书中所涉及的实施例，其含义是结合该实施例描述的特地特征、结构或特性包括在本发明的至少一个实施例中。说明书中出现于各处的这些术语不一定都涉及同一实施例。此外，当结合任一实施例描述特定特征、结构或特性时，都认为其落入本领域普通技术人员结合其他实施例就可以实现的这些特定特征、结构或特性的范围内。

Claims (6)

1.一种晶圆承载盘的标记识别装置，包括用于承载晶圆的晶圆承载盘，其特征在于，在所述晶圆承载盘的预设位置处设有预设深度的凹槽，所述凹槽内通过黏胶层粘贴黑色陶瓷片。
2.根据权利要求1所述的晶圆承载盘的标记识别装置，其特征在于，所述陶瓷片的厚度与所述凹槽的深度一致。
3.根据权利要1所述的晶圆承载盘的标记识别装置，其特征在于，所述陶瓷片的形状与所述凹槽的形状一致。
4.根据权利要求1所述的晶圆承载盘的标记识别装置，其特征在于，所述凹槽与所述陶瓷片的形状均为矩形结构。
5.一种晶圆承载盘的标记识别方法，其特征在于，包括以下步骤：
步骤S1、在所述晶圆承载盘的预设位置处设有预设深度的凹槽；
步骤S2、在所述凹槽内涂覆黏胶层；
步骤S3、将黑色陶瓷片粘贴在所述凹槽内，当检测传感器识别到所述陶瓷片时，可对晶圆承载盘进行定位。
6.根据权利要求5所述的晶圆承载盘的标记识别装置，其特征在于，所述步骤S2中，所述黏胶层为耐高温、耐酸碱的树脂胶水。
CN201811595322.XA 2018-12-25 2018-12-25 一种晶圆承载盘的标记识别装置及方法 Pending CN109686695A (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112430814A (zh) * 2020-12-14 2021-03-02 浙江一益医疗器械有限公司 一种针管蚀刻方法

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WO1999028957A1 (fr) * 1997-11-28 1999-06-10 Nikon Corporation Appareil de maintien de substrat et appareil d'exposition l'utilisant
CN101273421A (zh) * 2005-11-28 2008-09-24 株式会社村田制作所 陶瓷电子元件
CN205443507U (zh) * 2016-03-24 2016-08-10 安徽三安光电有限公司 一种准确定位晶圆长晶曲线的mocvd设备
CN205630286U (zh) * 2016-04-20 2016-10-12 安徽三安光电有限公司 一种晶片载盘
CN206370410U (zh) * 2016-12-29 2017-08-01 宏茂微电子(上海)有限公司 晶圆承载盘
CN207629838U (zh) * 2017-10-13 2018-07-20 上海致领半导体科技发展有限公司 一种含有rfid标签的陶瓷载盘

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999028957A1 (fr) * 1997-11-28 1999-06-10 Nikon Corporation Appareil de maintien de substrat et appareil d'exposition l'utilisant
CN101273421A (zh) * 2005-11-28 2008-09-24 株式会社村田制作所 陶瓷电子元件
CN205443507U (zh) * 2016-03-24 2016-08-10 安徽三安光电有限公司 一种准确定位晶圆长晶曲线的mocvd设备
CN205630286U (zh) * 2016-04-20 2016-10-12 安徽三安光电有限公司 一种晶片载盘
CN206370410U (zh) * 2016-12-29 2017-08-01 宏茂微电子(上海)有限公司 晶圆承载盘
CN207629838U (zh) * 2017-10-13 2018-07-20 上海致领半导体科技发展有限公司 一种含有rfid标签的陶瓷载盘

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112430814A (zh) * 2020-12-14 2021-03-02 浙江一益医疗器械有限公司 一种针管蚀刻方法
CN112430814B (zh) * 2020-12-14 2023-02-17 浙江一益医疗器械有限公司 一种针管蚀刻方法

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