JP4668291B2 - 表面実装用の水晶デバイス - Google Patents

表面実装用の水晶デバイス Download PDF

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Publication number
JP4668291B2
JP4668291B2 JP2008107108A JP2008107108A JP4668291B2 JP 4668291 B2 JP4668291 B2 JP 4668291B2 JP 2008107108 A JP2008107108 A JP 2008107108A JP 2008107108 A JP2008107108 A JP 2008107108A JP 4668291 B2 JP4668291 B2 JP 4668291B2
Authority
JP
Japan
Prior art keywords
length
corners
metal cover
curvature
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2008107108A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009260644A (ja
JP2009260644A5 (enExample
Inventor
重善 村瀬
千里 石丸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Dempa Kogyo Co Ltd
Original Assignee
Nihon Dempa Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Dempa Kogyo Co Ltd filed Critical Nihon Dempa Kogyo Co Ltd
Priority to JP2008107108A priority Critical patent/JP4668291B2/ja
Priority to US12/384,515 priority patent/US7859348B2/en
Priority to CN2009101352064A priority patent/CN101562437B/zh
Publication of JP2009260644A publication Critical patent/JP2009260644A/ja
Publication of JP2009260644A5 publication Critical patent/JP2009260644A5/ja
Application granted granted Critical
Publication of JP4668291B2 publication Critical patent/JP4668291B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2008107108A 2008-04-16 2008-04-16 表面実装用の水晶デバイス Active JP4668291B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008107108A JP4668291B2 (ja) 2008-04-16 2008-04-16 表面実装用の水晶デバイス
US12/384,515 US7859348B2 (en) 2008-04-16 2009-04-06 Crystal device for surface mounting
CN2009101352064A CN101562437B (zh) 2008-04-16 2009-04-16 用于表面安装的晶体器件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008107108A JP4668291B2 (ja) 2008-04-16 2008-04-16 表面実装用の水晶デバイス

Publications (3)

Publication Number Publication Date
JP2009260644A JP2009260644A (ja) 2009-11-05
JP2009260644A5 JP2009260644A5 (enExample) 2010-04-22
JP4668291B2 true JP4668291B2 (ja) 2011-04-13

Family

ID=41200650

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008107108A Active JP4668291B2 (ja) 2008-04-16 2008-04-16 表面実装用の水晶デバイス

Country Status (3)

Country Link
US (1) US7859348B2 (enExample)
JP (1) JP4668291B2 (enExample)
CN (1) CN101562437B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011233703A (ja) * 2010-04-27 2011-11-17 Daishinku Corp 電子部品パッケージ、及び電子部品パッケージの製造方法
JP5836796B2 (ja) 2011-12-28 2015-12-24 日本特殊陶業株式会社 セラミックパッケージ
CN104944354B (zh) * 2014-03-31 2017-11-14 中芯国际集成电路制造(上海)有限公司 芯片结构、其制作方法及包括其的mems器件
JP7166997B2 (ja) * 2019-08-27 2022-11-08 京セラ株式会社 電子部品パッケージおよび電子装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002231845A (ja) * 2001-01-30 2002-08-16 Kyocera Corp 電子部品収納用パッケージ
JP4614594B2 (ja) * 2001-08-28 2011-01-19 京セラ株式会社 電子部品収納用パッケージ
JP2003086723A (ja) * 2001-09-14 2003-03-20 Nec Schott Components Corp 薄型金属パッケージ
JP3810356B2 (ja) * 2002-07-31 2006-08-16 京セラ株式会社 電子装置
KR100476564B1 (ko) * 2003-01-21 2005-03-18 삼성전기주식회사 수정진동자 세라믹 패키지
JP2007073713A (ja) * 2005-09-06 2007-03-22 Epson Toyocom Corp 圧電デバイス用パッケージ
JP2007075857A (ja) 2005-09-14 2007-03-29 Nippon Dempa Kogyo Co Ltd シーム溶接機
JP2007142186A (ja) * 2005-11-18 2007-06-07 Citizen Miyota Co Ltd 電子部品パッケージの蓋体の製造方法、それを用いて製造された電子部品パッケージの蓋体、電子部品パッケージの製造方法およびそれを用いて製造された電子部品パッケージ
JP2007173976A (ja) 2005-12-19 2007-07-05 Nippon Dempa Kogyo Co Ltd 水晶デバイス
JP5554473B2 (ja) * 2008-03-14 2014-07-23 株式会社大真空 電子部品用パッケージおよび圧電振動デバイス

Also Published As

Publication number Publication date
US20090261913A1 (en) 2009-10-22
JP2009260644A (ja) 2009-11-05
CN101562437B (zh) 2013-10-23
CN101562437A (zh) 2009-10-21
US7859348B2 (en) 2010-12-28

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