CN101562437B - 用于表面安装的晶体器件 - Google Patents

用于表面安装的晶体器件 Download PDF

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Publication number
CN101562437B
CN101562437B CN2009101352064A CN200910135206A CN101562437B CN 101562437 B CN101562437 B CN 101562437B CN 2009101352064 A CN2009101352064 A CN 2009101352064A CN 200910135206 A CN200910135206 A CN 200910135206A CN 101562437 B CN101562437 B CN 101562437B
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CN
China
Prior art keywords
corners
length
outer periphery
metal
metal ring
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CN2009101352064A
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English (en)
Chinese (zh)
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CN101562437A (zh
Inventor
村濑重善
石丸千里
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Dempa Kogyo Co Ltd
Original Assignee
Nihon Dempa Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Nihon Dempa Kogyo Co Ltd filed Critical Nihon Dempa Kogyo Co Ltd
Publication of CN101562437A publication Critical patent/CN101562437A/zh
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Publication of CN101562437B publication Critical patent/CN101562437B/zh
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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
CN2009101352064A 2008-04-16 2009-04-16 用于表面安装的晶体器件 Active CN101562437B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008107108A JP4668291B2 (ja) 2008-04-16 2008-04-16 表面実装用の水晶デバイス
JP2008-107108 2008-04-16
JP2008107108 2008-04-16

Publications (2)

Publication Number Publication Date
CN101562437A CN101562437A (zh) 2009-10-21
CN101562437B true CN101562437B (zh) 2013-10-23

Family

ID=41200650

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009101352064A Active CN101562437B (zh) 2008-04-16 2009-04-16 用于表面安装的晶体器件

Country Status (3)

Country Link
US (1) US7859348B2 (enExample)
JP (1) JP4668291B2 (enExample)
CN (1) CN101562437B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011233703A (ja) * 2010-04-27 2011-11-17 Daishinku Corp 電子部品パッケージ、及び電子部品パッケージの製造方法
JP5836796B2 (ja) * 2011-12-28 2015-12-24 日本特殊陶業株式会社 セラミックパッケージ
CN104944354B (zh) * 2014-03-31 2017-11-14 中芯国际集成电路制造(上海)有限公司 芯片结构、其制作方法及包括其的mems器件
JP7166997B2 (ja) * 2019-08-27 2022-11-08 京セラ株式会社 電子部品パッケージおよび電子装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6777858B2 (en) * 2003-01-21 2004-08-17 Samsung Electro-Mechanics Co., Ltd. Ceramic package for crystal oscillator
CN1555667A (zh) * 2001-09-14 2004-12-15 Nec������ʽ���� 表面安装组件

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002231845A (ja) * 2001-01-30 2002-08-16 Kyocera Corp 電子部品収納用パッケージ
JP4614594B2 (ja) * 2001-08-28 2011-01-19 京セラ株式会社 電子部品収納用パッケージ
JP3810356B2 (ja) * 2002-07-31 2006-08-16 京セラ株式会社 電子装置
JP2007073713A (ja) * 2005-09-06 2007-03-22 Epson Toyocom Corp 圧電デバイス用パッケージ
JP2007075857A (ja) 2005-09-14 2007-03-29 Nippon Dempa Kogyo Co Ltd シーム溶接機
JP2007142186A (ja) * 2005-11-18 2007-06-07 Citizen Miyota Co Ltd 電子部品パッケージの蓋体の製造方法、それを用いて製造された電子部品パッケージの蓋体、電子部品パッケージの製造方法およびそれを用いて製造された電子部品パッケージ
JP2007173976A (ja) 2005-12-19 2007-07-05 Nippon Dempa Kogyo Co Ltd 水晶デバイス
JP5554473B2 (ja) * 2008-03-14 2014-07-23 株式会社大真空 電子部品用パッケージおよび圧電振動デバイス

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1555667A (zh) * 2001-09-14 2004-12-15 Nec������ʽ���� 表面安装组件
US6777858B2 (en) * 2003-01-21 2004-08-17 Samsung Electro-Mechanics Co., Ltd. Ceramic package for crystal oscillator

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
JP特开2002-231845A 2002.08.16
JP特开2003-068900A 2003.03.07
JP特开2004-63960A 2004.02.26
JP特开2007-142186A 2007.06.07
JP特开2007-173976A 2007.07.05

Also Published As

Publication number Publication date
CN101562437A (zh) 2009-10-21
US7859348B2 (en) 2010-12-28
US20090261913A1 (en) 2009-10-22
JP4668291B2 (ja) 2011-04-13
JP2009260644A (ja) 2009-11-05

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