JP4664273B2 - 発光ダイオード発光装置の平面構造 - Google Patents
発光ダイオード発光装置の平面構造 Download PDFInfo
- Publication number
- JP4664273B2 JP4664273B2 JP2006347433A JP2006347433A JP4664273B2 JP 4664273 B2 JP4664273 B2 JP 4664273B2 JP 2006347433 A JP2006347433 A JP 2006347433A JP 2006347433 A JP2006347433 A JP 2006347433A JP 4664273 B2 JP4664273 B2 JP 4664273B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- transparent
- transparent conductive
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
- F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
- F21S4/24—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape of ribbon or tape form, e.g. LED tapes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2109/00—Light sources with light-generating elements disposed on transparent or translucent supports or substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Devices (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
Description
110、110’ 第一透明導電線
1101 導電線段
120 第二透明パターン
130、130’ 第一発光ダイオード
131、131’ 粘着構造
200 透明可撓性キャリアテープ
210 第一透明導電線
230 第一発光ダイオード
240 絶縁層
250 第二透明導電線
260 第二発光ダイオード
300 透明可撓性キャリアキャリアテープ
310 第一透明パターン
330 第一発光ダイオード
340 第一透明パターン化絶縁層
350 第二透明導電線
360 第二発光ダイオード
400 透明可撓性キャリアキャリアテープ
410 第二透明パターン
420 透明導電膜
430 発光ダイオード
460 第一領域
470 第二領域
10 発光装置
16、18 透明基板
17 電源線
19 接地線
21 保護層
20 可撓性キャリアキャリアテープを提供する工程
22 透明導電膜を形成する工程
24 絶縁パターンを製作する工程
26 粘着構造を透明導電膜上に形成する工程
28 発光ダイオードを粘着構造に放置する工程
30 必要な大きさの発光ダイオード平面構造を提供する工程
32 発光ダイオード平面結構を二基板間に放置する工程
34 保護ゲルを発光ダイオード平面構造と基板間に充填する工程
Claims (7)
- 発光ダイオード発光装置の平面構造であって、
透明絶縁可撓性キャリアテープと、
前記透明絶縁可撓性キャリアテープの一表面上に設置される複数の第一透明導電線と、
前記第一透明導電線を跨接すると共に、前記第一透明導電線と電気的に接続する複数の第一発光ダイオードと、
前記第一透明導電線の上方に設置され、一部の前記第一透明導電線を被覆すると共に、前記第一透明導電線の両端を露出する透明パターン化絶縁層と、
前記透明パターン化絶縁層の上に設置される複数の第二透明導電線と、
前記透明絶縁可撓性キャリアテープの上に設置され、前記複数の第二透明導電線と電気的に接続する複数の第二発光ダイオードと、
を備えることを特徴とする発光ダイオード発光装置の平面構造。 - 前記第二透明導電線は前記第一透明導電線を跨過することを特徴とする
請求項1に記載の発光ダイオード発光装置の平面構造。 - 前記第一発光ダイオードと前記第二発光ダイオードとは、単結晶ダイオード、或いは、ポリシリコン発光ダイオードのどちらかであることを特徴とする
請求項1または請求項2に記載の発光ダイオード発光装置の平面構造。 - 更に、前記第一透明導電線と前記第二透明導電線とを正負極電源に電気的に接続する正負電源線を有することを特徴とする
請求項1から請求項3までの何れか一項に記載の発光ダイオード発光装置の平面構造。 - 前記第一透明導電線は前記透明絶縁可撓性キャリアテープの二つの表面に設置されることを特徴とする
請求項1から請求項4までの何れか一項に記載の発光ダイオード発光装置の平面構造。 - 更に、
前記透明絶縁可撓性キャリアテープ、前記第一透明導電線、前記第二透明導電線、及び、前記第一発光ダイオード、及び前記第二発光ダイオードを挟む両透明剛性基板と、
前記両透明剛性基板の一つと前記透明絶縁可撓性キャリアテープとの間に位置する保護ゲルと、
を備えることを特徴とする
請求項1から請求項5までの何れか一項に記載の発光ダイオード発光装置の平面構造。 - 更に、前記第一発光ダイオードと前記第一透明導電線とを粘着し、前記第二発光ダイオードと前記第二透明導電線とを粘着する複数の粘着構造を有することを特徴とする
請求項1から請求項6までの何れか一項に記載の発光ダイオード発光装置の平面構造。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95136269 | 2006-09-29 | ||
TW95145049A TWI323046B (en) | 2006-09-29 | 2006-12-04 | Plane structure of light emitting diode lighting apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008091849A JP2008091849A (ja) | 2008-04-17 |
JP4664273B2 true JP4664273B2 (ja) | 2011-04-06 |
Family
ID=38255401
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006347433A Expired - Fee Related JP4664273B2 (ja) | 2006-09-29 | 2006-12-25 | 発光ダイオード発光装置の平面構造 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7604377B2 (ja) |
JP (1) | JP4664273B2 (ja) |
KR (1) | KR100885894B1 (ja) |
HK (1) | HK1098013A2 (ja) |
Families Citing this family (50)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2007061033A1 (ja) * | 2005-11-28 | 2009-05-07 | シャープ株式会社 | 照明装置とその製造方法 |
US20110004973A1 (en) * | 2007-09-26 | 2011-01-13 | Fortuna Mark W | Illuminated glove device |
JP5463447B2 (ja) * | 2008-01-18 | 2014-04-09 | 三洋電機株式会社 | 発光装置及びそれを備えた灯具 |
TWI416755B (zh) * | 2008-05-30 | 2013-11-21 | Epistar Corp | 光源模組、其對應之光棒及其對應之液晶顯示裝置 |
CN101603636B (zh) * | 2008-06-10 | 2012-05-23 | 展晶科技(深圳)有限公司 | 光源装置 |
DE102009042434A1 (de) * | 2009-09-22 | 2011-09-08 | Osram Gesellschaft mit beschränkter Haftung | Leuchtvorrichtung, Lampe mit der Leuchtvorrichtung und Verfahren zum Herstellen einer Leuchtvorrichtung |
TW201123125A (en) * | 2009-12-21 | 2011-07-01 | Aussmak Optoelectronic Corp | Light transmissible display apparatus |
US9175811B2 (en) * | 2010-02-12 | 2015-11-03 | Cree, Inc. | Solid state lighting device, and method of assembling the same |
CA2794512A1 (en) | 2010-03-26 | 2011-09-29 | David L. Simon | Led light tube with dual sided light distribution |
JP5337105B2 (ja) * | 2010-06-03 | 2013-11-06 | 株式会社東芝 | 半導体発光装置 |
US8192051B2 (en) | 2010-11-01 | 2012-06-05 | Quarkstar Llc | Bidirectional LED light sheet |
US8410726B2 (en) | 2011-02-22 | 2013-04-02 | Quarkstar Llc | Solid state lamp using modular light emitting elements |
US8314566B2 (en) | 2011-02-22 | 2012-11-20 | Quarkstar Llc | Solid state lamp using light emitting strips |
JP2013016406A (ja) * | 2011-07-06 | 2013-01-24 | Teijin Engineering Ltd | 発光装置 |
US9343002B2 (en) * | 2011-08-19 | 2016-05-17 | Luminator Holding L.P. | Window including integrated display signage |
TW201323218A (zh) * | 2011-12-06 | 2013-06-16 | Shuai-Long Chen | 導電化學強化玻璃製造一體成型背光模組及其製造方法 |
WO2013115379A1 (ja) * | 2012-02-02 | 2013-08-08 | シチズンホールディングス株式会社 | 半導体発光装置及びその製造方法 |
US20130335963A1 (en) * | 2012-03-22 | 2013-12-19 | Willis Electric Co., Ltd | Lighted reflective sculpture |
US9956752B2 (en) * | 2012-10-04 | 2018-05-01 | Guardian Glass, LLC | Methods of making laminated LED array and/or products including the same |
US9696012B2 (en) | 2012-10-04 | 2017-07-04 | Guardian Industries Corp. | Embedded LED assembly with optional beam steering optical element, and associated products, and/or methods |
US9651231B2 (en) * | 2012-10-04 | 2017-05-16 | Guardian Industries Corp. | Laminated LED array and/or products including the same |
JP6280689B2 (ja) * | 2012-12-13 | 2018-02-14 | 株式会社小糸製作所 | 反射膜を備えた車両用灯具 |
TWM465753U (zh) * | 2013-01-31 | 2013-11-11 | Polytron Technologies Inc | 電氣裝置 |
JP2014160736A (ja) * | 2013-02-19 | 2014-09-04 | Toshiba Corp | 半導体発光装置及び発光装置 |
US20140362575A1 (en) * | 2013-06-07 | 2014-12-11 | John E. Shirilla | Flexible light panel |
US9482393B2 (en) | 2013-06-07 | 2016-11-01 | John E. Shirilla | Flexible light panel for professional use |
TWI512235B (zh) * | 2013-07-08 | 2015-12-11 | Lediamond Opto Corp | 發光裝置 |
TWI599745B (zh) * | 2013-09-11 | 2017-09-21 | 晶元光電股份有限公司 | 可撓式發光二極體組件及發光二極體燈泡 |
US9897292B1 (en) | 2013-10-30 | 2018-02-20 | Automated Assembly Corporation | Solid-state lighting elements on adhesive transfer tape |
US9379289B1 (en) * | 2013-10-30 | 2016-06-28 | Automated Assembly Corporation | LEDs on adhesive transfer tape |
US10237980B2 (en) * | 2013-12-18 | 2019-03-19 | Lumileds Llc | Flexible substrate with conductive layer for mounting LED arrays |
US9651230B1 (en) | 2014-02-07 | 2017-05-16 | Sourcemaker, Inc. | Flexible lighting apparatus |
CN105992465B (zh) * | 2015-03-06 | 2019-01-15 | 龙门县佳茂聚氨酯橡胶有限公司 | 嵌入式发光二极管电路板及其制作方法 |
US20160348859A1 (en) * | 2015-05-26 | 2016-12-01 | Yu-Nan WANG | Strip light and lighting device application thereof |
ITUB20153160A1 (it) * | 2015-08-19 | 2017-02-19 | Osram Spa | Dispositivo di illuminazione e corrispondente procedimento |
US20170095582A1 (en) * | 2015-10-01 | 2017-04-06 | Sensor Electronic Technology, Inc. | Integrated Flip Chip Device Array |
WO2017066675A1 (en) | 2015-10-14 | 2017-04-20 | Pacific Insight Electronics Corp. | Laminated light-transmitting panel for a vehicle with embedded light sources |
GB2549801B (en) * | 2016-04-29 | 2018-08-29 | Design Led Products Ltd | Modular light panel |
KR20180012544A (ko) * | 2016-07-27 | 2018-02-06 | 박승환 | 고해상도 투명 발광장치 및 그 제조 방법 |
US11678445B2 (en) | 2017-01-25 | 2023-06-13 | Apple Inc. | Spatial composites |
CN111263924B (zh) | 2017-03-29 | 2022-10-14 | 苹果公司 | 具有集成接口系统的设备 |
KR102413568B1 (ko) | 2017-09-29 | 2022-06-27 | 애플 인크. | 다중 부분 디바이스 인클로저 |
US11175769B2 (en) | 2018-08-16 | 2021-11-16 | Apple Inc. | Electronic device with glass enclosure |
US10705570B2 (en) | 2018-08-30 | 2020-07-07 | Apple Inc. | Electronic device housing with integrated antenna |
US11189909B2 (en) | 2018-08-30 | 2021-11-30 | Apple Inc. | Housing and antenna architecture for mobile device |
US11133572B2 (en) | 2018-08-30 | 2021-09-28 | Apple Inc. | Electronic device with segmented housing having molded splits |
US11258163B2 (en) | 2018-08-30 | 2022-02-22 | Apple Inc. | Housing and antenna architecture for mobile device |
CN113994345A (zh) | 2019-04-17 | 2022-01-28 | 苹果公司 | 无线可定位标签 |
US12009576B2 (en) | 2019-12-03 | 2024-06-11 | Apple Inc. | Handheld electronic device |
CN112885254A (zh) * | 2021-04-13 | 2021-06-01 | 深圳市蝉翼科技有限公司 | 柔性透明led显示屏 |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51117486A (en) * | 1974-07-11 | 1976-10-15 | Chao Albert | Electric illumination structure incorporated in plastic cord or cable |
JPH09330049A (ja) * | 1996-06-12 | 1997-12-22 | Shiyuuya Yamashita | Led等の電飾部材の取付け構造 |
JP2000164012A (ja) * | 1998-11-27 | 2000-06-16 | Siemens Ag | 照明装置 |
JP2000174350A (ja) * | 1998-12-10 | 2000-06-23 | Toshiba Corp | 光半導体モジュール |
JP3178677B2 (ja) * | 1999-03-03 | 2001-06-25 | 株式会社ダイワ工業 | 多層配線基板の製造方法 |
JP2001306002A (ja) * | 2000-04-26 | 2001-11-02 | First:Kk | 帯状発光体 |
JP2001326289A (ja) * | 2000-03-08 | 2001-11-22 | Semiconductor Energy Lab Co Ltd | 不揮発性メモリおよび半導体装置 |
JP2002111065A (ja) * | 2000-09-26 | 2002-04-12 | Rohm Co Ltd | 半導体発光装置 |
JP2003031007A (ja) * | 2001-07-16 | 2003-01-31 | Stanley Electric Co Ltd | 灯 具 |
JP2004071675A (ja) * | 2002-08-02 | 2004-03-04 | Nichia Chem Ind Ltd | 発光ダイオード |
JP2004253711A (ja) * | 2003-02-21 | 2004-09-09 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置 |
JP2005533737A (ja) * | 2002-07-19 | 2005-11-10 | ピルキントン パブリック リミテッド カンパニー | 積層グレージングパネル |
JP2006147631A (ja) * | 2004-11-16 | 2006-06-08 | Matsushita Electric Works Ltd | 半導体装置およびその評価方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3894225A (en) * | 1974-07-11 | 1975-07-08 | Albert L Chao | Tape-lamps |
US4514791A (en) * | 1983-09-12 | 1985-04-30 | Naomitsu Tokieda | Lamp ribbon |
US4761720A (en) * | 1987-05-14 | 1988-08-02 | Wolo Manufacturing Corporation | Illuminated tape |
US5162696A (en) * | 1990-11-07 | 1992-11-10 | Goodrich Frederick S | Flexible incasements for LED display panels |
JPH0836368A (ja) * | 1994-07-21 | 1996-02-06 | Hiyoshi Denshi Kk | イルミネーション・テープ |
US5623181A (en) * | 1995-03-23 | 1997-04-22 | Iwasaki Electric Co., Ltd. | Multi-layer type light emitting device |
KR100537349B1 (ko) * | 1996-06-26 | 2006-02-28 | 오스람 게젤샤프트 미트 베쉬랭크터 하프퉁 | 발광 변환 소자를 포함하는 발광 반도체 소자 |
DE29706201U1 (de) * | 1997-03-27 | 1997-05-28 | Osa Elektronik Gmbh | Leucht- oder Anzeigeelement mit einer Lichteinkopplung in einen Lichtleitkörper |
US6371637B1 (en) * | 1999-02-26 | 2002-04-16 | Radiantz, Inc. | Compact, flexible, LED array |
US6680578B2 (en) * | 2001-09-19 | 2004-01-20 | Osram Opto Semiconductors, Gmbh | Organic light emitting diode light source |
TW558622B (en) * | 2002-01-24 | 2003-10-21 | Yuan Lin | Lamp on sheet and manufacturing method thereof |
JP4198498B2 (ja) | 2003-03-24 | 2008-12-17 | 株式会社モリテックス | 環状斜光照明装置の製造方法とフレキシブル配線基板 |
US7128442B2 (en) * | 2003-05-09 | 2006-10-31 | Kian Shin Lee | Illumination unit with a solid-state light generating source, a flexible substrate, and a flexible and optically transparent encapsulant |
KR20030079814A (ko) * | 2003-07-01 | 2003-10-10 | 길혜용 | 발광장치용 플렉시블 인쇄회로기판 및 그를 이용한사인광고용 발광장치 |
KR20060034671A (ko) * | 2006-03-29 | 2006-04-24 | 오재학 | 굴곡이 자유로운 엘이디모듈 |
-
2006
- 2006-12-19 KR KR1020060129796A patent/KR100885894B1/ko not_active IP Right Cessation
- 2006-12-20 US US11/641,879 patent/US7604377B2/en not_active Expired - Fee Related
- 2006-12-25 JP JP2006347433A patent/JP4664273B2/ja not_active Expired - Fee Related
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2007
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Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51117486A (en) * | 1974-07-11 | 1976-10-15 | Chao Albert | Electric illumination structure incorporated in plastic cord or cable |
JPH09330049A (ja) * | 1996-06-12 | 1997-12-22 | Shiyuuya Yamashita | Led等の電飾部材の取付け構造 |
JP2000164012A (ja) * | 1998-11-27 | 2000-06-16 | Siemens Ag | 照明装置 |
JP2000174350A (ja) * | 1998-12-10 | 2000-06-23 | Toshiba Corp | 光半導体モジュール |
JP3178677B2 (ja) * | 1999-03-03 | 2001-06-25 | 株式会社ダイワ工業 | 多層配線基板の製造方法 |
JP2001326289A (ja) * | 2000-03-08 | 2001-11-22 | Semiconductor Energy Lab Co Ltd | 不揮発性メモリおよび半導体装置 |
JP2001306002A (ja) * | 2000-04-26 | 2001-11-02 | First:Kk | 帯状発光体 |
JP2002111065A (ja) * | 2000-09-26 | 2002-04-12 | Rohm Co Ltd | 半導体発光装置 |
JP2003031007A (ja) * | 2001-07-16 | 2003-01-31 | Stanley Electric Co Ltd | 灯 具 |
JP2005533737A (ja) * | 2002-07-19 | 2005-11-10 | ピルキントン パブリック リミテッド カンパニー | 積層グレージングパネル |
JP2004071675A (ja) * | 2002-08-02 | 2004-03-04 | Nichia Chem Ind Ltd | 発光ダイオード |
JP2004253711A (ja) * | 2003-02-21 | 2004-09-09 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置 |
JP2006147631A (ja) * | 2004-11-16 | 2006-06-08 | Matsushita Electric Works Ltd | 半導体装置およびその評価方法 |
Also Published As
Publication number | Publication date |
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KR100885894B1 (ko) | 2009-02-26 |
JP2008091849A (ja) | 2008-04-17 |
KR20080029720A (ko) | 2008-04-03 |
HK1098013A2 (en) | 2007-07-06 |
US20080080181A1 (en) | 2008-04-03 |
US7604377B2 (en) | 2009-10-20 |
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