TWM392905U - Plane structure of light emitting diode lighting apparatus - Google Patents

Plane structure of light emitting diode lighting apparatus Download PDF

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Publication number
TWM392905U
TWM392905U TW99210131U TW99210131U TWM392905U TW M392905 U TWM392905 U TW M392905U TW 99210131 U TW99210131 U TW 99210131U TW 99210131 U TW99210131 U TW 99210131U TW M392905 U TWM392905 U TW M392905U
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Taiwan
Prior art keywords
light
conductive portion
transmissive
emitting diode
transparent
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TW99210131U
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Chinese (zh)
Inventor
Sam Yu
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Polytron Technologies Inc
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Priority to TW99210131U priority Critical patent/TWM392905U/en
Publication of TWM392905U publication Critical patent/TWM392905U/en

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Abstract

A plane structure of light emitting diode lighting apparatus comprising a first light-transmissive conductor unit and a second light-transmissive conductor unit insulated with each other and disposed on a light-transmissive rigid substrate. First light emitting diodes are electrically connected to the first light-transmissive conductor unit and the second light-transmissive conductor unit. Such plane structure is applied to various display, decoration and lighting.

Description

M392905 五、新型說明: 【新型所屬之技術領域】 本創作是有關一種發光裝置之平面結構,特別是一種發光二極體 裝置之平面結構。 【先前技術】 隨著技術的進步與發展’發光二極體(Light Emitting Diode, LED) 在許多應用上扮演舉足輕重的地位’此種元件具有發熱量低、耗電量 小、壽命長、反應速度快、體積小、抗震佳、無放電氣體及可平面封 裝等優點,因此普遍應用於照明應用、景觀設計、交通號誌、電子顯 示工具的產品上。 舉例來說’在商業建築與景觀美化應用上,LED照明系統能夠展 現燈光色彩變化的效果,不但可以具有良好的採光功能,且具有—定 的節能性與色彩繽紛、炫麗的裝飾效果。 然而,習知的LED應用大多將LED配合線路的佈設後固定或安 裝於非透明的載體上,如此的安裝或固定方式限制了 LED應用產品的 大小、尺寸、形狀與透視的應用。 【新型内容】 本創作提供一種發光二極體裝置之平面結構,可應用於各種顯示 裝飾與照明之用。 本創作之一實施例係為一種發光二極體裝置之平面結構,包含: 一透光剛性基板、-第—透光導電部、—第二透光導f部與複數個第 -發光二極體。第-透光導電部與第二透光導電部分別為圖案化設置 於透光剛性基板之上表面,其中第一透光導電部與第二透光導電部彼 3 此電性絕緣;複數個第-發光二極體中,每—第一發光二極體跨設旅 電性連接第一透光導電部與第二透光導電部。 以下藉由具體實施例配合所附的圖式詳加說明,當更容易暸解本 創作之目的、技術内容、特點及其所達成之功效。須說明者,以下實 施例及圖式中,與本創作非直接相關之元件已省略而未繪示;且圖式 中各元件間之尺寸關係僅為求容易瞭解,非用以限制實際比例。 【實施方式】 請參照圖1,為本創作之一實施例之發光二極體裝置之平面結構 之示意圖。發光二極體裝置之平面結構包含:一透光剛性基板10、一 第一透光導電部20、一第二透光導電部3〇與複數個第—發光二極體 4〇。第一透光導電部20與第二透光導電部30分別為圖案化設置於透 光剛性基板10之上表面,其中第一透光導電部2〇與第二透光導電部 30彼此電性絕緣;複數個第一發光二極體4〇中,每一第一發光二極 體40跨設並電性連接第一透光導電部20與第二透光導電部3〇。透光 剛性基板10為一剛性絕緣材料’舉例來說,可為一透明玻璃、一可透 光之彩繪玻璃或者一剛性塑膠基板,但不以此為限。第—透光導電部 20與第二透光導電部30可為導電透明膠'銦錫氧化物(Indium Tin Oxide,ΠΌ)與銦鋅氧化物(indium Zinc Oxide, IZO)等透明導電材料,以 濺鍍、蒸鍍、印刷塗佈或貼附的方式形成於透光剛性基板1〇上。可以 理解的,第一透光導電部20與第二透光導電部30亦可利用導電材料 摻入染料等以產生不同的視覺效杲。 請繼續參照圖2,為本創作之實施例之發光二極體裝置之平面結構 之俯視圖’第一透光導電部20與第二透光導電部30根據不同需求圖 案化設置於透光剛性基板10上,使跨接於第一透光導電部2〇與第二 透光導電部30之複數個第一發光二極體40呈現所需圖案。舉例來說, 第一透光導電部20之一端連接外界之一電源供應器(未圖示)之一正 M392905 極;第二透光導電部30之一端連接外界之一電源供應器之一負極,用 以驅動複數個第一發光二極體40作動發光。要說明的是,第一透光導 電部20與第二透光導電部30亦可連接外界其他控制訊號線,以控制 複數個第一發光二極體40作動。 要說明的是,第一透光導電部20與第二透光導電部30之寬度可 如圖1、圖2之實施例所示,為線狀圖案化分佈,但並不以此為限, 圖3為本創作之另一實施例之發光二極體裝置之平面結構之俯視圖, 第一透光導電部20與第二透光導電部30可為區塊圖案分佈於透光剛 性基板10上。M392905 V. New description: [New technical field] This creation is about the planar structure of a light-emitting device, especially the planar structure of a light-emitting diode device. [Prior Art] With the advancement and development of technology, 'Light Emitting Diode (LED) plays a pivotal role in many applications.' Such components have low heat generation, low power consumption, long life, and reaction speed. Fast, small size, good shock resistance, no discharge gas and flat package, so it is widely used in lighting applications, landscape design, traffic signs, electronic display tools. For example, in commercial buildings and landscaping applications, LED lighting systems can show the effects of light color changes, not only can have good lighting function, but also have a certain energy-saving and colorful, dazzling decorative effects. However, conventional LED applications mostly fix or mount LED mating lines on non-transparent carriers. Such mounting or fixing methods limit the size, size, shape and perspective of LED applications. [New content] This creation provides a planar structure of a light-emitting diode device that can be applied to various display decoration and illumination applications. An embodiment of the present invention is a planar structure of a light-emitting diode device, comprising: a light-transmissive rigid substrate, a first-light-transmissive conductive portion, a second light-transmitting conductive portion f, and a plurality of first-light-emitting diodes body. The first transparent conductive portion and the second transparent conductive portion are respectively patterned on the upper surface of the transparent rigid substrate, wherein the first transparent conductive portion and the second transparent conductive portion are electrically insulated; In the first light-emitting diode, each of the first light-emitting diodes is electrically connected to the first light-transmissive conductive portion and the second light-transmissive conductive portion. The following is a detailed description of the specific embodiments and the accompanying drawings, so that it is easier to understand the purpose, technical content, features and effects of the present invention. It should be noted that in the following embodiments and drawings, components that are not directly related to the present invention have been omitted and are not shown; and the dimensional relationships between the components in the drawings are merely for ease of understanding and are not intended to limit the actual ratio. [Embodiment] Please refer to Fig. 1, which is a schematic view showing the planar structure of a light-emitting diode device according to an embodiment of the present invention. The planar structure of the light-emitting diode device comprises: a light-transmissive rigid substrate 10, a first light-transmissive conductive portion 20, a second light-transmissive conductive portion 3A, and a plurality of first-light-emitting diodes. The first transparent conductive portion 20 and the second transparent conductive portion 30 are respectively patterned and disposed on the upper surface of the transparent rigid substrate 10, wherein the first transparent conductive portion 2 and the second transparent conductive portion 30 are electrically connected to each other. Each of the plurality of first light-emitting diodes 40 is disposed across and electrically connected to the first light-transmissive conductive portion 20 and the second light-transmitting conductive portion 3A. The transparent substrate 10 is a rigid insulating material. For example, it may be a transparent glass, a permeable transparent glass or a rigid plastic substrate, but not limited thereto. The first transparent conductive portion 20 and the second transparent conductive portion 30 may be transparent conductive materials such as indium tin oxide (Indium Tin Oxide) and indium zinc oxide (IZO). Sputtering, vapor deposition, printing, or attaching is formed on the light-transmissive rigid substrate 1''. It can be understood that the first transparent conductive portion 20 and the second transparent conductive portion 30 can also be doped with a dye or the like by using a conductive material to generate different visual effects. Please refer to FIG. 2 , which is a top view of the planar structure of the LED device of the present embodiment. The first transparent conductive portion 20 and the second transparent conductive portion 30 are patterned on the transparent rigid substrate according to different requirements. 10, the plurality of first light-emitting diodes 40 connected to the first light-transmissive conductive portion 2A and the second light-transmitting conductive portion 30 are presented with a desired pattern. For example, one end of the first light-transmissive conductive portion 20 is connected to one of the external power supply devices (not shown), which is a positive M392905 pole; one end of the second transparent conductive portion 30 is connected to one of the external ones of the power supply. The driving of the plurality of first light emitting diodes 40 is performed. It should be noted that the first light-transmitting conductive portion 20 and the second light-transmitting conductive portion 30 may also be connected to other control signal lines to control the operation of the plurality of first light-emitting diodes 40. It should be noted that the widths of the first transparent conductive portion 20 and the second transparent conductive portion 30 may be linearly patterned as shown in the embodiment of FIG. 1 and FIG. 2, but are not limited thereto. 3 is a plan view showing a planar structure of a light-emitting diode device according to another embodiment of the present invention. The first light-transmissive conductive portion 20 and the second light-transmissive conductive portion 30 may be distributed in a block pattern on the light-transmissive rigid substrate 10. .

請參照圖4,為本創作之另一實施例之發光二極體裝置之平面結 構之示意圖。更包含一透光保護層50與一透光基板60,透光保護層 5〇係覆蓋第一透光導電部20、第二透光導電部30與第一發光二極體 4〇。透光保護層50可為聚胺脂(PU)、環氧樹脂(epoxy)、聚乙烯醇縮丁 醛樹脂(PVB)、聚乙烯醋酸乙烯酯(EVA)、紫外線硬化膠(UV膠)之其中 任一’但本發明不限於上述。透光基板60係設置於透光保護層5〇上, 使透光保護層50設置於透光剛性基板1〇與透光基板6〇之間。其中透 光基板60為—可撓性材料或一剛性基板;透光基板60也可為一光擴Referring to FIG. 4, a schematic diagram of a planar structure of a light-emitting diode device according to another embodiment of the present invention is shown. Further, a transparent protective layer 50 and a transparent substrate 60 are disposed, and the transparent protective layer 5 covers the first transparent conductive portion 20, the second transparent conductive portion 30, and the first LED. The light transmissive protective layer 50 may be a polyurethane (PU), an epoxy, a polyvinyl butyral resin (PVB), a polyvinyl acetate (EVA), or an ultraviolet curing adhesive (UV adhesive). Either 'but the invention is not limited to the above. The transparent substrate 60 is disposed on the transparent protective layer 5 , and the transparent protective layer 50 is disposed between the transparent rigid substrate 1 and the transparent substrate 6 . The light transmissive substrate 60 is a flexible material or a rigid substrate; the transparent substrate 60 can also be an optical expansion.

散板\用以將第一發光二極體40所發出的光經過透光基板(光擴散 =)60後均勻射出。$外,本創作之發光二極體裝置之平面結構,更包 ^複數個#電黏著結構(未示於圖#中)將第一發光二極體*黏著於第 ▲透光導電部2〇與第二透光導電部μ,導電黏著結構可為銀膠或錫 :如此之平面結構,透光剛性基板1〇具有高強度耐刮等特性,配合 二保4層%麟保護第—發光二極體4G,延長使用壽命,並可應 用於各種齡輯触明之用。 構^5 ’為本創作之[實施例之發光二極體裝置之平面結 ° ^^含:—第—絕緣部7G、—第三透光導電部80、一第 基板6心9〇、複數個第二發光二極體1〇0、透光保護層5〇與透光 0第絕緣部70係絕緣材質並圖案化設置於第一透光導電部 5 M392905 2〇或第二透光導電部3〇上;第三透光導電部8〇與第四透光導電部9〇 係對應設緣部7G之以面其以三奴導電部8G與第四 透光導電部90彼此電性絕緣;每一第二發光二極體觸跨設並電性連 接第三透光導電部80與細透料電部9G。透光賴層5()係覆蓋第 -透光導電部2G、第二透光導電部3G、第三透光導電部⑽、第四透 光導電部90、第一發光二極體40與第二發光二極體1〇〇。第二發光二 極體100的設置可使本創作之發光二極體裝置之平面結構之發光密度 更月b靈活應用與文化。本實施例的精神在於,可依照不同的需求以一 層或者雙層之發光二極體的應用組合,增加使用上的彈性。至於第三 透光導電部80與第四透光導電部9〇讀料與製程方式與第一透光^ 電部20或第二透光導電部3〇相同,透光保護層%與透光基板的亦 與前述實施例相同,在此不再贅述。 綜合上述,本創作之發光二極體裝置之平面結構包含第一透光導 電部與第二透光導電部彼此絕緣並圖案化設置於透光剛性基板上,第 一發光二極體電性連接第一透光導電部與第二透光導電部,透光剛性 基板具有高強度耐刮等特性’配合透光保護層能夠保護發光二極體 長使用壽命。 以上所述之實施例僅是為說明本創作之技術思想及特點,其目 在使熟習此項技藝之人士能夠瞭解本創作之内容並據以實施,^不能 以之限定本辦之專鄕圍,即大凡依本_所揭示之精神所作之= 等變化或修飾,仍應涵蓋在本創作之專利範圍内。 ^ 【圖式簡單說明】 圖1為本創作之一實施例之發光二極體裝置之平面結構之示意 圖。 圖2為本創作之實施例之發光二極體裝置之平面結構之俯視圖。 圖3為本創作之另一實施例之發光二極體裝置之平面結構之俯視 圖。 圖4為本創作之另一實施例之發光二極體裝置之平面結構之示音 圖。 圖5為本創作之另一實施例之發光二極體裝置之平面結構之示立 圖。 【主要元件符號說明】 透光剛性基板 第一透光導電部 第二透光導電部 第一發光二極體 透光保護層 透光基板 第一絕緣部 第三透光導電部 第四透光導電部 第二發光二極體The diffuser plate is used to uniformly emit light emitted from the first light-emitting diode 40 through the light-transmitting substrate (light diffusion =) 60. In addition, the planar structure of the light-emitting diode device of the present invention is further covered with a plurality of #electro-adhesive structures (not shown in Figure #) to adhere the first light-emitting diode* to the ▲ light-transmitting conductive portion 2〇 And the second transparent conductive portion μ, the conductive adhesive structure can be silver glue or tin: such a planar structure, the light-transmissive rigid substrate 1 〇 has high-strength and scratch-resistant characteristics, and is matched with the second layer of 4 layers of lin protection. The polar body 4G, which has a long service life and can be used for various ages. [5] is a planar junction of the light-emitting diode device of the embodiment [^^: - the first insulating portion 7G, the third transparent conductive portion 80, the first substrate 6 core 9 〇, plural The second light-emitting diodes 1〇0, the light-transmissive protective layer 5〇 and the light-transmissive 0th insulating portion 70 are insulated and patterned and disposed on the first light-transmitting conductive portion 5 M392905 2〇 or the second transparent conductive portion The third light-transmissive conductive portion 8A and the fourth light-transmissive conductive portion 9 are correspondingly disposed on the edge portion 7G, and are electrically insulated from each other by the third slave conductive portion 8G and the fourth light-transmitting conductive portion 90; Each of the second light-emitting diodes is electrically connected to the third light-transmissive conductive portion 80 and the fine-transmissive electric portion 9G. The light-transmitting layer 5 () covers the first-light-transmitting conductive portion 2G, the second light-transmitting conductive portion 3G, the third light-transmitting conductive portion (10), the fourth light-transmitting conductive portion 90, the first light-emitting diode 40, and the first Two light-emitting diodes 1〇〇. The arrangement of the second light-emitting diode 100 allows the light-emitting density of the planar structure of the light-emitting diode device of the present invention to be flexibly applied and cultured. The spirit of the embodiment is that the application flexibility of one or two layers of light-emitting diodes can be increased according to different requirements. The third transparent conductive portion 80 and the fourth transparent conductive portion 9 are the same as the first transparent conductive portion 20 or the second transparent conductive portion 3, and the transparent protective layer is 100% transparent. The substrate is also the same as the previous embodiment, and details are not described herein again. In summary, the planar structure of the LED device of the present invention includes the first transparent conductive portion and the second transparent conductive portion being insulated from each other and patterned on the transparent rigid substrate, and the first light emitting diode is electrically connected. The first light-transmitting conductive portion and the second light-transmitting conductive portion, the light-transmitting rigid substrate has high-strength scratch resistance and the like. The light-transmitting protective layer can protect the long life of the light-emitting diode. The embodiments described above are only for explaining the technical ideas and features of the present invention, and the purpose of the present invention is to enable those skilled in the art to understand the contents of the present invention and implement them accordingly. That is, the changes or modifications made by the people in accordance with the spirit of this _ are still covered by the scope of this creation. ^ BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing the planar structure of a light-emitting diode device according to an embodiment of the present invention. 2 is a plan view showing the planar structure of the light-emitting diode device of the embodiment of the present invention. Fig. 3 is a plan view showing the planar structure of a light-emitting diode device according to another embodiment of the present invention. Fig. 4 is a sound diagram showing the planar structure of a light-emitting diode device according to another embodiment of the present invention. Fig. 5 is a perspective view showing the planar structure of a light-emitting diode device according to another embodiment of the present invention. [Main component symbol description] Light-transmissive rigid substrate, first light-transmissive conductive portion, second light-transmitting conductive portion, first light-emitting diode, light-transmitting protective layer, light-transmissive substrate, first insulating portion, third light-transmitting conductive portion, fourth light-transmitting conductive Second light-emitting diode

Claims (1)

M392905 、申請專利範圍: 1. 一種發光二極體裝置之平面結構,包含: 一透光剛性基板; 一第一透光導電部,為圖案化設置於該透光剛性基板之上表面; 一第二透光導電部,為圖案化設置於該透光剛性基板之上表面,其 中該第一透光導電部與該第二透光導電部彼此電性絕緣;以及 複數個第一發光二極體,每一該第一發光二極體跨設並電性連接該 第一透光導電部與該第二透光導電部。 2·如請求項1所述之發光二極體裝置之平面結構,更包含一透光保護 層,係覆蓋該第一透光導電部、該第二透光導電部與該些第一發光二極 體。 3.如請求項2所述之發光二極體裝置之平面結構,其中該透光保護層為 聚胺脂(PU)、環氧樹脂(epoXy)、聚乙烯醇縮丁醛樹脂(ργΒ)、聚乙烯醋 酸乙烯酯(EVA)、紫外線硬化膠(uv膠)之其中任一。 透光基板之間。 4·如清求項2所述之發光二極體裝置之平面結構,更包含一透光基板, 係认置於該透絲賴上’使該透光保護層設置於該透細性基板與該 可撓性材料或一剛性基板。 5·如清求項4所述之發光二極體裝置之平面結才冓,其中該透光基板為一 6.如請求項4所述之發光二極體裝置之平面結構 所述之發光二鋪裝置之平面輯,其巾該透細性基板M392905, the scope of patent application: 1. A planar structure of a light-emitting diode device, comprising: a light-transparent rigid substrate; a first light-transmissive conductive portion, patterned on the upper surface of the light-transmissive rigid substrate; The two transparent conductive portions are patterned on the upper surface of the light-transmissive rigid substrate, wherein the first transparent conductive portion and the second transparent conductive portion are electrically insulated from each other; and the plurality of first light-emitting diodes Each of the first light-emitting diodes is electrically connected to the first light-transmissive conductive portion and the second light-transmissive conductive portion. The planar structure of the light-emitting diode device of claim 1, further comprising a light-transmissive protective layer covering the first transparent conductive portion, the second transparent conductive portion and the first light-emitting diodes Polar body. 3. The planar structure of the light-emitting diode device according to claim 2, wherein the light-transmissive protective layer is a polyurethane (PU), an epoxy resin (epoXy), a polyvinyl butyral resin (ργΒ), Any of polyethylene vinyl acetate (EVA) and ultraviolet curing rubber (uv glue). Between the light transmissive substrates. 4. The planar structure of the light-emitting diode device according to claim 2, further comprising a light-transmissive substrate disposed on the light-drawing layer to cause the light-transmissive protective layer to be disposed on the transparent substrate The flexible material or a rigid substrate. 5. The planar junction of the light-emitting diode device according to claim 4, wherein the light-transmissive substrate is a light-emitting diode according to the planar structure of the light-emitting diode device according to claim 4 Plane set of paving device, the towel is transparent substrate 、銦錫氧化物與銦辞氧化物之至 少任一。 光擴散板。 7.如清求項1所述4 為一剛性絕緣材料。 O D士上· 一 _ ,其中該透光基板為一 8 M392905 導電部 川·如請求項9所述之發光二極體裝 結構可為銀膠或錫膏。 置之平面結構,其中該些導電黏著 U.如請求項1所述之發光二極體裝置之平面結構,更包含: 吾-第-絕緣部’圖案化設置於該第-透光導電部或該第二透光導電 一第三透光導電部,對應設置於該第一絕緣部之上表面; 一第四透光導電部,對應設置於該第一絕緣部之上表面,其中該第 二透光導電部與該第四透光導電部彼此電性絕緣;以及 複數個第二發光二極體,每一該第二發光二極體跨設並電性連接該 第三透光導電部與該第四透光導電部。 12.如請求項η所述之發光二極體裝置之平面結構,該第三透光導電部 與該第四透光導電部係為導電透明膠、銦錫氧化物及銦鋅氧化物之至少 任一 〇 13_如請求項η所述之發光二極體裝置之平面結構,更包含一透光保護 層,係覆蓋該第一透光導電部、該第二透光導電部、該第三透光導電部、 該第四透光導電部、該些第一發光二極體與該些第二發光二極體。 14. 如請求項13所述之發光二極體裝置之平面結構,其中該透光保護層 為聚胺脂(PU)、環氧樹脂(epoxy)、聚乙烯醇縮丁醛樹脂(pvb)、聚乙烯 醋酸乙烯酯(EVA)、紫外線硬化膠(UV膠)之其中任一。 15. 如請求項13所述之發光二極體裝置之平面結構,更包含一透光基 板’係設置於該透光保護層上,使該透光保護層設置於該透光剛性基板 與該透光基板之間。 16. 如請求項15所述之發光二極體裝置之平面結構,其中該透光基板為 9 M392905 一可撓性材料或一剛性基板。 17.如請求項15所述之發光二極體裝置之平面結構,其中該透光基板為 一光擴散板。At least one of indium tin oxide and indium oxide. Light diffusing plate. 7. As described in claim 1, 4 is a rigid insulating material. O 士上·一 _ , wherein the light-transmissive substrate is an 8 M392905 conductive portion. The light-emitting diode assembly according to claim 9 may be a silver paste or a solder paste. The plane structure of the light-emitting diode device according to claim 1, further comprising: the first-light-insulating portion is patterned on the first light-transmitting conductive portion or The second light-transmissive conductive-third light-transmissive conductive portion is correspondingly disposed on the upper surface of the first insulating portion; a fourth transparent conductive portion is correspondingly disposed on the upper surface of the first insulating portion, wherein the second The light-transmissive conductive portion and the fourth light-transmissive conductive portion are electrically insulated from each other; and a plurality of second light-emitting diodes, each of the second light-emitting diodes is electrically connected to the third light-transmitting conductive portion The fourth transparent conductive portion. 12. The planar structure of the light-emitting diode device according to claim η, wherein the third transparent conductive portion and the fourth transparent conductive portion are at least conductive transparent adhesive, indium tin oxide, and indium zinc oxide. The planar structure of the light-emitting diode device according to claim η further includes a light-transmissive protective layer covering the first transparent conductive portion, the second transparent conductive portion, and the third a light-transmitting conductive portion, the fourth light-transmitting conductive portion, the first light-emitting diodes, and the second light-emitting diodes. 14. The planar structure of the light-emitting diode device according to claim 13, wherein the light-transmissive protective layer is polyurethane (PU), epoxy (epoxy), polyvinyl butyral resin (pvb), Any of polyvinyl acetate (EVA) and ultraviolet curing glue (UV adhesive). 15. The planar structure of the light-emitting diode device of claim 13, further comprising a transparent substrate disposed on the light-transmissive protective layer, wherein the transparent protective layer is disposed on the transparent rigid substrate Between the light transmissive substrates. 16. The planar structure of the light emitting diode device of claim 15, wherein the light transmissive substrate is a 9 M392905 flexible material or a rigid substrate. 17. The planar structure of the light emitting diode device of claim 15, wherein the light transmissive substrate is a light diffusing plate.
TW99210131U 2010-05-28 2010-05-28 Plane structure of light emitting diode lighting apparatus TWM392905U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI720418B (en) * 2019-01-31 2021-03-01 致伸科技股份有限公司 Semiconductor light emitting unit and package method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI720418B (en) * 2019-01-31 2021-03-01 致伸科技股份有限公司 Semiconductor light emitting unit and package method thereof

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