HK1098013A2 - Plane structure of light emitting diode lighting apparatus - Google Patents

Plane structure of light emitting diode lighting apparatus

Info

Publication number
HK1098013A2
HK1098013A2 HK07101928A HK07101928A HK1098013A2 HK 1098013 A2 HK1098013 A2 HK 1098013A2 HK 07101928 A HK07101928 A HK 07101928A HK 07101928 A HK07101928 A HK 07101928A HK 1098013 A2 HK1098013 A2 HK 1098013A2
Authority
HK
Hong Kong
Prior art keywords
transparent pattern
lighting apparatus
emitting diode
transparent
light emitting
Prior art date
Application number
HK07101928A
Other languages
English (en)
Inventor
Sam Yu
Da Long Cheng
Original Assignee
Polytron Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from TW95145049A external-priority patent/TWI323046B/zh
Application filed by Polytron Technologies Inc filed Critical Polytron Technologies Inc
Publication of HK1098013A2 publication Critical patent/HK1098013A2/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
    • F21S4/24—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape of ribbon or tape form, e.g. LED tapes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2109/00—Light sources with light-generating elements disposed on transparent or translucent supports or substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Devices (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
HK07101928A 2006-09-29 2007-02-16 Plane structure of light emitting diode lighting apparatus HK1098013A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW95136269 2006-09-29
TW95145049A TWI323046B (en) 2006-09-29 2006-12-04 Plane structure of light emitting diode lighting apparatus

Publications (1)

Publication Number Publication Date
HK1098013A2 true HK1098013A2 (en) 2007-07-06

Family

ID=38255401

Family Applications (1)

Application Number Title Priority Date Filing Date
HK07101928A HK1098013A2 (en) 2006-09-29 2007-02-16 Plane structure of light emitting diode lighting apparatus

Country Status (4)

Country Link
US (1) US7604377B2 (ja)
JP (1) JP4664273B2 (ja)
KR (1) KR100885894B1 (ja)
HK (1) HK1098013A2 (ja)

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2007061033A1 (ja) * 2005-11-28 2009-05-07 シャープ株式会社 照明装置とその製造方法
US20110004973A1 (en) * 2007-09-26 2011-01-13 Fortuna Mark W Illuminated glove device
JP5463447B2 (ja) * 2008-01-18 2014-04-09 三洋電機株式会社 発光装置及びそれを備えた灯具
TWI416755B (zh) * 2008-05-30 2013-11-21 Epistar Corp 光源模組、其對應之光棒及其對應之液晶顯示裝置
CN101603636B (zh) * 2008-06-10 2012-05-23 展晶科技(深圳)有限公司 光源装置
DE102009042434A1 (de) * 2009-09-22 2011-09-08 Osram Gesellschaft mit beschränkter Haftung Leuchtvorrichtung, Lampe mit der Leuchtvorrichtung und Verfahren zum Herstellen einer Leuchtvorrichtung
TW201123125A (en) * 2009-12-21 2011-07-01 Aussmak Optoelectronic Corp Light transmissible display apparatus
US9175811B2 (en) * 2010-02-12 2015-11-03 Cree, Inc. Solid state lighting device, and method of assembling the same
CA2794512A1 (en) 2010-03-26 2011-09-29 David L. Simon Led light tube with dual sided light distribution
JP5337105B2 (ja) * 2010-06-03 2013-11-06 株式会社東芝 半導体発光装置
US8192051B2 (en) 2010-11-01 2012-06-05 Quarkstar Llc Bidirectional LED light sheet
US8410726B2 (en) 2011-02-22 2013-04-02 Quarkstar Llc Solid state lamp using modular light emitting elements
US8314566B2 (en) 2011-02-22 2012-11-20 Quarkstar Llc Solid state lamp using light emitting strips
JP2013016406A (ja) * 2011-07-06 2013-01-24 Teijin Engineering Ltd 発光装置
US9343002B2 (en) * 2011-08-19 2016-05-17 Luminator Holding L.P. Window including integrated display signage
TW201323218A (zh) * 2011-12-06 2013-06-16 Shuai-Long Chen 導電化學強化玻璃製造一體成型背光模組及其製造方法
WO2013115379A1 (ja) * 2012-02-02 2013-08-08 シチズンホールディングス株式会社 半導体発光装置及びその製造方法
US20130335963A1 (en) * 2012-03-22 2013-12-19 Willis Electric Co., Ltd Lighted reflective sculpture
US9956752B2 (en) * 2012-10-04 2018-05-01 Guardian Glass, LLC Methods of making laminated LED array and/or products including the same
US9696012B2 (en) 2012-10-04 2017-07-04 Guardian Industries Corp. Embedded LED assembly with optional beam steering optical element, and associated products, and/or methods
US9651231B2 (en) * 2012-10-04 2017-05-16 Guardian Industries Corp. Laminated LED array and/or products including the same
JP6280689B2 (ja) * 2012-12-13 2018-02-14 株式会社小糸製作所 反射膜を備えた車両用灯具
TWM465753U (zh) * 2013-01-31 2013-11-11 Polytron Technologies Inc 電氣裝置
JP2014160736A (ja) * 2013-02-19 2014-09-04 Toshiba Corp 半導体発光装置及び発光装置
US20140362575A1 (en) * 2013-06-07 2014-12-11 John E. Shirilla Flexible light panel
US9482393B2 (en) 2013-06-07 2016-11-01 John E. Shirilla Flexible light panel for professional use
TWI512235B (zh) * 2013-07-08 2015-12-11 Lediamond Opto Corp 發光裝置
TWI599745B (zh) * 2013-09-11 2017-09-21 晶元光電股份有限公司 可撓式發光二極體組件及發光二極體燈泡
US9897292B1 (en) 2013-10-30 2018-02-20 Automated Assembly Corporation Solid-state lighting elements on adhesive transfer tape
US9379289B1 (en) * 2013-10-30 2016-06-28 Automated Assembly Corporation LEDs on adhesive transfer tape
US10237980B2 (en) * 2013-12-18 2019-03-19 Lumileds Llc Flexible substrate with conductive layer for mounting LED arrays
US9651230B1 (en) 2014-02-07 2017-05-16 Sourcemaker, Inc. Flexible lighting apparatus
CN105992465B (zh) * 2015-03-06 2019-01-15 龙门县佳茂聚氨酯橡胶有限公司 嵌入式发光二极管电路板及其制作方法
US20160348859A1 (en) * 2015-05-26 2016-12-01 Yu-Nan WANG Strip light and lighting device application thereof
ITUB20153160A1 (it) * 2015-08-19 2017-02-19 Osram Spa Dispositivo di illuminazione e corrispondente procedimento
US20170095582A1 (en) * 2015-10-01 2017-04-06 Sensor Electronic Technology, Inc. Integrated Flip Chip Device Array
WO2017066675A1 (en) 2015-10-14 2017-04-20 Pacific Insight Electronics Corp. Laminated light-transmitting panel for a vehicle with embedded light sources
GB2549801B (en) * 2016-04-29 2018-08-29 Design Led Products Ltd Modular light panel
KR20180012544A (ko) * 2016-07-27 2018-02-06 박승환 고해상도 투명 발광장치 및 그 제조 방법
US11678445B2 (en) 2017-01-25 2023-06-13 Apple Inc. Spatial composites
CN111263924B (zh) 2017-03-29 2022-10-14 苹果公司 具有集成接口系统的设备
KR102413568B1 (ko) 2017-09-29 2022-06-27 애플 인크. 다중 부분 디바이스 인클로저
US11175769B2 (en) 2018-08-16 2021-11-16 Apple Inc. Electronic device with glass enclosure
US10705570B2 (en) 2018-08-30 2020-07-07 Apple Inc. Electronic device housing with integrated antenna
US11189909B2 (en) 2018-08-30 2021-11-30 Apple Inc. Housing and antenna architecture for mobile device
US11133572B2 (en) 2018-08-30 2021-09-28 Apple Inc. Electronic device with segmented housing having molded splits
US11258163B2 (en) 2018-08-30 2022-02-22 Apple Inc. Housing and antenna architecture for mobile device
CN113994345A (zh) 2019-04-17 2022-01-28 苹果公司 无线可定位标签
US12009576B2 (en) 2019-12-03 2024-06-11 Apple Inc. Handheld electronic device
CN112885254A (zh) * 2021-04-13 2021-06-01 深圳市蝉翼科技有限公司 柔性透明led显示屏

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3894225A (en) * 1974-07-11 1975-07-08 Albert L Chao Tape-lamps
JPS51117486A (en) * 1974-07-11 1976-10-15 Chao Albert Electric illumination structure incorporated in plastic cord or cable
US4514791A (en) * 1983-09-12 1985-04-30 Naomitsu Tokieda Lamp ribbon
US4761720A (en) * 1987-05-14 1988-08-02 Wolo Manufacturing Corporation Illuminated tape
US5162696A (en) * 1990-11-07 1992-11-10 Goodrich Frederick S Flexible incasements for LED display panels
JPH0836368A (ja) * 1994-07-21 1996-02-06 Hiyoshi Denshi Kk イルミネーション・テープ
US5623181A (en) * 1995-03-23 1997-04-22 Iwasaki Electric Co., Ltd. Multi-layer type light emitting device
JPH09330049A (ja) * 1996-06-12 1997-12-22 Shiyuuya Yamashita Ｌｅｄ等の電飾部材の取付け構造
KR100537349B1 (ko) * 1996-06-26 2006-02-28 오스람 게젤샤프트 미트 베쉬랭크터 하프퉁 발광 변환 소자를 포함하는 발광 반도체 소자
DE29706201U1 (de) * 1997-03-27 1997-05-28 Osa Elektronik Gmbh Leucht- oder Anzeigeelement mit einer Lichteinkopplung in einen Lichtleitkörper
DE19854899C1 (de) * 1998-11-27 1999-12-30 Siemens Ag Beleuchtungseinheit
JP2000174350A (ja) * 1998-12-10 2000-06-23 Toshiba Corp 光半導体モジュール
US6371637B1 (en) * 1999-02-26 2002-04-16 Radiantz, Inc. Compact, flexible, LED array
JP3178677B2 (ja) * 1999-03-03 2001-06-25 株式会社ダイワ工業 多層配線基板の製造方法
JP2001326289A (ja) * 2000-03-08 2001-11-22 Semiconductor Energy Lab Co Ltd 不揮発性メモリおよび半導体装置
JP2001306002A (ja) * 2000-04-26 2001-11-02 First:Kk 帯状発光体
JP4565723B2 (ja) * 2000-09-26 2010-10-20 ローム株式会社 半導体発光装置
JP4431932B2 (ja) * 2001-07-16 2010-03-17 スタンレー電気株式会社 灯具
US6680578B2 (en) * 2001-09-19 2004-01-20 Osram Opto Semiconductors, Gmbh Organic light emitting diode light source
TW558622B (en) * 2002-01-24 2003-10-21 Yuan Lin Lamp on sheet and manufacturing method thereof
GB0216787D0 (en) * 2002-07-19 2002-08-28 Pilkington Plc Laminated glazing panel
JP4239509B2 (ja) * 2002-08-02 2009-03-18 日亜化学工業株式会社 発光ダイオード
JP2004253711A (ja) * 2003-02-21 2004-09-09 Kyocera Corp 発光素子収納用パッケージおよび発光装置
JP4198498B2 (ja) 2003-03-24 2008-12-17 株式会社モリテックス 環状斜光照明装置の製造方法とフレキシブル配線基板
US7128442B2 (en) * 2003-05-09 2006-10-31 Kian Shin Lee Illumination unit with a solid-state light generating source, a flexible substrate, and a flexible and optically transparent encapsulant
KR20030079814A (ko) * 2003-07-01 2003-10-10 길혜용 발광장치용 플렉시블 인쇄회로기판 및 그를 이용한사인광고용 발광장치
JP2006147631A (ja) * 2004-11-16 2006-06-08 Matsushita Electric Works Ltd 半導体装置およびその評価方法
KR20060034671A (ko) * 2006-03-29 2006-04-24 오재학 굴곡이 자유로운 엘이디모듈

Also Published As

Publication number Publication date
KR100885894B1 (ko) 2009-02-26
JP4664273B2 (ja) 2011-04-06
JP2008091849A (ja) 2008-04-17
KR20080029720A (ko) 2008-04-03
US20080080181A1 (en) 2008-04-03
US7604377B2 (en) 2009-10-20

Similar Documents

Publication Publication Date Title
HK1098013A2 (en) Plane structure of light emitting diode lighting apparatus
WO2008044170A3 (en) Thin illumination device, display device and luminary device
ATE398836T1 (de) Lichtemittierende vorrichtung mit umwandlungsstruktur
WO2009033922A3 (de) Beleuchtungseinrichtung mit mehreren steuerbaren leuchtdioden
WO2006049844A3 (en) High brightness light emitting diode light source
WO2009011360A1 (ja) 照明装置
MX359758B (es) Encristalado de iluminación para vehículo.
TW200633265A (en) Composite LED modules
WO2007130632A3 (en) Light-emitting diode shelf
MX2010002830A (es) Luz led (diodo de emisión de luz) omnidireccional compacta.
MX2014008909A (es) Unidad de encristalado de iluminacion para un vehiculo.
WO2009016852A1 (ja) 照明装置、及びこれを用いた表示装置
TW200729543A (en) Light emitting device and method of forming the same
HK1127796A1 (en) Integrally formed single piece light emitting diode light wire
MX2010003785A (es) Dispositivo de iluminacion con diodos emisores de luz.
HK1133544A2 (en) Modular structure of lighting emitting diode (led) light source
TW200802944A (en) Light emitting diode module
TW200802957A (en) Light emitting diode module
TW200802956A (en) Light emitting diode module
WO2009016853A1 (ja) 照明装置、及びこれを用いた表示装置
ATE525612T1 (de) Led flachleuchte
WO2011101736A3 (en) Linear light emitting diode (led) lighting fixture
MX2012013189A (es) Dispositivo de iluminacion, dispositivo de presentacion y receptor de television.
WO2009020298A3 (en) Lighting device
ATE518279T1 (de) Elektrisches gerät mit einer status- anzeigevorrichtung

Legal Events

Date Code Title Description
PEU Short-term patents expired

Effective date: 20150215