JP4658772B2 - 集積回路パッケージを製造する方法 - Google Patents
集積回路パッケージを製造する方法 Download PDFInfo
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- JP4658772B2 JP4658772B2 JP2005308766A JP2005308766A JP4658772B2 JP 4658772 B2 JP4658772 B2 JP 4658772B2 JP 2005308766 A JP2005308766 A JP 2005308766A JP 2005308766 A JP2005308766 A JP 2005308766A JP 4658772 B2 JP4658772 B2 JP 4658772B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000000758 substrate Substances 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 18
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 11
- 229910052710 silicon Inorganic materials 0.000 claims description 11
- 239000010703 silicon Substances 0.000 claims description 11
- 238000005530 etching Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 7
- 230000004308 accommodation Effects 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 2
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 27
- 239000007787 solid Substances 0.000 description 7
- 230000000930 thermomechanical effect Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- LVROLHVSYNLFBE-UHFFFAOYSA-N 2,3,6-trichlorobiphenyl Chemical compound ClC1=CC=C(Cl)C(C=2C=CC=CC=2)=C1Cl LVROLHVSYNLFBE-UHFFFAOYSA-N 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
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- H01L2224/0554—External layer
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- H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
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- Y10T29/49128—Assembling formed circuit to base
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- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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- Y10T29/49—Method of mechanical manufacture
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- Y10T29/49117—Conductor or circuit manufacturing
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- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
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- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
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Description
基板を提供するステップと、
基板上の集積回路を収容するための少なくとも1つの収容エリアと、前記少なくとも1つの収容エリアを中心として配置される複数のアイランドとの境界を定めるステップと、
曲折した形状の接続部材を近傍のアイランドの間に作成するために前記基板をエッチングするステップであって、前記アイランドは前記集積回路パッケージ内における熱膨張の差異を吸収する構成を有している、当該ステップと、を含む集積回路パッケージを製造する方法が提供される。
Claims (9)
- 集積回路パッケージを製造する方法であって、
基板を提供するステップと、
基板上の集積回路を収容するための少なくとも1つの収容エリアと、前記少なくとも1つの収容エリアを中心として配置される複数のアイランドとの境界を定めるステップと、
曲折した形状の複数の接続部材を近傍のアイランドの間に作成するために前記基板をエッチングするステップであって、前記複数のアイランドの各々が当該アイランドの近傍のアイランドに対し運動の自由度を備えるように、前記接続部材の各々は、ばねとして機能する構成とされ、その結果、前記複数のアイランドは前記集積回路パッケージ内における熱膨張の差異を吸収する、当該ステップと、
を含み、
基板の表面に加えられるマスクによって、前記少なくとも1つの収容エリアと前記アイランドとの境界を定める
ことを特徴とする、集積回路パッケージを製造する方法。 - 前記少なくとも1つの収容エリアにて電気的な接触部を形成し、各々のアイランドにて電気的な端子を形成することを含み、各々の電気的な端子が、回路層を介して、前記電気的な接触部のうちの1つと電気的に接続されている請求項1に記載の方法。
- 基板上に金属層を堆積させることによって基板の表面上に回路層を形成することを含む請求項2に記載の方法。
- マスクを載せて基板を露光した後、基板をエッチングすることによって、前記接続部材を作成するために基板の材料を除去することを含む請求項1に記載の方法。
- 絶縁層を備えたシリコンウェーハから基板を形成することを含む請求項1に記載の方法。
- 基板に凹部を形成することによって前記少なくとも1つの収容エリアの境界を定めることを含む請求項1に記載の方法。
- 基板をエッチングすることによって前記凹部を形成することを含む請求項6に記載の方法。
- 基板を通して通路を形成することによって前記少なくとも1つの収容エリアの境界を定めることを含み、前記通路を囲む基板の領域が電気的な接触部を支えている請求項2に記載の方法。
- 基板をエッチングすることによって前記通路を形成することを含む請求項8に記載の方法。
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