JP4654829B2 - 部品実装状態検査装置及び方法 - Google Patents

部品実装状態検査装置及び方法 Download PDF

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Publication number
JP4654829B2
JP4654829B2 JP2005236803A JP2005236803A JP4654829B2 JP 4654829 B2 JP4654829 B2 JP 4654829B2 JP 2005236803 A JP2005236803 A JP 2005236803A JP 2005236803 A JP2005236803 A JP 2005236803A JP 4654829 B2 JP4654829 B2 JP 4654829B2
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Japan
Prior art keywords
substrate
detection camera
component
board
camera
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005236803A
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English (en)
Japanese (ja)
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JP2007053207A (ja
JP2007053207A5 (enExample
Inventor
晃 山田
良一郎 片野
慎治郎 辻
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2005236803A priority Critical patent/JP4654829B2/ja
Publication of JP2007053207A publication Critical patent/JP2007053207A/ja
Publication of JP2007053207A5 publication Critical patent/JP2007053207A5/ja
Application granted granted Critical
Publication of JP4654829B2 publication Critical patent/JP4654829B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
JP2005236803A 2005-08-17 2005-08-17 部品実装状態検査装置及び方法 Expired - Fee Related JP4654829B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005236803A JP4654829B2 (ja) 2005-08-17 2005-08-17 部品実装状態検査装置及び方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005236803A JP4654829B2 (ja) 2005-08-17 2005-08-17 部品実装状態検査装置及び方法

Publications (3)

Publication Number Publication Date
JP2007053207A JP2007053207A (ja) 2007-03-01
JP2007053207A5 JP2007053207A5 (enExample) 2008-09-11
JP4654829B2 true JP4654829B2 (ja) 2011-03-23

Family

ID=37917455

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005236803A Expired - Fee Related JP4654829B2 (ja) 2005-08-17 2005-08-17 部品実装状態検査装置及び方法

Country Status (1)

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JP (1) JP4654829B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4711859B2 (ja) * 2006-03-02 2011-06-29 パナソニック株式会社 部品接合方法及び部品接合装置
JP5272784B2 (ja) * 2009-02-17 2013-08-28 オムロン株式会社 光学的検査方法および光学的検査装置
JP2011021999A (ja) * 2009-07-15 2011-02-03 Kyodo Design & Planning Corp 基板検査装置
KR101328609B1 (ko) * 2012-11-12 2013-11-13 (주)바론시스템 압흔 검사장치
JP2019219357A (ja) * 2018-06-22 2019-12-26 名古屋電機工業株式会社 撮影装置、撮影方法および撮影プログラム
CN114740645A (zh) * 2022-04-20 2022-07-12 厦门福信光电集成有限公司 一种导电粒子压痕检测设备

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6267248U (enExample) * 1985-10-17 1987-04-27
JP3323395B2 (ja) * 1995-03-24 2002-09-09 松下電器産業株式会社 フラットパネルディスプレイへのic部品の接合方法

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Publication number Publication date
JP2007053207A (ja) 2007-03-01

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