JP4641155B2 - 化学機械研磨用の研磨剤 - Google Patents

化学機械研磨用の研磨剤 Download PDF

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Publication number
JP4641155B2
JP4641155B2 JP2004166360A JP2004166360A JP4641155B2 JP 4641155 B2 JP4641155 B2 JP 4641155B2 JP 2004166360 A JP2004166360 A JP 2004166360A JP 2004166360 A JP2004166360 A JP 2004166360A JP 4641155 B2 JP4641155 B2 JP 4641155B2
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acid
group
abrasive
water
compound
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JP2004166360A
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Japanese (ja)
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JP2005347579A (ja
JP2005347579A5 (enExample
Inventor
毅 山下
龍司 相澤
成史 倉本
泰夫 松見
修之 勝田
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Nippon Shokubai Co Ltd
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Nippon Shokubai Co Ltd
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Priority to JP2004166360A priority Critical patent/JP4641155B2/ja
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Publication of JP2005347579A5 publication Critical patent/JP2005347579A5/ja
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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2004166360A 2004-06-03 2004-06-03 化学機械研磨用の研磨剤 Expired - Fee Related JP4641155B2 (ja)

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JP2004166360A JP4641155B2 (ja) 2004-06-03 2004-06-03 化学機械研磨用の研磨剤

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JP2004166360A JP4641155B2 (ja) 2004-06-03 2004-06-03 化学機械研磨用の研磨剤

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JP2005347579A JP2005347579A (ja) 2005-12-15
JP2005347579A5 JP2005347579A5 (enExample) 2007-06-28
JP4641155B2 true JP4641155B2 (ja) 2011-03-02

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103184011A (zh) * 2011-12-30 2013-07-03 第一毛织株式会社 Cmp浆料组合物和使用其的抛光方法

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006179845A (ja) * 2004-11-26 2006-07-06 Fuji Photo Film Co Ltd 金属用研磨液及び研磨方法
US20090302266A1 (en) * 2006-04-03 2009-12-10 Jsr Corporation Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, and kit for preparing aqueous dispersion for chemical mechanical polishing
JPWO2008117573A1 (ja) * 2007-03-27 2010-07-15 Jsr株式会社 化学機械研磨用水系分散体、該水系分散体を調製するためのキット、化学機械研磨方法、および半導体装置の製造方法
JP2010080864A (ja) * 2008-09-29 2010-04-08 Fujifilm Corp 研磨液
CN102232242B (zh) 2008-12-11 2014-07-09 日立化成株式会社 Cmp用研磨液以及使用该研磨液的研磨方法
JP5554121B2 (ja) * 2010-03-31 2014-07-23 富士フイルム株式会社 研磨液及び研磨方法
JP5648567B2 (ja) 2010-05-07 2015-01-07 日立化成株式会社 Ｃｍｐ用研磨液及びこれを用いた研磨方法
US8435896B2 (en) * 2011-03-03 2013-05-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Stable, concentratable chemical mechanical polishing composition and methods relating thereto
US8440097B2 (en) * 2011-03-03 2013-05-14 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Stable, concentratable, water soluble cellulose free chemical mechanical polishing composition
JPWO2013065491A1 (ja) * 2011-11-01 2015-04-02 旭硝子株式会社 ガラス基板の製造方法
JP6169938B2 (ja) * 2013-10-04 2017-07-26 花王株式会社 シリコンウェーハ用研磨液組成物
JP7619796B2 (ja) * 2020-12-18 2025-01-22 山口精研工業株式会社 フツリン酸ガラス用研磨剤組成物、及びフツリン酸ガラス用研磨剤組成物を用いた研磨方法
CN113604154B (zh) * 2021-07-09 2022-07-12 万华化学集团电子材料有限公司 一种钨插塞化学机械抛光液、制备方法及其应用

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003017448A (ja) * 2001-06-29 2003-01-17 Sumitomo Chem Co Ltd 金属研磨材、金属研磨組成物及び研磨方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103184011A (zh) * 2011-12-30 2013-07-03 第一毛织株式会社 Cmp浆料组合物和使用其的抛光方法
CN103184011B (zh) * 2011-12-30 2015-05-27 第一毛织株式会社 Cmp浆料组合物和使用其的抛光方法

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Publication number Publication date
JP2005347579A (ja) 2005-12-15

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