JP4631021B2 - 研磨装置 - Google Patents
研磨装置 Download PDFInfo
- Publication number
- JP4631021B2 JP4631021B2 JP2004070486A JP2004070486A JP4631021B2 JP 4631021 B2 JP4631021 B2 JP 4631021B2 JP 2004070486 A JP2004070486 A JP 2004070486A JP 2004070486 A JP2004070486 A JP 2004070486A JP 4631021 B2 JP4631021 B2 JP 4631021B2
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- temperature
- wafer
- unit
- radiation thermometer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 238000005498 polishing Methods 0.000 title claims description 112
- 230000005855 radiation Effects 0.000 claims description 28
- 238000003860 storage Methods 0.000 claims description 25
- 238000001514 detection method Methods 0.000 claims description 13
- 238000005259 measurement Methods 0.000 claims description 4
- 230000001681 protective effect Effects 0.000 description 14
- 238000002844 melting Methods 0.000 description 7
- 230000008018 melting Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 238000009529 body temperature measurement Methods 0.000 description 3
- 229910052580 B4C Inorganic materials 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- 239000006061 abrasive grain Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- AYJRCSIUFZENHW-DEQYMQKBSA-L barium(2+);oxomethanediolate Chemical compound [Ba+2].[O-][14C]([O-])=O AYJRCSIUFZENHW-DEQYMQKBSA-L 0.000 description 2
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 229910000420 cerium oxide Inorganic materials 0.000 description 2
- 229910000423 chromium oxide Inorganic materials 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 229910001887 tin oxide Inorganic materials 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Images
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Description
2:チャックテーブル
20:移動基台 21:ジャバラ
3:研磨手段
30:スピンドル 31:マウンタ 32:研磨ホイール 33:研磨砥石
4:送り手段
40:ガイドレール 41:ボールネジ 42:駆動源 43:昇降板
5:オペレーションパネル
6:送り手段制御部
7:放射温度計
70:検出端面
8:エアーノズル
90:計測温度記憶部 91:許容温度記憶部 92:温度比較部
Claims (1)
- ウェーハを保持するチャックテーブルと、該チャックテーブルに保持されたウェーハを乾式にて研磨する研磨砥石を備えた研磨手段と、該研磨手段を研磨送りする送り手段とを少なくとも備えた研磨装置であって、
該研磨砥石の研磨面の温度を計測する放射温度計と、該放射温度計の検出端面に向けてエアーを噴出するエアーノズルが配設され、
ウェーハの研磨時に該研磨砥石の研磨面の一部がウェーハに作用して研磨が行われ、ウェーハに対面しない該研磨面の一部は該放射温度計の直上に位置付けられており、
該放射温度計の該検出端面が該研磨砥石の研磨面に対面して該研磨砥石から放射される熱を該放射温度計において逐次計測し、
該放射温度計が出力する温度を記憶する計測温度記憶部と、該研磨面の許容温度を記憶する許容温度記憶部と、該計測温度記憶部に記憶された温度と該許容温度記憶部に記憶された許容温度とを比較する温度比較部と、該温度比較部における比較結果に基づいて該送り手段を制御する送り手段制御部とが含まれる研磨装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004070486A JP4631021B2 (ja) | 2004-03-12 | 2004-03-12 | 研磨装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004070486A JP4631021B2 (ja) | 2004-03-12 | 2004-03-12 | 研磨装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005260038A JP2005260038A (ja) | 2005-09-22 |
JP4631021B2 true JP4631021B2 (ja) | 2011-02-16 |
Family
ID=35085464
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004070486A Expired - Lifetime JP4631021B2 (ja) | 2004-03-12 | 2004-03-12 | 研磨装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4631021B2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6393489B2 (ja) * | 2014-02-21 | 2018-09-19 | 株式会社ディスコ | 研磨装置 |
JP6475518B2 (ja) * | 2015-03-03 | 2019-02-27 | 株式会社ディスコ | ウエーハの加工方法 |
JP6896472B2 (ja) * | 2017-03-23 | 2021-06-30 | 株式会社ディスコ | ウエーハの研磨方法及び研磨装置 |
KR102551940B1 (ko) * | 2018-05-03 | 2023-07-05 | 주식회사 케이씨텍 | 기판 처리 장치 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0469159A (ja) * | 1990-07-10 | 1992-03-04 | Nec Corp | 片面ポリッシング装置 |
JPH05177534A (ja) * | 1991-12-27 | 1993-07-20 | Kyushu Electron Metal Co Ltd | 半導体用シリコンウェーハの研磨方法 |
JPH0628665U (ja) * | 1992-09-09 | 1994-04-15 | 住友金属工業株式会社 | 温度測定装置 |
JPH0724708A (ja) * | 1993-07-15 | 1995-01-27 | Toshiba Corp | 研磨方法及び研磨装置 |
JPH1018215A (ja) * | 1996-06-28 | 1998-01-20 | Nikko Co Ltd | アスファルト混合物の混合調整用ミキサ |
JP2000205963A (ja) * | 1999-01-19 | 2000-07-28 | Toyota Motor Corp | 赤外線表面温度計の耐久性向上方法 |
JP2003071714A (ja) * | 2001-09-05 | 2003-03-12 | Disco Abrasive Syst Ltd | 研磨装置 |
JP2003302287A (ja) * | 2002-04-10 | 2003-10-24 | Nippon Steel Corp | 温度測定装置 |
-
2004
- 2004-03-12 JP JP2004070486A patent/JP4631021B2/ja not_active Expired - Lifetime
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0469159A (ja) * | 1990-07-10 | 1992-03-04 | Nec Corp | 片面ポリッシング装置 |
JPH05177534A (ja) * | 1991-12-27 | 1993-07-20 | Kyushu Electron Metal Co Ltd | 半導体用シリコンウェーハの研磨方法 |
JPH0628665U (ja) * | 1992-09-09 | 1994-04-15 | 住友金属工業株式会社 | 温度測定装置 |
JPH0724708A (ja) * | 1993-07-15 | 1995-01-27 | Toshiba Corp | 研磨方法及び研磨装置 |
JPH1018215A (ja) * | 1996-06-28 | 1998-01-20 | Nikko Co Ltd | アスファルト混合物の混合調整用ミキサ |
JP2000205963A (ja) * | 1999-01-19 | 2000-07-28 | Toyota Motor Corp | 赤外線表面温度計の耐久性向上方法 |
JP2003071714A (ja) * | 2001-09-05 | 2003-03-12 | Disco Abrasive Syst Ltd | 研磨装置 |
JP2003302287A (ja) * | 2002-04-10 | 2003-10-24 | Nippon Steel Corp | 温度測定装置 |
Also Published As
Publication number | Publication date |
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JP2005260038A (ja) | 2005-09-22 |
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