JP4623715B2 - 基板搬送機構及び該基板搬送機構を備える基板搬送装置 - Google Patents

基板搬送機構及び該基板搬送機構を備える基板搬送装置 Download PDF

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Publication number
JP4623715B2
JP4623715B2 JP2004316921A JP2004316921A JP4623715B2 JP 4623715 B2 JP4623715 B2 JP 4623715B2 JP 2004316921 A JP2004316921 A JP 2004316921A JP 2004316921 A JP2004316921 A JP 2004316921A JP 4623715 B2 JP4623715 B2 JP 4623715B2
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substrate
unit
temperature
chamber
mounting
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Japanese (ja)
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JP2005354025A (ja
JP2005354025A5 (https=
Inventor
剛 守屋
博之 中山
喜久夫 奥山
学 島田
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2004316921A priority Critical patent/JP4623715B2/ja
Priority to US11/128,256 priority patent/US7748138B2/en
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Publication of JP2005354025A5 publication Critical patent/JP2005354025A5/ja
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  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2004316921A 2004-05-13 2004-10-29 基板搬送機構及び該基板搬送機構を備える基板搬送装置 Expired - Fee Related JP4623715B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2004316921A JP4623715B2 (ja) 2004-05-13 2004-10-29 基板搬送機構及び該基板搬送機構を備える基板搬送装置
US11/128,256 US7748138B2 (en) 2004-05-13 2005-05-13 Particle removal method for a substrate transfer mechanism and apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004144013 2004-05-13
JP2004316921A JP4623715B2 (ja) 2004-05-13 2004-10-29 基板搬送機構及び該基板搬送機構を備える基板搬送装置

Publications (3)

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JP2005354025A JP2005354025A (ja) 2005-12-22
JP2005354025A5 JP2005354025A5 (https=) 2007-11-08
JP4623715B2 true JP4623715B2 (ja) 2011-02-02

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JP2004316921A Expired - Fee Related JP4623715B2 (ja) 2004-05-13 2004-10-29 基板搬送機構及び該基板搬送機構を備える基板搬送装置

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Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4754990B2 (ja) * 2006-02-23 2011-08-24 東京エレクトロン株式会社 基板処理システム、基板処理方法、及び記憶媒体
JP4745099B2 (ja) * 2006-03-28 2011-08-10 東京エレクトロン株式会社 基板処理装置、搬送ピックのクリーニング方法、制御プログラムおよびコンピュータ読取り可能な記憶媒体
JP4801522B2 (ja) * 2006-07-21 2011-10-26 株式会社日立ハイテクノロジーズ 半導体製造装置及びプラズマ処理方法
JP4896899B2 (ja) 2007-01-31 2012-03-14 東京エレクトロン株式会社 基板処理装置およびパーティクル付着防止方法
JP4959457B2 (ja) 2007-07-26 2012-06-20 東京エレクトロン株式会社 基板搬送モジュール及び基板処理システム
JP5521307B2 (ja) * 2008-10-24 2014-06-11 東京エレクトロン株式会社 パーティクル捕集装置及びパーティクル捕集方法
JP5395405B2 (ja) * 2008-10-27 2014-01-22 東京エレクトロン株式会社 基板洗浄方法及び装置
JP5123820B2 (ja) * 2008-10-27 2013-01-23 東京エレクトロン株式会社 基板処理装置の真空排気方法及び基板処理装置
US20110064545A1 (en) * 2009-09-16 2011-03-17 Applied Materials, Inc. Substrate transfer mechanism with preheating features
JP5549185B2 (ja) * 2009-11-06 2014-07-16 株式会社ニコン 半導体デバイスの製造方法および基板貼り合せ装置
JP2014139980A (ja) 2013-01-21 2014-07-31 Hitachi High-Technologies Corp 試料処理装置およびその方法並びに荷電粒子線装置
JP6592261B2 (ja) * 2015-03-20 2019-10-16 リンテック株式会社 搬送装置および搬送方法
JP6339057B2 (ja) * 2015-09-29 2018-06-06 株式会社日立国際電気 基板処理装置、半導体装置の製造方法、プログラム
WO2018030255A1 (ja) * 2016-08-09 2018-02-15 近藤工業株式会社 半導体製造装置
KR102534203B1 (ko) * 2017-02-24 2023-05-19 도쿄엘렉트론가부시키가이샤 기판 처리 시스템
KR102322826B1 (ko) * 2019-08-22 2021-11-05 세메스 주식회사 기판 이송 장치 및 이를 포함하는 기판 처리 시스템

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0241375A (ja) * 1988-07-29 1990-02-09 Tokyo Cosmos Electric Co Ltd 透明電極用遮蔽インキ
JPH0394445A (ja) * 1989-09-06 1991-04-19 Mitsubishi Electric Corp 半導体ウエハ搬送システム
JPH0733174B2 (ja) * 1991-06-20 1995-04-12 株式会社トーヨコグループ技術研究所 ウェハー搬送ロボット
JPH08330377A (ja) * 1995-05-29 1996-12-13 Hitachi Ltd 基板搬送装置及び半導体製造方法
JPH11102951A (ja) * 1997-09-25 1999-04-13 Tokyo Electron Ltd 処理装置
AU2002223125A1 (en) * 2000-11-15 2002-05-27 Nikon Corporation Method and device for transfer, method and device for exposure, and method of manufacturing device
JP2002359180A (ja) * 2001-06-01 2002-12-13 Toshiba Corp ガス循環システム
JP2003017478A (ja) * 2001-07-05 2003-01-17 Tokyo Electron Ltd 真空処理装置および真空処理方法
JP2003224079A (ja) * 2002-01-31 2003-08-08 Shin Etsu Handotai Co Ltd 熱処理方法、熱処理装置およびシリコンエピタキシャルウェーハの製造方法
JP2005093968A (ja) * 2003-09-19 2005-04-07 Kazumasa Onishi 真空チャック

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JP2005354025A (ja) 2005-12-22

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