JP4623224B2 - 樹脂フィルムシート及び電子部品 - Google Patents

樹脂フィルムシート及び電子部品 Download PDF

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Publication number
JP4623224B2
JP4623224B2 JP2009148551A JP2009148551A JP4623224B2 JP 4623224 B2 JP4623224 B2 JP 4623224B2 JP 2009148551 A JP2009148551 A JP 2009148551A JP 2009148551 A JP2009148551 A JP 2009148551A JP 4623224 B2 JP4623224 B2 JP 4623224B2
Authority
JP
Japan
Prior art keywords
resin film
layer
particles
resin
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2009148551A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010034037A (ja
JP2010034037A5 (ru
Inventor
務 河野
宏治 小林
和良 小島
眞行 美野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2009148551A priority Critical patent/JP4623224B2/ja
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to TW098121389A priority patent/TW201013710A/zh
Priority to CN201110251065.XA priority patent/CN102298988B/zh
Priority to CN2011102510630A priority patent/CN102298987A/zh
Priority to KR1020090057037A priority patent/KR101038614B1/ko
Priority to TW100142306A priority patent/TWI396626B/zh
Priority to CN2011102511046A priority patent/CN102298989A/zh
Priority to CN2009101503914A priority patent/CN101615446B/zh
Priority to TW099127941A priority patent/TWI415144B/zh
Publication of JP2010034037A publication Critical patent/JP2010034037A/ja
Publication of JP2010034037A5 publication Critical patent/JP2010034037A5/ja
Priority to KR1020100085249A priority patent/KR101120277B1/ko
Application granted granted Critical
Publication of JP4623224B2 publication Critical patent/JP4623224B2/ja
Priority to KR1020110067984A priority patent/KR101120253B1/ko
Priority to KR1020110067981A priority patent/KR20110084491A/ko
Priority to KR1020110067977A priority patent/KR20110084490A/ko
Priority to KR1020110067975A priority patent/KR20110084489A/ko
Priority to KR1020110067974A priority patent/KR20110084488A/ko
Priority to KR1020110119297A priority patent/KR101200148B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29199—Material of the matrix
    • H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Insulated Conductors (AREA)
  • Laminated Bodies (AREA)
  • Conductive Materials (AREA)
  • Adhesive Tapes (AREA)
  • Wire Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
JP2009148551A 2008-06-26 2009-06-23 樹脂フィルムシート及び電子部品 Expired - Fee Related JP4623224B2 (ja)

Priority Applications (16)

Application Number Priority Date Filing Date Title
JP2009148551A JP4623224B2 (ja) 2008-06-26 2009-06-23 樹脂フィルムシート及び電子部品
CN201110251065.XA CN102298988B (zh) 2008-06-26 2009-06-25 内含导电性粒子的树脂膜片及由其电连接的电子部件
CN2011102510630A CN102298987A (zh) 2008-06-26 2009-06-25 树脂膜片的用途
KR1020090057037A KR101038614B1 (ko) 2008-06-26 2009-06-25 도전성 입자를 내재시킨 수지 필름 시트 및 도전성 입자를 내재시킨 수지 필름 시트로 전기적으로 접속된 전자 부품
TW100142306A TWI396626B (zh) 2008-06-26 2009-06-25 Resin diaphragm, electronic parts and circuit connection material
CN2011102511046A CN102298989A (zh) 2008-06-26 2009-06-25 内含导电性粒子的树脂膜片及由其电连接的电子部件
CN2009101503914A CN101615446B (zh) 2008-06-26 2009-06-25 内含导电性粒子的树脂膜片及由其电连接的电子部件
TW099127941A TWI415144B (zh) 2008-06-26 2009-06-25 A resin film containing conductive particles and an electronic component electrically connected with a resin film containing conductive particles
TW098121389A TW201013710A (en) 2008-06-26 2009-06-25 Resin film sheet having conductive particles and electronic component electrically connected by the same
KR1020100085249A KR101120277B1 (ko) 2008-06-26 2010-09-01 도전성 입자를 내재시킨 수지 필름 시트 및 도전성 입자를 내재시킨 수지 필름 시트로 전기적으로 접속된 전자 부품
KR1020110067984A KR101120253B1 (ko) 2008-06-26 2011-07-08 도전성 입자를 내재시킨 수지 필름 시트로 전기적으로 접속된 전자 부품
KR1020110067981A KR20110084491A (ko) 2008-06-26 2011-07-08 도전성 입자를 내재시킨 수지 필름 시트 및 도전성 입자를 내재시킨 수지 필름 시트로 전기적으로 접속된 전자 부품
KR1020110067977A KR20110084490A (ko) 2008-06-26 2011-07-08 도전성 입자를 내재시킨 수지 필름 시트 및 도전성 입자를 내재시킨 수지 필름 시트로 전기적으로 접속된 전자 부품
KR1020110067975A KR20110084489A (ko) 2008-06-26 2011-07-08 도전성 입자를 내재시킨 수지 필름 시트 및 도전성 입자를 내재시킨 수지 필름 시트로 전기적으로 접속된 전자 부품
KR1020110067974A KR20110084488A (ko) 2008-06-26 2011-07-08 도전성 입자를 내재시킨 수지 필름 시트 및 도전성 입자를 내재시킨 수지 필름 시트로 전기적으로 접속된 전자 부품
KR1020110119297A KR101200148B1 (ko) 2008-06-26 2011-11-16 도전성 입자를 내재시킨 수지 필름 시트 및 도전성 입자를 내재시킨 수지 필름 시트로 전기적으로 접속된 전자 부품

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008167454 2008-06-26
JP2009148551A JP4623224B2 (ja) 2008-06-26 2009-06-23 樹脂フィルムシート及び電子部品

Related Child Applications (4)

Application Number Title Priority Date Filing Date
JP2010157782A Division JP4661985B2 (ja) 2008-06-26 2010-07-12 樹脂フィルムシート及び電子部品
JP2010158022A Division JP4661986B2 (ja) 2008-06-26 2010-07-12 樹脂フィルムシート及び電子部品
JP2010158078A Division JP4766185B2 (ja) 2008-06-26 2010-07-12 樹脂フィルムシート及び電子部品
JP2010157800A Division JP4970574B2 (ja) 2008-06-26 2010-07-12 樹脂フィルムシート及び電子部品

Publications (3)

Publication Number Publication Date
JP2010034037A JP2010034037A (ja) 2010-02-12
JP2010034037A5 JP2010034037A5 (ru) 2010-04-30
JP4623224B2 true JP4623224B2 (ja) 2011-02-02

Family

ID=41495036

Family Applications (9)

Application Number Title Priority Date Filing Date
JP2009148551A Expired - Fee Related JP4623224B2 (ja) 2008-06-26 2009-06-23 樹脂フィルムシート及び電子部品
JP2010158022A Expired - Fee Related JP4661986B2 (ja) 2008-06-26 2010-07-12 樹脂フィルムシート及び電子部品
JP2010157800A Expired - Fee Related JP4970574B2 (ja) 2008-06-26 2010-07-12 樹脂フィルムシート及び電子部品
JP2010158078A Expired - Fee Related JP4766185B2 (ja) 2008-06-26 2010-07-12 樹脂フィルムシート及び電子部品
JP2010157782A Expired - Fee Related JP4661985B2 (ja) 2008-06-26 2010-07-12 樹脂フィルムシート及び電子部品
JP2011127062A Withdrawn JP2011198767A (ja) 2008-06-26 2011-06-07 樹脂フィルムシート及び電子部品
JP2011127070A Pending JP2011233530A (ja) 2008-06-26 2011-06-07 樹脂フィルムシート及び電子部品
JP2011127061A Withdrawn JP2011233529A (ja) 2008-06-26 2011-06-07 樹脂フィルムシート及び電子部品
JP2011127055A Withdrawn JP2011233528A (ja) 2008-06-26 2011-06-07 樹脂フィルムシート及び電子部品

Family Applications After (8)

Application Number Title Priority Date Filing Date
JP2010158022A Expired - Fee Related JP4661986B2 (ja) 2008-06-26 2010-07-12 樹脂フィルムシート及び電子部品
JP2010157800A Expired - Fee Related JP4970574B2 (ja) 2008-06-26 2010-07-12 樹脂フィルムシート及び電子部品
JP2010158078A Expired - Fee Related JP4766185B2 (ja) 2008-06-26 2010-07-12 樹脂フィルムシート及び電子部品
JP2010157782A Expired - Fee Related JP4661985B2 (ja) 2008-06-26 2010-07-12 樹脂フィルムシート及び電子部品
JP2011127062A Withdrawn JP2011198767A (ja) 2008-06-26 2011-06-07 樹脂フィルムシート及び電子部品
JP2011127070A Pending JP2011233530A (ja) 2008-06-26 2011-06-07 樹脂フィルムシート及び電子部品
JP2011127061A Withdrawn JP2011233529A (ja) 2008-06-26 2011-06-07 樹脂フィルムシート及び電子部品
JP2011127055A Withdrawn JP2011233528A (ja) 2008-06-26 2011-06-07 樹脂フィルムシート及び電子部品

Country Status (4)

Country Link
JP (9) JP4623224B2 (ru)
KR (8) KR101038614B1 (ru)
CN (4) CN101615446B (ru)
TW (3) TWI396626B (ru)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4623224B2 (ja) * 2008-06-26 2011-02-02 日立化成工業株式会社 樹脂フィルムシート及び電子部品
WO2013132831A1 (ja) * 2012-03-06 2013-09-12 東洋インキＳｃホールディングス株式会社 導電性微粒子およびその製造方法、導電性樹脂組成物、導電性シート、並びに電磁波シールドシート
JP6221285B2 (ja) * 2013-03-21 2017-11-01 日立化成株式会社 回路部材の接続方法
JP6069153B2 (ja) * 2013-09-27 2017-02-01 デクセリアルズ株式会社 アンダーフィル材、及びこれを用いた半導体装置の製造方法
JP6645730B2 (ja) * 2014-01-28 2020-02-14 デクセリアルズ株式会社 接続体及び接続体の製造方法
JP6307308B2 (ja) * 2014-03-06 2018-04-04 デクセリアルズ株式会社 接続構造体の製造方法、及び回路接続材料
WO2015151874A1 (ja) * 2014-03-31 2015-10-08 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法
KR101737173B1 (ko) 2014-07-24 2017-05-17 삼성에스디아이 주식회사 이방 도전성 필름, 이의 제조 방법, 및 이를 포함하는 반도체 장치
CN107001865B (zh) * 2014-11-12 2020-08-21 迪睿合株式会社 光固化类各向异性导电粘接剂、连接体的制造方法及电子部件的连接方法
JP6661886B2 (ja) * 2015-03-11 2020-03-11 日立化成株式会社 フィルム状回路接続材料及び回路部材の接続構造体の製造方法
KR101684144B1 (ko) 2015-07-08 2016-12-07 울산대학교 산학협력단 무단변속기를 이용한 고효율 파력발전기 및 그 제어방법
JP6327630B1 (ja) * 2017-04-28 2018-05-23 リンテック株式会社 フィルム状焼成材料、支持シート付フィルム状焼成材料、フィルム状焼成材料の製造方法、及び支持シート付フィルム状焼成材料の製造方法
WO2019050006A1 (ja) * 2017-09-11 2019-03-14 日立化成株式会社 回路接続用接着剤フィルム及びその製造方法、回路接続構造体の製造方法、並びに、接着剤フィルム収容セット
JP7210846B2 (ja) * 2017-09-11 2023-01-24 株式会社レゾナック 回路接続用接着剤フィルム及びその製造方法、回路接続構造体の製造方法、並びに、接着剤フィルム収容セット
JP2020024937A (ja) * 2019-10-28 2020-02-13 日立化成株式会社 フィルム状回路接続材料及び回路部材の接続構造体の製造方法
KR20210154293A (ko) 2020-06-11 2021-12-21 현대자동차주식회사 리튬이온 이차전지 및 그 제조방법
KR20220019470A (ko) 2020-08-10 2022-02-17 현대자동차주식회사 리튬이온 이차전지 제조 시스템 및 그 제조 방법

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