JP4601482B2 - 描画装置および描画方法 - Google Patents

描画装置および描画方法 Download PDF

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Publication number
JP4601482B2
JP4601482B2 JP2005126614A JP2005126614A JP4601482B2 JP 4601482 B2 JP4601482 B2 JP 4601482B2 JP 2005126614 A JP2005126614 A JP 2005126614A JP 2005126614 A JP2005126614 A JP 2005126614A JP 4601482 B2 JP4601482 B2 JP 4601482B2
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Japan
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interval
data
master clock
engine
value
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Expired - Lifetime
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JP2005126614A
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English (en)
Japanese (ja)
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JP2006066877A5 (enExample
JP2006066877A (ja
Inventor
和成 関川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2005126614A priority Critical patent/JP4601482B2/ja
Priority to TW094125234A priority patent/TWI368184B/zh
Priority to US11/191,021 priority patent/US7266802B2/en
Priority to KR1020050068956A priority patent/KR101135601B1/ko
Publication of JP2006066877A publication Critical patent/JP2006066877A/ja
Publication of JP2006066877A5 publication Critical patent/JP2006066877A5/ja
Application granted granted Critical
Publication of JP4601482B2 publication Critical patent/JP4601482B2/ja
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Expired - Lifetime legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0006—Industrial image inspection using a design-rule based approach
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70283—Mask effects on the imaging process
    • G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Ink Jet (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2005126614A 2004-07-29 2005-04-25 描画装置および描画方法 Expired - Lifetime JP4601482B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2005126614A JP4601482B2 (ja) 2004-07-29 2005-04-25 描画装置および描画方法
TW094125234A TWI368184B (en) 2004-07-29 2005-07-26 Drawing apparatus and drawing method
US11/191,021 US7266802B2 (en) 2004-07-29 2005-07-28 Drawing apparatus and drawing method
KR1020050068956A KR101135601B1 (ko) 2004-07-29 2005-07-28 묘화 장치 및 묘화 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004221778 2004-07-29
JP2005126614A JP4601482B2 (ja) 2004-07-29 2005-04-25 描画装置および描画方法

Publications (3)

Publication Number Publication Date
JP2006066877A JP2006066877A (ja) 2006-03-09
JP2006066877A5 JP2006066877A5 (enExample) 2008-04-03
JP4601482B2 true JP4601482B2 (ja) 2010-12-22

Family

ID=35731611

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005126614A Expired - Lifetime JP4601482B2 (ja) 2004-07-29 2005-04-25 描画装置および描画方法

Country Status (4)

Country Link
US (1) US7266802B2 (enExample)
JP (1) JP4601482B2 (enExample)
KR (1) KR101135601B1 (enExample)
TW (1) TWI368184B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5001638B2 (ja) * 2006-12-22 2012-08-15 株式会社オーク製作所 露光データ作成装置
JP5020745B2 (ja) * 2007-08-29 2012-09-05 株式会社ニューフレアテクノロジー 描画データの作成方法及び荷電粒子ビーム描画装置
JP5215018B2 (ja) * 2008-03-28 2013-06-19 大日本スクリーン製造株式会社 画像記録装置
KR101095549B1 (ko) 2010-04-29 2011-12-19 삼성전자주식회사 마스크리스 노광 장치와 이를 이용한 스티칭 노광 방법
CN103699708A (zh) * 2013-05-14 2014-04-02 上海大众汽车有限公司 全参数化拉延模具设计方法
GB2517702A (en) * 2013-08-28 2015-03-04 Ibm Collaborative electronic nose management in personal devices
US12452416B2 (en) 2016-01-22 2025-10-21 Spike Vision (Beijing) Technology Co., Ltd. Generating image based on pulse sequences obtained from encoded information
CN109803096B (zh) * 2019-01-11 2020-08-25 北京大学 一种基于脉冲信号的显示方法和系统
US11228758B2 (en) * 2016-01-22 2022-01-18 Peking University Imaging method and device

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2075026A1 (en) * 1991-08-08 1993-02-09 William E. Nelson Method and apparatus for patterning an imaging member
US6074790A (en) * 1994-11-17 2000-06-13 Texas Instruments Incorporated Black and white defect correction for a digital micromirror printer
JPH10112579A (ja) 1996-10-07 1998-04-28 M S Tec:Kk レジスト露光方法及びその露光装置
SE516914C2 (sv) * 1999-09-09 2002-03-19 Micronic Laser Systems Ab Metoder och rastrerare för högpresterande mönstergenerering
JP2001255664A (ja) * 2000-03-14 2001-09-21 Fuji Photo Film Co Ltd 画像露光方法
DE10031915A1 (de) * 2000-06-30 2002-01-10 Heidelberger Druckmasch Ag Kompakte Mehrstrahllaserlichtquelle und Interleafrasterscanlinien-Verfahren zur Belichtung von Druckplatten
US6998219B2 (en) * 2001-06-27 2006-02-14 University Of South Florida Maskless photolithography for etching and deposition
JP4320694B2 (ja) * 2001-08-08 2009-08-26 株式会社オーク製作所 多重露光描画装置および多重露光式描画方法
JP4273291B2 (ja) * 2001-08-17 2009-06-03 株式会社オーク製作所 多重露光描画装置および多重露光描画方法
US20030186164A1 (en) * 2002-03-27 2003-10-02 Hitachi, Ltd. Information recording medium, a method for recording information and a method for manufacturing a medium
JP4274784B2 (ja) * 2002-05-28 2009-06-10 新光電気工業株式会社 配線形成システムおよびその方法
JP2004012899A (ja) * 2002-06-07 2004-01-15 Fuji Photo Film Co Ltd 露光装置
CN101487982A (zh) * 2002-08-24 2009-07-22 无掩模平版印刷公司 连续地直接写的光刻技术
JP4150250B2 (ja) * 2002-12-02 2008-09-17 富士フイルム株式会社 描画ヘッド、描画装置及び描画方法
US7061591B2 (en) * 2003-05-30 2006-06-13 Asml Holding N.V. Maskless lithography systems and methods utilizing spatial light modulator arrays

Also Published As

Publication number Publication date
KR101135601B1 (ko) 2012-04-17
KR20060048868A (ko) 2006-05-18
TWI368184B (en) 2012-07-11
JP2006066877A (ja) 2006-03-09
US20060022982A1 (en) 2006-02-02
TW200622935A (en) 2006-07-01
US7266802B2 (en) 2007-09-04

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