JP4598047B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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- JP4598047B2 JP4598047B2 JP2007305510A JP2007305510A JP4598047B2 JP 4598047 B2 JP4598047 B2 JP 4598047B2 JP 2007305510 A JP2007305510 A JP 2007305510A JP 2007305510 A JP2007305510 A JP 2007305510A JP 4598047 B2 JP4598047 B2 JP 4598047B2
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- oxide film
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- 239000004065 semiconductor Substances 0.000 title claims description 46
- 238000004519 manufacturing process Methods 0.000 title claims description 23
- 238000005530 etching Methods 0.000 claims description 27
- 239000000758 substrate Substances 0.000 claims description 26
- 238000002955 isolation Methods 0.000 claims description 23
- 238000005498 polishing Methods 0.000 claims description 8
- 238000010030 laminating Methods 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 238000000034 method Methods 0.000 description 43
- 238000000206 photolithography Methods 0.000 description 24
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 18
- 229910052710 silicon Inorganic materials 0.000 description 18
- 239000010703 silicon Substances 0.000 description 18
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 8
- 238000004140 cleaning Methods 0.000 description 8
- 229910052581 Si3N4 Inorganic materials 0.000 description 7
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 7
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- 229920005591 polysilicon Polymers 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/823481—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type isolation region manufacturing related aspects, e.g. to avoid interaction of isolation region with adjacent structure
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/975—Substrate or mask aligning feature
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Element Separation (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Description
<第1の実施例>
図2は、本発明の第1の実施例を示し、本発明による半導体装置の製造方法の工程を示している。ここで、該半導体装置には、MOSトランジスタ等形成のためのアクティブ領域を分離するため素子分離用トレンチと、アライメントマーク用トレンチとが形成される。アライメントマーク用トレンチは、半導体素子の配列を規定するグリッドラインに沿って形成される。
<第2の実施例>
第2の実施例は、ACWホトリソ/エッチング工程において、アライメントマーク用トレンチ内に堆積されている酸化膜を全て除去した後に、アライメントマーク用トレンチ内を含むウェハ全面に酸化膜(犠牲酸化膜)を形成することにより異物を除去する形態である。この点、第1の実施例においては、CMP工程において生じる異物がアライメントマーク部の溝内から除去され難くなる可能性があった。
101 シリコン基板
102 パッド酸化膜
103 シリコン窒化膜
105 酸化膜
106 デバイストレンチ部
107、108 犠牲酸化膜
110 素子分離用トレンチ
120 アライメントマーク用トレンチ
130 アクティブ領域
140 半導体素子
Claims (1)
- 半導体基板上に設けられる活性領域に複数の半導体素子を形成して半導体装置を製造する製造方法であって、
前記半導体基板上に、複数の素子分離用トレンチと複数のアライメントマーク用トレンチとを形成し、前記トレンチの双方が形成された半導体基板上に酸化膜を積層する第1工程と、
前記素子分離用トレンチをマスクするレジストマスクを用いたエッチングを行って、前記活性領域に積層された酸化膜と前記アライメントマーク用トレンチ内部に積層された略全ての酸化膜を除去する第2工程と、
前記アライメントマーク用トレンチ内部を犠牲酸化膜によって被覆する第3工程と、
前記酸化膜が除去された半導体基板の面を研磨することによって前記素子分離用トレンチに積層されて残った酸化膜を平坦化して前記活性領域を前記半導体素子毎に分離する第4工程と、
前記犠牲酸化膜をリフトオフする第5工程と、
前記アライメントマーク用トレンチを用いて前記半導体素子を形成するためレジストマスクの位置決めを行う第6工程と、
を含み、前記犠牲酸化膜によって被覆する第3工程は、前記アライメントマーク用トレンチ内部と共に、前記素子分離用トレンチに積層された酸化膜を前記犠牲酸化膜によって被覆する工程であることを特徴とする製造方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007305510A JP4598047B2 (ja) | 2007-11-27 | 2007-11-27 | 半導体装置の製造方法 |
CNA2008101732745A CN101447452A (zh) | 2007-11-27 | 2008-10-31 | 半导体器件的制造方法 |
US12/292,511 US7629223B2 (en) | 2007-11-27 | 2008-11-20 | Method for manufacturing semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007305510A JP4598047B2 (ja) | 2007-11-27 | 2007-11-27 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009130242A JP2009130242A (ja) | 2009-06-11 |
JP4598047B2 true JP4598047B2 (ja) | 2010-12-15 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007305510A Expired - Fee Related JP4598047B2 (ja) | 2007-11-27 | 2007-11-27 | 半導体装置の製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7629223B2 (ja) |
JP (1) | JP4598047B2 (ja) |
CN (1) | CN101447452A (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9171726B2 (en) * | 2009-11-06 | 2015-10-27 | Infineon Technologies Ag | Low noise semiconductor devices |
US20110244683A1 (en) * | 2010-04-01 | 2011-10-06 | Michiaki Sano | Fabricating Voids Using Slurry Protect Coat Before Chemical-Mechanical Polishing |
KR101725978B1 (ko) * | 2010-10-05 | 2017-04-12 | 에스케이하이닉스 주식회사 | 반도체 소자의 형성 방법 |
JP5950514B2 (ja) * | 2011-08-12 | 2016-07-13 | キヤノン株式会社 | 光電変換装置の製造方法 |
CN103035511B (zh) * | 2011-10-09 | 2015-08-19 | 上海华虹宏力半导体制造有限公司 | 制作无阻挡层的高压器件的零层光刻标记的方法 |
US9263272B2 (en) * | 2012-04-24 | 2016-02-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Gate electrodes with notches and methods for forming the same |
US9385069B2 (en) * | 2013-03-07 | 2016-07-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Gate contact structure for FinFET |
JP6541659B2 (ja) | 2013-08-23 | 2019-07-10 | フォセ テクノロジー インテルナシオナル ベー ヴェ | シングル・モード・ファイバ・ブラッグ・グレーティング圧力センサ |
US10007114B2 (en) | 2015-05-01 | 2018-06-26 | Seiko Epson Corporation | Electro-optical device, electronic apparatus, and manufacturing method of electro-optical device |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07283302A (ja) * | 1994-04-05 | 1995-10-27 | Kawasaki Steel Corp | 半導体集積回路装置の製造方法 |
JP2001052993A (ja) * | 1999-08-16 | 2001-02-23 | Sony Corp | 半導体装置及び半導体装置の製造方法 |
JP2004235245A (ja) * | 2003-01-28 | 2004-08-19 | Denso Corp | 半導体装置の製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001102440A (ja) | 1999-09-29 | 2001-04-13 | Nec Corp | 半導体集積回路装置の製造方法 |
JP2002050682A (ja) | 2000-08-07 | 2002-02-15 | Sony Corp | 半導体装置の製造方法およびレチクルマスク |
US6573151B1 (en) * | 2000-08-22 | 2003-06-03 | Advanced Micro Devices, Inc. | Method of forming zero marks |
JP2002134701A (ja) | 2000-10-25 | 2002-05-10 | Nec Corp | 半導体装置の製造方法 |
JP4825402B2 (ja) * | 2004-01-14 | 2011-11-30 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
US7338909B2 (en) * | 2004-06-18 | 2008-03-04 | Taiwan Semiconductor Manufacturing Co. Ltd. | Micro-etching method to replicate alignment marks for semiconductor wafer photolithography |
-
2007
- 2007-11-27 JP JP2007305510A patent/JP4598047B2/ja not_active Expired - Fee Related
-
2008
- 2008-10-31 CN CNA2008101732745A patent/CN101447452A/zh active Pending
- 2008-11-20 US US12/292,511 patent/US7629223B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07283302A (ja) * | 1994-04-05 | 1995-10-27 | Kawasaki Steel Corp | 半導体集積回路装置の製造方法 |
JP2001052993A (ja) * | 1999-08-16 | 2001-02-23 | Sony Corp | 半導体装置及び半導体装置の製造方法 |
JP2004235245A (ja) * | 2003-01-28 | 2004-08-19 | Denso Corp | 半導体装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20090137092A1 (en) | 2009-05-28 |
US7629223B2 (en) | 2009-12-08 |
CN101447452A (zh) | 2009-06-03 |
JP2009130242A (ja) | 2009-06-11 |
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