JP4595018B2 - 半導体装置の製造方法およびボンディング装置 - Google Patents

半導体装置の製造方法およびボンディング装置 Download PDF

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Publication number
JP4595018B2
JP4595018B2 JP2009039448A JP2009039448A JP4595018B2 JP 4595018 B2 JP4595018 B2 JP 4595018B2 JP 2009039448 A JP2009039448 A JP 2009039448A JP 2009039448 A JP2009039448 A JP 2009039448A JP 4595018 B2 JP4595018 B2 JP 4595018B2
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JP
Japan
Prior art keywords
capillary
bonding
initial ball
pressure contact
pad surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2009039448A
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English (en)
Japanese (ja)
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JP2010199142A5 (https=
JP2010199142A (ja
Inventor
裕介 丸矢
伸幸 青柳
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Shinkawa Ltd
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Shinkawa Ltd
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Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP2009039448A priority Critical patent/JP4595018B2/ja
Priority to SG2011060969A priority patent/SG173828A1/en
Priority to CN201080008761.1A priority patent/CN102326241B/zh
Priority to PCT/JP2010/050910 priority patent/WO2010095490A1/ja
Publication of JP2010199142A publication Critical patent/JP2010199142A/ja
Publication of JP2010199142A5 publication Critical patent/JP2010199142A5/ja
Application granted granted Critical
Publication of JP4595018B2 publication Critical patent/JP4595018B2/ja
Priority to US13/214,682 priority patent/US8292160B2/en
Active legal-status Critical Current
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07183—Means for monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
JP2009039448A 2009-02-23 2009-02-23 半導体装置の製造方法およびボンディング装置 Active JP4595018B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2009039448A JP4595018B2 (ja) 2009-02-23 2009-02-23 半導体装置の製造方法およびボンディング装置
SG2011060969A SG173828A1 (en) 2009-02-23 2010-01-25 Method for manufacturing semiconductor device, and bonding apparatus
CN201080008761.1A CN102326241B (zh) 2009-02-23 2010-01-25 半导体装置的制造方法以及焊接装置
PCT/JP2010/050910 WO2010095490A1 (ja) 2009-02-23 2010-01-25 半導体装置の製造方法およびボンディング装置
US13/214,682 US8292160B2 (en) 2009-02-23 2011-08-22 Method of manufacturing semiconductor device, and bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009039448A JP4595018B2 (ja) 2009-02-23 2009-02-23 半導体装置の製造方法およびボンディング装置

Publications (3)

Publication Number Publication Date
JP2010199142A JP2010199142A (ja) 2010-09-09
JP2010199142A5 JP2010199142A5 (https=) 2010-10-21
JP4595018B2 true JP4595018B2 (ja) 2010-12-08

Family

ID=42633776

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009039448A Active JP4595018B2 (ja) 2009-02-23 2009-02-23 半導体装置の製造方法およびボンディング装置

Country Status (5)

Country Link
US (1) US8292160B2 (https=)
JP (1) JP4595018B2 (https=)
CN (1) CN102326241B (https=)
SG (1) SG173828A1 (https=)
WO (1) WO2010095490A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11404393B2 (en) 2018-08-23 2022-08-02 Kaijo Corporation Wire bonding method and wire bonding device

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DE102011080534A1 (de) * 2011-08-05 2013-02-07 Hesse & Knipps Gmbh Verfahren zum Ultraschallbonden
TWI541920B (zh) * 2013-07-23 2016-07-11 矽品精密工業股份有限公司 打線結構之製法
MY171264A (en) 2014-03-28 2019-10-07 Nxp Usa Inc Wire bonding method employing two scrub settings
USD771168S1 (en) 2014-10-31 2016-11-08 Coorstek, Inc. Wire bonding ceramic capillary
USD797172S1 (en) 2015-02-03 2017-09-12 Coorstek, Inc. Ceramic bonding tool with textured tip
USD797826S1 (en) 2015-02-03 2017-09-19 Coorstek, Inc. Ceramic bonding tool with textured tip
USD797171S1 (en) 2015-02-03 2017-09-12 Coorstek, Inc. Ceramic bonding tool with textured tip
USD753739S1 (en) 2015-04-17 2016-04-12 Coorstek, Inc. Wire bonding wedge tool
USD868123S1 (en) 2016-12-20 2019-11-26 Coorstek, Inc. Wire bonding wedge tool
JP6688725B2 (ja) 2016-12-26 2020-04-28 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
CN112437974B (zh) * 2018-06-06 2025-02-14 德州仪器公司 半导体裸片的球接合附接
US11205937B2 (en) 2018-07-18 2021-12-21 Asm Technology Singapore Pte Ltd Driving system having reduced vibration transmission
US11901329B2 (en) * 2019-06-17 2024-02-13 Kaijo Corporation Wire bonding method and wire bonding apparatus
CN117020481B (zh) * 2023-07-14 2026-01-20 凌波微步半导体设备(常熟)有限公司 一种用于焊接研磨工艺的焊接方法、装置及终端设备

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JPH0377338A (ja) * 1989-08-21 1991-04-02 Fujitsu Ltd ワイヤボンディング装置
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Publication number Priority date Publication date Assignee Title
US11404393B2 (en) 2018-08-23 2022-08-02 Kaijo Corporation Wire bonding method and wire bonding device

Also Published As

Publication number Publication date
CN102326241A (zh) 2012-01-18
US8292160B2 (en) 2012-10-23
US20110315743A1 (en) 2011-12-29
SG173828A1 (en) 2011-09-29
CN102326241B (zh) 2014-04-02
WO2010095490A1 (ja) 2010-08-26
JP2010199142A (ja) 2010-09-09

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